| Now Online |
Visitors: 138 Members: 10 |
|
| Subscribe to the SMTnet Express |
|
|
|
| Link to SMTnet |
| Tell everyone you know about SMTnet! You can add this small image to your Web site and provide a link to us. Click here to learn how. |
 |
|
|
|
| |
 |
|

Technical Library articles |
|
Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors
Published: |
Nov 21, 2007 |
Author: |
Endicott Interconnect Technologies |
Abstract: |
This paper discusses laser micromachining of barium
titanate (BaTiO3)-polymer nanocomposites and sol-gel thin films. In particular, recent developments on high capacitance, large area, and thin flexible embedded capacitors are highlighted.... |
|
|
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level
Published: |
Nov 15, 2007 |
Author: |
Kester, Inc. |
Abstract: |
At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave solderin... |
|
|
Maximizing Production Productivity of Automatic Termination Machines
Published: |
Nov 08, 2007 |
Author: |
Schleuniger, Inc. |
Abstract: |
In the past, it was typical to see production batch sizes for automatic termination machines between 1000 and 5000 pieces or more. Most companies would simply make a large batch of parts and stock the parts until they were needed. Because of lean m... |
|
|
Making A Case for Continuous Furnaces
Published: |
Nov 08, 2007 |
Author: |
BTU International |
Abstract: |
A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the vari... |
|
|
Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections
Published: |
Nov 01, 2007 |
Author: |
Endicott Interconnect |
Abstract: |
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,... |
|
|
Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate
Published: |
Oct 25, 2007 |
Author: |
Endicott Interconnect Technologies |
Abstract: |
More and more substrate designs require signals paths that can handle multi-gigahertz frequencies [1-3]. The challenges for organic substrates, in meeting these electrical requirements, include using high-speed, low-loss materials, manufacturing prec... |
|
|
A Practical Guide to Achieving Lead-Free Electronics Assembly
Published: |
Oct 18, 2007 |
Author: |
AIM |
Abstract: |
To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to Quality/Inspection, must have a solid understanding of the changes required of them. This pertains... |
|
|
Maximizing process control with controlled convection rates
Published: |
Oct 10, 2007 |
Author: |
BTU International |
Abstract: |
Today�s convection ovens are equipped with several key control elements. One is temperature, obviously. Another is belt speed. A third is the gaseous atmosphere used. Convection control is an additional, albeit optional, means of control that directl... |
|
|
RF Packaging Advancements
Published: |
Oct 02, 2007 |
Author: |
EMPF / ACI |
Abstract: |
The vast majority (99%) of the electronics market in North America is composed of products produced for commercial applications. The 1% share of the electronics market driven by Department of Defense (DoD) applications has created a niche market for ... |
|
|
The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards
Published: |
Sep 27, 2007 |
Author: |
Universal Instruments |
Abstract: |
Considerable interest exists in the process known as the pinin-paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface m... |
|
|
|
|