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Technical Library articles |
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Are You Becoming E-Wasted?
Published: |
Mar 13, 2007 |
Author: |
Jim Usery |
Abstract: |
This article gives an explanation of what e-waste is and states the regulations on how it can be disposed of. It also tells what some companies are doing to help the consumer get rid of it.... |
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Prototyping Your New Electronic Product Idea
Published: |
Mar 13, 2007 |
Author: |
Jim Usery |
Abstract: |
This article outlines the minimum tasks needed to send your new electronic product idea out for prototyping. It lists and defines the minimums to either perform your self or to have subcontracted.... |
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I Have an Idea for a New Product, but Now What?
Published: |
Mar 13, 2007 |
Author: |
Jim Usery |
Abstract: |
Do you have an idea for an electronic product, the next must-have gadget or the greatest problem-solving device that was ever invented? This article will provide you with some guidelines to assist you in getting your idea turned into a successful de... |
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Basics of Manufacturing Printed Circuit Boards
Published: |
Mar 13, 2007 |
Author: |
Jim Usery |
Abstract: |
This article tells about the basics of manufacturing printed circuit boards including the terminology and the steps to processing a PCB.... |
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What Your Electronic Manufacturing Service Provider Needs from You
Published: |
Mar 13, 2007 |
Author: |
Jim Usery |
Abstract: |
This article tells what your electronic manufacturing service providers needs from you to prepare an accurate quotation for a typical printed circuit board assembly project.... |
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What Are Gerber Files for Printed Circuit Boards, and Who Needs Them?
Published: |
Mar 13, 2007 |
Author: |
Jim Usery |
Abstract: |
This article tells what a gerber file is and what it is used for in the electronic manufacturing industry.... |
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Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
Published: |
Mar 08, 2007 |
Author: |
Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee |
Abstract: |
The increasing awareness of health risk associated with lead (Pb) containing solder alloys has pushed the electronics industry toward lead-free. The legislation ban the use of lead is only one of the driving forces. From the business point of view, t... |
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RF online, rose online, mu online
Published: |
Feb 22, 2007 |
Author: |
RF online, rose online, mu online |
Abstract: |
Battlefield Call of Duty Command&Conquer Conquer Online Counter Strike Diablo Doom EverQuest General Games Guild Wars Half-Life Helbreath Legend Of Mir Lineage 2 Mafia MapleStory MMORPG & MPOG Mu Online Ragnarok Online RF Online Risk your Life Rose O... |
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New BGA Solder Mask Repair Technique Using Laser Cut Stencils
Published: |
Feb 01, 2007 |
Author: |
Best, Inc |
Abstract: |
The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair.... |
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BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages
Published: |
Feb 01, 2007 |
Author: |
Ray Cirimele, Best, Inc |
Abstract: |
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that
allows for ... |
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