Electronics Manufacturing Technical Articles

Jul 07, 2011

E.Boni, D. Montanari, L. Caliari, F. Bregoli, L. Barbieri, F. Bergamaschi

The demand for miniaturized electronic equipment and fully-automated assembly lines for mass-production of new products require the availability of a complete range of SMD components...

Jun 29, 2011

Chrys Shea, Quyen Chu, Sundar Sethuraman, Rajoo Venkat ,Jeff Ando, Paul Hashimoto

High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address...

Jun 28, 2011

ZESTRON

ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....

Jun 23, 2011

Jasbir Bath, Gordon Clark, Tim Jensen, Renee Michalkiewicz, Brian Toleno

Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and refinement of the definition and testing of halogen-free solde...

Jun 16, 2011

Roger Massey, Adrian Zee

Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume ...

Jun 09, 2011

Brian J. Leach

QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and...

Jun 09, 2011

Craig Leising

Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla...

Jun 02, 2011

Edward Wyrwas, Lloyd Condra, Avshalom Hava

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit boa...

May 26, 2011

Ila Pal

The Semiconductor industry enabling today’s electronics market place is widely disseminated between multiple customer factions such as consumer electronics, telecommunications, automotive, medical devices, military, aerospace, industrial controls, embedde...

May 19, 2011

Sjef v. Gastel, Manager of Advanced Development, Assembléon

Electronic equipment manufacturers know that rework and scrap cost them money, but rarely know just how much. Calculating it is relatively straightforward knowing the production line’s First Pass Yield (FPY), though....