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Technical Library articles |
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Reduced Oxide Soldering Activation (ROSA)
Published: |
Jul 19, 2007 |
Author: |
American Competitiveness Institute / EMPF |
Abstract: |
ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory chan... |
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Drying & Storage of Moisture Sensitive Devices MSD
Published: |
Jul 19, 2007 |
Author: |
X-TREME SERIES AUTO DRY CABINETS |
Abstract: |
Drying & Storage of Moisture Sensitive Devices getting more and more important. With its reliable design and leading specifications, X-TREME Series auto dry cabinets are suitable for almost all dehumidification applications. ... |
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Implementing Lead Free Soldering � European Consortium Research
Published: |
Jul 12, 2007 |
Author: |
Multicore Solders |
Abstract: |
Over the last ten years, there have been a large number of
publications describing work into lead free electronics soldering. They have come from all regions of the world and from academic organisations, individual companies and consortia. ... |
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Implementing Lead Free Soldering � European Consortium Research
Published: |
Jul 12, 2007 |
Author: |
Multicore Solders |
Abstract: |
Over the last ten years, there have been a large number of publications describing work into lead free electronics soldering. They have come from all regions of the world and from academic organisations, individual companies and consortia.... |
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Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies
Published: |
Jun 27, 2007 |
Author: |
Universal Instruments Corporation |
Abstract: |
Most microelectronic manufacturing sectors are experiencing a renaissance of sorts as traditional surface mount components, in particular large leaded devices make the transition to more compact chip scale packages and flip chip technology.... |
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Selective Solder Paste Deposition Reliability Test Results
Published: |
Jun 21, 2007 |
Author: |
Best Inc |
Abstract: |
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for e... |
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Large Thin Organic PTFE Substrates for Multichip Applications
Published: |
Jun 13, 2007 |
Author: |
Endicott Interconnect Technologies |
Abstract: |
Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices...... |
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Proof is in the PTH - Assuring Via Reliability from Chip Carriers to Thick Printed Wiring Boards
Published: |
Jun 06, 2007 |
Author: |
Endicott Interconnect Technologies |
Abstract: |
The reliability of Plated through holes (PTH's) is
presented as "PTH life curves" which plot cycle to fail vs. temperature for the entire range of field, accelerated thermal cycling, and assembly reflow thermal exposures on a Printed Wire Board (PW... |
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Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs
Published: |
May 31, 2007 |
Author: |
Universal Instruments Corporation |
Abstract: |
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained.... |
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Phase Convection�: The Lead-Free Solution
Published: |
May 30, 2007 |
Author: |
ViTechnology |
Abstract: |
In Europe, the Restriction on Hazardous Substances (RoHS)Directive prohibits the use of lead in electronics beginning July 1, 2006. At the same time the lead-free initiatives of Japanese manufacturers, putting pressure to eliminate lead in electronic... |
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