This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits....

Many solder users have preconceived notions and worries involving reflow profiling guidelines. Year after year of reading profiling recommendations in industry publications, from a litany of pundits, has made it clear that perfect profiles exist and...

This paper will explore how test can be an integral part of manufacturing to assure High Reliability Products. We will discuss how test parameters and test techniques are effective in finding time zero vs. time dependent defects. Understanding of ma...

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package ...

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment....

There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning....

There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning. However, there is no single process change that is a sure cure for tombstoning! Th...

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062� immersion Ag plated printed circuit boards (PCB) using Pbfree solder paste....

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062� immersion Ag plated printed circuit boards (PCB) using Pbfree solder paste....

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062� immersion Ag plated printed circuit boards (PCB) using Pbfree solder paste. Four different leadless CSP designs were studied and each was ev...