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Technical Library articles |
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Cleaning High-power Electronics
Published: |
Jan 06, 2009 |
Author: |
Zestron Corporation |
Abstract: |
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components ... |
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An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections
Published: |
Jan 01, 2009 |
Author: |
Michael J. Rowlands and Vara Calmidi, Endicott Interconnect Technologies |
Abstract: |
Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement... |
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Five Myths of Reliability
Published: |
Dec 23, 2008 |
Author: |
DfR Solutions |
Abstract: |
Myth 1: I don't worry about design, because most of my problems are with defects from suppliers...... |
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Fuel Cell Production Revs Up. The paste printing platform and process has other uses, too.
Published: |
Dec 18, 2008 |
Author: |
DEK |
Abstract: |
Unless you've been living under a rock the past several years, you are no doubt keenly aware of the global drive toward alternative energy sources. Certainly this initiative is attractive because of the clear environmental benefits of developing fos... |
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Bromide-Free Options for Printed Circuit Boards
Published: |
Dec 11, 2008 |
Author: |
DfR Solutions |
Abstract: |
Flame retardants have been around since the Egyptians and Romans used alum to reduce the flammability of wood. Brominated flame retardants (BFRs) first experienced use after World War II as the substitution of wood and metal for plastics and foams re... |
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Click On Stock
Published: |
Dec 10, 2008 |
Author: |
Uniquip Plus |
Abstract: |
Whether its up to the minute, accurate stock and inventory or the fact that all distributors are either franchised or authorized gives no need to worry as every part can traced directly to the manufacturer... |
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Broadband Printing � A Paradigm
Published: |
Dec 03, 2008 |
Author: |
Speedline Technologies, Inc |
Abstract: |
The SMT industry is going through a challenging phase of assembling miniature components, such as micro BGA, 0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primarily driven by the cell phone and other hand held device ... |
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Advanced Electronic Connector Technologies
Published: |
Nov 27, 2008 |
Author: |
ACI-EMPF |
Abstract: |
Military electrical connectors have traditionally used very conservative design rules that provide the ruggedization needed for harsh military use environments. Commercial electronic connectors have typically used less conservative design rules that.... |
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Advanced Electronic Connector Technologies
Published: |
Nov 27, 2008 |
Author: |
ACI-EMPF |
Abstract: |
Military electrical connectors have traditionally used very conservative design rules that provide the ruggedization needed for harsh military use environments. Commercial electronic connectors have typically used less conservative design rules...... |
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Controlling Copper Build Up in Automatic Soldering Equipment
Published: |
Nov 20, 2008 |
Author: |
AIM |
Abstract: |
Since "nothing solders like solder", HAL (Hot Air Leveling) will continue to hold a significant place in the surface finishing industry. Furthermore, the wave soldering process will continue to be a viable means of electronics assembly. However, as a... |
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