Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production

Add Article »

1749 SMT / PCB Assembly Related Technical Articles

Verifying the efficiency of soldering fume extraction and measuring nanoparticle exposure during soldering with an iron with the testo DiSCmini

Jul 10, 2023 | Testo

That manual soldering produces harmful substances in the form of aerosols is a known problem in the electric and electronic industry. The lead-free electronics solders used today have done little to change that. The soldering fumes still contain particles which are formed by the solder and the flux agent. These particles have a high potential of causing permanent damage to the workers’ health. Due to their small diameter between 10 and 150 nm, they can penetrate all the way into the alveoli. But numerous studies also show that nanoparticles can reach all areas of the body through the bloodstream [1].

...

Publisher: Testo SE & Co. KGaA

Testo SE & Co. KGaA

World Leader in Measurement Technology

West Chester, USA

Manufacturer

CLEANING BEFORE CONFORMAL COATING

Jul 04, 2023 | Naveen Ravindran

CONTENT * Introduction * Failure Mechanisms * Coating Failures * Cleaning Before Conformal Coating * Analytics & Test Methods...

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas, Virginia, USA

Consultant / Service Provider, Manufacturer, Training Provider

Conformal Coating Defects

Jul 04, 2023 | Diamond MT

Conformal Coatings are polymeric materials used to protect circuitry, parts, and related components. They are most commonly used to protect printed circuit boards (PCBs) and electronic devices. However, conformal coatings can be applied to a wide variety of materials, including metal, plastic, silicone, ceramics, glass, and even paper. We use the term "substrate" to refer to an object or material that's been coated with a conformal coating....

Publisher: Diamond MT

Diamond MT

Conformal Coating Service Provider; Parylene Conformal Coating

Johnstown, Pennsylvania, USA

Other

The Effects of Silver Content and Solidification Profile on the Anand Constitutive Model for SAC Lead Free Solders

Jun 14, 2023 | Munshi M. Basit, Mohammad Motalab, Jordan C. Roberts, Jeffrey C. Suhling, Pradeep Lall

In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically....

Publisher: Auburn University

Auburn University

Auburn University is a comprehensive land-grant institution with primary missions including instruction, research, and extension/outreach.

Auburn, Alabama, USA

Research Institute / Laboratory / School

Using Stencil: Design to Reduce SMT Defects

Jun 12, 2023 | Paul Lotosky, Michael Murphy, Robert Pearson, Michael Tesch

Solder paste printing is understood to be the leading contributor of defects in the electronics assembly process. Because yield accounts for such a large percentage of the margin, the greatest opportunity to improve profitability in the assembly of most electronics can be gained by reducing or eliminating solder defects. This article examines process adjustments made through stencil design that correct a misalignment situation between the PCB and stencil, leading to a 43% reduction in assembly defects. Examples of each are found in Table 1....

Publisher: AVI Precision Engineering Pte Ltd

AVI Precision Engineering Pte Ltd

Manufacturer of compatible replacement parts of SMT, Through-hole & Wave soldering machines, namely Panasert, Dynapert, Universal, Sanyo, Fuji, Juki, Philips, Camalot, Nitto, Yamaha, Tenryu, Samsung, Quad, Electrovert, Soltec, Sensbey, Iemme, Koki, Yokota, Tamura, etc.Precision machining servicesBuy, sell, service & overhaul used SMT & Through-hole machines.Machinery & accessories for Electr

Singapore, Singapore

Manufacturer

Optimizing Stencil Design For Lead-Free Smt Processing

Jun 12, 2023 | Ranjit S Pandher, Chrys Shea

As any new technology emerges, increasing levels of refinement are required to facilitate the mainstream implementation and continual improvement processes. In the case of lead-free processing, the initial hurdles of alloy and chemistry selection are cleared on the first level, providing a base process. The understanding gained from early work on the base process leads to the next level of refinement in optimizing the primary factors that influence yield. These factors may include thermal profiles, PWB surface finishes, component metallization, solder mask selection or stencil design....

Publisher: Cookson Electronics Assembly Materials

Cookson Electronics Assembly Materials

Cookson Electronics Assembly Materials

Singapore, Singapore

The Effect of Higher Stencil Tension on Printing Performance

Jun 12, 2023 | Tom Meeus, Jan Van Lieshout, Hans Korsse, Sathiya Naryana

In this article we will examine if there is a measurable difference in the printing performance when using stencils which have a higher tension than is commonly accepted in the industry. Alpha's new tensoRED™ High Tension Frame System will be introduced during this wider examination. We will examine their effect in terms of controlling variation in critical deposit volumes and what, if any effect on positional accuracy can be seen....

Publisher: Alpha Assembly Solutions

Alpha Assembly Solutions

Alpha Assembly Solutions is a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places.

South Plainfield, New Jersey, USA

Manufacturer

Stencil Printing Process Tools for Miniaturisation and High Yield Processing

Jun 12, 2023 | Clive Ashmore & Mark Whitmore

The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented....

Publisher: ASM Assembly Systems (DEK)

ASM Assembly Systems (DEK)

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Suwanee, Georgia, USA

Manufacturer

Stencil Design For Mixed Technology Through-Hole / Smt Placement And Reflow

Jun 12, 2023 | William E. Coleman, Denis Jean, Julie Bradbury

This paper will review stencil design requirements for printing solder paste around and in through-hole pads / openings. There is much interest in this procedure since full implementation allows the placement of both through-hole components as well as SMD's and the subsequent reflow of both simultaneously. This in turn eliminates the need to wave solder or hand solder through-hole components....

Publisher: Photo Stencil LLC

Photo Stencil LLC

Photo Stencil provides high-performance stencils, squeegee blades, thick film and metal mask screens and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries.

Colorado Springs, Colorado, USA

Manufacturer

Recurrent Neural Network-Based Stencil Cleaning Cycle Predictive Modeling

Jun 12, 2023 | Haifeng Wang, Tian He, and Sang Won Yoon

This paper presents a real-time predictive approach to improve solder paste stencil printing cycle decision making process in surface mount assembly lines. Stencil cleaning is a critical process that influences the quality and efficiency of printing circuit board. Stencil cleaning operation depends on various process variables, such as printing speed, printing pressure, and aperture shape. The objective of this research is to help efficiently decide stencil printing cleaning cycle by applying data-driven predictive methods. To predict the printed circuit board quality level, a recurrent neural network (RNN) is applied to obtain the printing performance for the different cleaning aging. In the prediction model, not only the previous printing performance statuses are included, but also the printing settings are used to enhance the RNN learning. The model is tested using data collected from an actual solder paste stencil printing line. Based on the predicted printing performance level, the model can help automatically identify the possible cleaning cycle in practice. The results indicate that the proposed model architecture can predictively provide accurate solder paste printing process information to decision makers and increase the quality of the stencil printing process....

Publisher: Binghamton University

Binghamton University

Binghamton as an institution is dedicated to higher education, one that combines an international reputation for graduate education, research, scholarship and creative endeavor with the best undergraduate programs available at ...

Binghamton, New York, USA

Research Institute / Laboratory / School

Void Free Reflow Soldering
IPC Training & Certification - Blackfox
Now Online
50
Visitors
5
Members

Who are SMTnet visitors?

Become a member now and receive the value and benefits of membership.

Sell Used SMT & Test Equipment
IPC/WHMA-A-620 training Nasa Space Addendum

See Your 2024 IPC Certification Training Schedule for Eptac