This paper will review some basic past and present flux chemistries that affect flux collection methodology. It will also review some of the most common flux collection methods, self-cleaning techniques, and maintenance goals. And, finally, data will...

Tracking goods through manufacturing was originally accomplished with pencil, paper and human input. Barcodes introduced an automated, machine-readable tracking mechanism that streamlined all types of manufacturing. But modern printed circuit board (...

The objective of the study was to evaluate the solder joint integrity impact of reflowing a Pbfree solder alloy using a tin/lead reflow profile on BGA components....

Design workflow is the core to your design team�s competitive advantage; it�s the conduit by which you turn your team�s expertise and ideas into manufacturable products. And yet, all engineering teams face the challenge of maximizing their producti...

The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high de...

This paper reports the results of the measurement of the impact strength of lead-free 0.50.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA...

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just ...

Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly methodology used to implement these devices is fully compatible with existing surf...

This article suggests five major areas where improved information can improve business decisions and profitability....

This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation...