Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment....

Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Flux Reattachment....

The purpose of the testing was to compare the resistance and check for open circuit conditions of reworked BGA test samples made with and without StencilQuik� after 500 thermal shock cycles....

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. ...

This paper explains the solder paste reflow process and the best practices to follow when developing your profile....

This white paper is suitable for both new and experienced users. It is a practical education in the use and misuse of auger valves for solder paste dispensing. Covers the best and worst practices associated with the process variables involved in sold...

Air-powered dispensing systems use controlled pulses of air pressure to dispense solder paste from syringe reservoirs in uniform amounts. In this paper, EFD explains the most critical variables affecting air-powered dispensing of solder pastes a...

This article updates one I wrote for Printed Circuit Fabrication Magazine in December 1991. Actually, this article trashes that - and about time. I was much too kind then talking about how to control the HASL process....

PULLMAN,Wash.-Researchers at Washington State University have created design guidelines for new molecules that could enhance the speed of internet communications and other optical technologies....

As with all other F/A processes, PCB�s occasionally need a little help from them. The following, just as the component process in Section previous, has been condensed from so many involvements over the past 35 years, I cannot remember - nor should I ...