The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB materi...

For many years Acoustic Micro Imaging (AMI) techniques have been utilized to evaluate the quality of the underfill used to support the solder bump interconnections of Flip Chip type devices. AMI has been established as one of the few techniques that ...

Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts a...

Flex cracks have been known in PCB manufacturing for quite some time. Flex cracks are created in capacitors when board flex stress / bending stress is applied to a circuit board with ceramic components already affixed to the PCB. As the ceramic capac...

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive tec...

This article examines stamp soldering, a solution that provides consistent high quality by repeatedly applying accurate amounts of molten solder onto a printed circuit board using static volumetric solder stamps guaranteeing total flatness during the...

This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective a...

Many Original Equipment Manufacturers, (OEM's), struggle to continue shipping aging or obsolete electronic products. Electronic products designed five to ten years ago are still relevant in the marketplace....

The medical industry is known for its emphasis on the type of device being designed. Designers must demonstrate, through adequate testing and documentation, that product requirements are being met. The FDA and similar bodies in other countries have v...

As the drive towards assembly miniaturization continues and Surface Mount Technology matures, components are becoming ever smaller and thinner. Despite considerable skepticism when 0201 devices were first introduced, they are now commonly used for hi...