Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for sol...

Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics packaging industry. In those early days, components were fairly large, making the board design and printing process relatively simpl...

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints....

It is now widely accepted that using designed experiments is the most effective way to optimize surface mount technology (SMT) processes. This situation begs the question “what is an effective strategy in implementing this powerful tool?” This paper will ...

PCBA Yield with 15mil pitch IC's and ROHS BGA-16mil pitch in Non-ROHS Environment is a challenge. Here tried a systematic approach using six sigma-DMAIC....

As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these tr...

The high level of current interest in embedded passives in printed circuit boards is driven by the tremendous pressure to pack more circuitry into smaller spaces. However, adoption has been limited due to design, prototyping and infrastructure issues, as ...

For effective machine vision, the first step in devising a vision system should be the lighting. This paper reviews important criteria for setting up an effective lighting system....

This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board....

The complexity of Printed Circuit Assembly process is increasing day by day and causing productivity issues in the industry, introducing fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short....