High Density Interconnect (HDI) technology is fast becoming the enabling technology for the next generation of small portable electronic communication devices. These methods employ many different dielectrics and via fabrication technologies. In this ...

In the quest for quality, selecting the right Statistical Process Control (SPC) Software system doesn�t boil down to a simple functional �fit-to-requirements� anymore. Once the expert domain of highly focused, independent software developers, the com...

High Density Interconnect (HDI) technology is fast becoming the enabling technology for the next generation of small portable electronic communication devices. These methods employ many different dielectrics and via fabrication technologies......

This brief study of lead-free wave soldering focuses upon copper dissolution and solder maintenance issues. Unfortunately, it is determined that waste and changeover costs can dramatically increase with lead-free wave soldering....

Globalization and increased competition requires an enterprise to focus on cost reduction, improved manufacturing processes and higher standards of quality. Effective yield management using Enterprise Resource Planning (ERP) systems is crucial for th...

Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pa...

A global firm needing a fast solution for their new product, which couldn�t be properly soldered due to faulty solder joints, approached Germany�s Martin GmbH. Martin�s expertise and superior rework equipment located the problem, isolated it, and pre...

Too often, the effects of assembly process parameters are not sufficiently accounted for in the optimization of thermal interface performance. This becomes increasingly critical as demands on this performance continue to grow and alternative processe...

Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Pack...

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