Selective soldering equipment can greatly relieve the assembly operation when dealing with mixed technology boards. The inspection process can be shortened due to fewer errors to verify and note, while touchup time can be significantly reduced, or ...

Quality of wave soldering depends on control of its many parameters....

The consumer�s interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes f...

This research takes an in-depth look at the challenges encountered in developing a lead free wave soldering process based on the specific products as well as on specific materials. It attempts to provide the reader with the information necessary to...

Lead-free SMT can be achieved reliably if several process requirements are implemented carefully....

The latest screen printing platforms unlock more of the potential from dual-lane processing......

This paper shall provide a brief outline of the reflow profile in general, with specific emphasis placed upon the suggested time spent above the melting temperature of the solder. The guidelines for soldering to various surfaces and with alternative ...

Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750µm to the latest WL-CSPs demanding 250µm diameter. This broadening spectrum of applications brin...

Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consume...

High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts are focussed on the optimized routing of signal, power and ground connections. More often overlooked are some o...