This study was designed to investigate the impact of mechanical vs. chemical energy contributions during the removal of contamination under 1-2 mil standoff components. To validate the results obtained, extensive studies were conducted, specifically ...

As the drive toward miniaturisation in electronic assembly continues, and Surface Mount Technology matures, components become ever smaller and lighter. Although the prevailing sizes in passives were 1206 and 0805 in the 1980's, these no longer mak...

In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to...

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential...

Shrinking product development cycles coupled with demanding product requirements and increasingly complex design implementations can overwhelm a design team. The technical risk of employing new, complex, high-speed processor technology can often dete...

With today's tight economy, there's new life in Agilent's older test equipment when upgraded with new tools available; thus avoiding the purchase of a new system. The upgrades also allow for larger boards to be tested without incurring higher cos...

Kitting is the first step in printed circuit board assembly. It is initiated well in advance of the actual production start to be able to prepare and deliver the kit on time. Kitting involves the gathering of all the parts needed for a particular ass...

The Restriction of Hazardous Substances (RoHS) regulations of the European Union, and similar regulations being enacted around the world, require the virtual elimination of lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6), polybromina...

Aug 11, 2008 - Toronto, Canada - Blink Communications will be exhibiting reliable network services during the 2008 Financial Services Technology Forum on October 28 & 29 at the Design Exchange in Toronto, Canada....

Toronto, ON - GAO Fiber Optics (http://www.GAOFiberOptics.com) has released a new series of Netgear Compatible transceivers - GBICs, SFPs, and XFPs - which are specially designed to be fully compatible with Netgear��s original products....