Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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589 SMT / PCB Technical Articles

A Novel Low Temperature Fast Flow And Fast Cure Reworkable Underfill

Apr 11, 2014 | Dr. Mary Liu and Dr. Wusheng Yin

In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for use in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable....

Publisher: YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials, LLC.

Albany, New York, United States

Manufacturer of Assembly Material, Components/Substrates, Contract Manufacturer

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Solar Panel Design Decision and General Information Sheet

Apr 10, 2014 | Alexander L Carrere.

This paper is meant to be a guide and a reference to new and old members alike who wish to know about, understand, and improve on the decisions made and processes implemented to build the current solar panels. The following paragraphs in the introduction will lay out background information on solar panels and cube satellites. This entire document was written with the idea that the reader will be able to follow the decisions made to construct the solar panels and then with this knowledge find areas of the project for improvement....

Publisher: iSAT Group

iSAT Group

Providence, Rhode Island, United States

Other

We are a student group at Brown University working to build a low-cost, open-source CubeSat, EQUiSat.

A System Level Electrostatic Discharge Protection Modeling Methodology for Time Domain Analysis.

Apr 03, 2014 | Nicolas Monnereau, Fabrice Caignet, David Trémouilles, Nicolas Nolhier, Marise Bafleur.

A system level modeling methodology is presented and validated on a simple case. It allows precise simulations of electrostatic discharge (ESD) stress propagation on a printed circuit board (PCB). The proposed model includes the integrated circuit (IC) ESD protection network, IC package, PCB lines, passives components, and externals elements. The impact of an external component on the ESD propagation paths into an IC is demonstrated. Resulting current and voltage waveforms are analyzed to highlight the interactions between all the elements of an operating PCB. A precise measurement technique was designed and used to compare with the simulation results. The model proposed in this paper is able to predict, with good accuracy, the propagation of currents and voltages into the whole system during ESD stress. It might be used to understand why failures occur and how to fix them with the most suitable solution....

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

Institute of Electrical and Electronics Engineers (IEEE)

Piscataway, New Jersey, United States

Association, Non-Profit, Training / Education

IEEE is the world's largest professional association dedicated to advancing technological innovation and excellence for the benefit of humanity.

Cleaning PCB's in Electronics - Understanding Today's Needs.

Mar 27, 2014 | P.J. Duchi, Anne-Marie Laugt, Marie Verdier, G.Aabidh.

Because of the phase out of CFC's and HCFC's, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices....

Publisher: Inventec Performance Chemicals

Inventec Performance Chemicals

Vincennes , France

Manufacturer of Assembly Material

Inventec, one of Europe's leading Performance Chemicals companies, is the high-tech industries business of the Dehon Group

PCB Surface Finishes & Cost Effective Pb Free Assembly Materials

Mar 27, 2014 | Richard Puthota Director – Business Development & CTS India & Africa, Cookson Electronics

The surface finish you select will have a large influence on quality, reliability and cost. It is a complex decision that impacts many areas of the business. Select a finish that optimal for the business (and not just one function). Know that there are engineering tricks to improve on weak areas of each finish. Stay current in this field because new developments continue to be made....

Publisher: Cookson Electronics

Cookson Electronics

Providence, Rhode Island, United States

Manufacturer of Assembly Material

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Data Bus Components - The Communication System that Helps in Transferring Data

Mar 27, 2014 | Joe Faruqui

Data bus in computer terminology is a communication system that helps in transferring data between components within a computer, or between separate computers. Know more about data bus components and advancements in data bus technology by reading this article....

Publisher: Just Connectors

Just Connectors

Fountain Valley, California, United States

Other, Distributor

Just Connectors is subsidiary division of ASAP Semiconductor.

Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering

Mar 20, 2014 | Dipl.-Ing. Helmut Leicht; Andreas Thumm - IBL-Löttechnik GmbH.

In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use)....

Publisher: IBL - Löttechnik GmbH

IBL - Löttechnik GmbH

Königsbrunn, Germany

Manufacturer of Assembly Equipment, Soldering

Manufacturer of vapor phase soldering systems and associated products since 1985.

Stencil Design Guidelines for Electronics Assembly Technologies.

Mar 13, 2014 | Budapest University of Technology and Economics Department of Electronics Technology

A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production....

Publisher: Budapest University of Technology and Economics

Budapest University of Technology and Economics

Budapest, Hungary

Training / Education

BME is considered the world's oldest Institute of Technology which has university rank and structure. It was the first institute in Europe to train engineers at university level.

Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect.

Mar 06, 2014 | Jasbir Bath, Roberto Garcia - Christopher Associates Inc. Noriyoshi Uchida, Hajime Takahashi, Gordon Clark, Manabu Itoh - Koki Solder

Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies....

Publisher: Christopher Associates Inc.

Christopher Associates Inc.

Santa Ana, California, United States

Inspection

A pioneering supplier and distributor to the electronics and chemical processing industries.

A Novel High Thermal Conductive Underfill For Flip Chip Appliation

Feb 27, 2014 | Dr. Mary Liu and Dr. Wusheng Yin

Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices...

Publisher: YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials, LLC.

Albany, New York, United States

Manufacturer of Assembly Material, Components/Substrates, Contract Manufacturer

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

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