Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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695 SMT / PCB Technical Articles

Adhesive Backed Plastic Stencils vs Mini Metal Stencils

Aug 27, 2015 | Bob Wettermann, MIT

Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components....

Publisher: Business Electronics Soldering Technologies (BEST) Inc.

Business Electronics Soldering Technologies (BEST) Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, United States

Repair/Rework, Soldering, Service Provider, Training / Education

Challenges for Step Stencils with Design Guidelines for Solder Paste Printing

Aug 25, 2015 | Carmina Läntzsch, Georg Kleemann

The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil.

The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process....

Publisher: LaserJob

LaserJob

Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.

Fürstenfeldbruck, Germany

Manufacturer of Assembly Material, Soldering

SELECT CONFORMAL COAT FORMULATION FOR PCB ENVIRONMENT

Aug 20, 2015 | Wes Noble

Temperature and Humidity on Selective Conformal Coating It is well known that selective conformal coating on printed circuit board (PCB) assemblies provides unparallel protection for PCB’s. Nevertheless, concentrated conditions of humidity, water, and high temperatures can have negative effects on the conformal coating itself causing it to fail and become inapt for its intended purpose. Taking this into consideration, it is prudent to choose the right type of conformal coating that best suits the application and environmental conditions under which an assembly is likely to undergo in use. The proper conformal coating will significantly reduce the likelihood of failure/rejection, saving both valuable time and money for any manufacturing process....

Publisher: ETS - Energy Technology Systems, Inc.

ETS - Energy Technology Systems, Inc.

Manufacturer of Fluid Dispensing Equipment for Selective Conformal Coating, Potting, Encasulation & Underfill including Inspection, Conveying and Curing. Total Solution Fluid Dispensing & Conformal Cocating Process Lines.

Deer Park, Washington, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Inspection, Soldering, Turnkey

Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly

Aug 20, 2015 | John McMahon P.Eng, Tom Blaszczyk, Peter Barber

Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices.

Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results....

Publisher: Celestica Corporation

Celestica Corporation

A multinational electronics manufacturing services (EMS) company.

Toronto, Ontario, Canada

Manufacturer's Rep

NON-CONTACT FLUID DISPENSING WITH PS-8200 JETTING VALVE

Aug 18, 2015 | Brian Stumm

Jetting Valve Technology Superior to Needle Dispensing Compared to traditional needle dispensing technology, jetting valve technology is the most effective method for quick and accurate fluid dispensing. Injection technology has many advantages, it provides a combination of high-speed, high quality and low cost production for fluid dispensing processes. Instead of putting focus on getting the application done, jet dispense technology focuses on performance, providing applications like underfill, potting and encapsulation with more precision than ever before. Improved Fluid Dispensing Speed and Accuracy Non-contact jetting valves offer a significant advantage over traditional needle dispense valves. Jetting Valve Dispenser precision reaches to 200µm with dot diameter or line width as small as 250µm and volumetric dispensing down to .0036µl. Minimum space between lines is 180µm and maximum fluid dispense speed is 200 dots/second. The following video illustrates quick, accurate fluid dispensing for an LED packaging application....

Publisher: ETS - Energy Technology Systems, Inc.

ETS - Energy Technology Systems, Inc.

Manufacturer of Fluid Dispensing Equipment for Selective Conformal Coating, Potting, Encasulation & Underfill including Inspection, Conveying and Curing. Total Solution Fluid Dispensing & Conformal Cocating Process Lines.

Deer Park, Washington, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Inspection, Soldering, Turnkey

CONFORMAL COATING FOR WATER RESISTANT CIRCUIT ASSEMBLIES

Aug 18, 2015 | Brian Stumm

Why Selectively Conformal Coat the Electronic Assembly? Printed circuit boards (PCBs) are employed in a variety of products and devices, and this means that it might be necessary for your PCBs to be moisture resistant. It is important to choose the right type of conformal coating so you need not worry about the durability of your product. Fortunately, there are several options available that can help, and you can even use selective conformal coating robots to provide proper application of the coating....

Publisher: ETS - Energy Technology Systems, Inc.

ETS - Energy Technology Systems, Inc.

Manufacturer of Fluid Dispensing Equipment for Selective Conformal Coating, Potting, Encasulation & Underfill including Inspection, Conveying and Curing. Total Solution Fluid Dispensing & Conformal Cocating Process Lines.

Deer Park, Washington, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Inspection, Soldering, Turnkey

ULTRAVIOLET (UV) CURING TECHNOLOGY

Aug 18, 2015 | Wes Noble

What is UV Curing? “Ultraviolet (UV) light is an electromagnetic radiation with a wavelength from 400 nm to 100 nm, shorter than that of visible light but longer than X-rays.” (Source: Wikipedia). Ultraviolet or UV curing is used to create a photochemical reaction using high intensity Ultraviolet (UV) energy or “light” to quickly dry inks, adhesives or conformal coatings. Most materials cure with a UV wavelength around 350 ~ 400nm although some materials require UVC energy near 255nm. There are many advantages to using UV curing over other traditional methods of curing. Not only will it increase production speed, it assists in creating a better bond, and improves scratch and solvent resistance. When compared to other methods of curing, UV curing generates a more reliable cured product at a much higher rate of production in a considerably shorter period of time....

Publisher: ETS - Energy Technology Systems, Inc.

ETS - Energy Technology Systems, Inc.

Manufacturer of Fluid Dispensing Equipment for Selective Conformal Coating, Potting, Encasulation & Underfill including Inspection, Conveying and Curing. Total Solution Fluid Dispensing & Conformal Cocating Process Lines.

Deer Park, Washington, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Inspection, Soldering, Turnkey

Improve Crimp Quality to Increase Productivity

Aug 17, 2015 | Pete Doyon, VP, Product Management, Schleuniger, Inc.

Since a high percentage of product failures can be traced to poor electrical connections, crimp quality is of paramount importance. There are many factors that come into play that affect crimp quality and knowing the relevant factors, and to what extent each factor affects the end result, will help to guide the process engineer towards achieving the best possible results. ...

Publisher: Schleuniger, Inc.

Schleuniger, Inc.

Schleuniger, Inc. is a leading manufacturer of wire processing equipment. Our innovative automatic and semi-automatic machines are designed to cut, strip, crimp and mark all types of wire and cable.

Manchester, New Hampshire, United States

Manufacturer of Assembly Equipment

Pad Cratering Susceptibility Testing with Acoustic Emission

Aug 13, 2015 | Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic Technology Group,

Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs.

Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing....

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, United States

Manufacturer of Assembly Equipment

Enclosed Media Printing as an Alternative to Metal Blades

Aug 06, 2015 | Michael L. Martel

Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself, traditionally the source of 70% of all assembly defects, finds its process window narrowing. The technology of metal blade squeegees, with the aid of new materials, understanding, and settings such as blade angle, has kept pace with all but the smallest applications, e.g., 200μ - .50 AR and 150μ - .375 AR, which have been pushing blade printing technology to its limits.

Enclosed media print head technology has existed, and has been under increasing development, as an alternative to metal squeegee blade printing. Until recently, the performance of enclosed print heads had been comparable to the very best metal squeegees, but advances in enclosed print media technology have now made it a superior alternative to squeegee blades in virtually all applications....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Screen Printing, Soldering

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