IPC has launched a new Midwest trade show covering all aspects of the electronics industry � board design and manufacture and electronics assembly, manufacture and test. This event is the ONLY industry-driven event in the Midwest that is focused on d...

Advanced manufacturing today is leaner, more efficient and quality conscious than at any other time in manufacturing history. In order to be competitive in the global marketplace, the nation�s 300,000 advanced manufacturers have increasingly turned t...

With the use of laser light for reflow having been established, all that remains is to apply it to best effect. Each time a laser is fired, it pumps a specific amount of energy at a particular wavelength to a particular point in space....

EFD Inc. and Leister USA have collaborated to bust the myth that you cannot perform laser reflow with solder paste. Using Leister diode lasers, EFD has formulated solder pastes that survive the rapid reflow cycle typical of laser heating....

A conformal coating is defined as a thin polymeric material which covers the surface of an electronic assembly. These coatings are used to provide an electrically insulative and environmentally protective seal or cover to a completed printed circuit ...

The complexity and programmability of modern embedded boards means that knowledge built up during debugging and testing must be regarded as Intellectual Property (IP) and therefore preserved. But many of the processes and tools used today do not prov...

While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" and "graininess and lack of shinine...

Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered p...

This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR). (BLR is also referred to as second level or solder ...

Femtosecond lasers enable microfabrication with resolution beyond the diffraction limit....