XLamp LEDs lead the solid-state lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase desi...

Today the lead free soldering process is a must in commercial electronics and it is also coming more and more important in automative and industrial electronics sectors in the near future. The most common choices for lead free solders are different T...

Significant improvements in coating deposition control can be achieved with advanced ultrasonic coating technology that provides precise control of the film thickness....

Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the...

Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differe...

Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growt...

A brand is the most important strategic asset your business will ever possess. Yet ask even the most experienced marketer and they will struggle to communicate the concept in a single sentence....

The plated thru hole has changed considerably in 50 years of electronic packaging, but in its many forms remains the most common interconnection in 1st and 2nd level electronic packaging, and is still one of the most feared in terms of reliability....

No SMT equipment can place accurately and run efficiently without quality nozzles and feeders. These two factors are the core of the pick and place process. With appropriate preventative maintenance combined with high quality nozzles, you can achieve...

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. ...