Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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766 SMT / PCB Technical Articles

The Value of Solder Paste Inspection

Aug 24, 2016 | Akber

Unfortunately, in PCB manufacture there is always the risk of solder joint defects. It has been estimated that over half of all such defects are the result of improper solder paste printing. There are variations based on the print volume. For smaller volume printing, good solder paste printing practices can be acceptable. For larger printing volumes, it will be worthwhile considering using solder paste inspection (SPI). When you think of the processes involved, surface mount assembly is complex. It relies on solder paste for connecting the leads on the integrated chip to the correct points on the board. The process involves using the stencil to print the paste onto the chip. This is then melted, resulting in a fused connection. There are crucial aspects of the process – the volume of solder used is vital in ensuring an effective fusing, as is the alignment. The complexity of achieving this has increased for two reasons – the density of components has increased in PCBs over time; and the SMT production often involves solder paste that is hidden from view. Because of the technical issues involved, the solder printing process is responsible for the majority of assembly defects. As an example, if too much solder paste used; OR if too little is used, there is a risk of unreliable joints, leading to the risk of failure. Because of these risks, SPI was developed. It provides a tool that allows manufacturers to monitor the volume and alignment of solder paste, and can be integrated into manufacturer’s quality management systems. The SPI process uses pictures taken from angle cameras that accurately measure the alignment and volume of solder paste. The pictures are then interpreted using software to provide key data about the printing process. The results help identify any potential errors that can then be addressed and corrected before assembly. SPI works to rapidly identify issues with volume or alignment of the solder. As a result, using SPI can improve the print quality and the yield, helping ensure efficient production of PCBs. The process also minimizes the potential of costs due to re-working of faults. SPI was originally developed as a two dimensional tool, but has developed from 2D to 3D. The third dimension measures the height of the solder paste, enabling the equipment to accurately measure the volume that is being laid onto the board in the printing process. When 3D SPI is used in conjunction with Automated Optical Inspection, quality control can be ensured for both the placement of components and the associated placement of the solder print. A sign of a good manufacturer is one who can provide PCBs on time, and defect-free. Manufacturers who integrate 3D SPI and Automated Optical Inspection have systems to ensure they can deliver your PCBs in line with your specifications. It will always be worth your while ensuring that you choose your manufacturer on this basis. http://www.rushpcb.com...

Publisher: RUSH PCB Inc

RUSH PCB Inc

RUSH PCB Inc is your source for high quality Printed circuit boards. Manufacture & assembly of printed circuit boards, Fast turn PCB Prototyping, ISO9001/ITAR/UL/Cage Code certified Manufacturing.

San Jose, CA 95131, California, USA

Manufacturer of Assembled PCBs, Manufacturer of Bare PCBs

Mechanical stress test for component solder joints and bonding wires

Aug 24, 2016 | MINIMOTOR Benelux

From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device....

Publisher: XYZTEC bv

XYZTEC bv

XYZTEC is the market and technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester, providing leading customers with fully automated shear, push and pull testing.

Panningen, Netherlands

Inspection, Test Services

Bond Test Measurement Accuracy

Aug 23, 2016 | Bob Sykes

While many things can affect the force measurement accuracy of a bond test, its ultimate limitation is that of the force sensor. With advances in technology, accuracy can be dramatically improved with no cost penalty and no need to select force measurement ranges. How is this accomplished? ...

Publisher: XYZTEC bv

XYZTEC bv

XYZTEC is the market and technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester, providing leading customers with fully automated shear, push and pull testing.

Panningen, Netherlands

Inspection, Test Services

Selective Reflow Rework Process

Aug 18, 2016 | Omar García, Enrique Avelar, C. Sanchez, M. Carrillo, O. Mendoza, J. Medina, Zhen (Jane) Feng,Ph.D., Murad Kurwa

The Selective Reflow Rework Process is an approach to improving the high volume rework process, increasing process capabilities and process repeatability by using a standard reflow oven of 12 zones, pick and place machinery, semi-automated printing gear and Solder Paste Inspection (SPI) implementations. This approach was able to reduce the amount of rework equipment by more than half. Our human resource requirements (indirect and direct labor) were cut by more than 50% and our rolled throughput yield increased from 68.9% to 84.14%. The Selective Reflow Rework Process is less reliant upon operators and has become a repeatable, stable rework process....

Publisher: Flex (Flextronics International)

Flex (Flextronics International)

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Singapore, Singapore

Design, Service Provider

Innovation ploughing into the automotive industry with the help of PCB’s

Aug 17, 2016 | Technotronix

To stake a claim in upcoming new technologies and increasing improved customer experience, it is now becoming a central point of consideration to bring out the new classy vehicle design, car manufacturing techniques, testing system in the global market. The current vehicle manufacturer’s also aim to maintain equilibrium between deep capital investment and long product cycle to make the car model a success story. With this, the type of printed circuit board to be used in the vehicle is decided with focusing more on the type of material used in the vehicle and the level of electronic manufacturing and design solution needed in the vehicle production. To go into the roots of the automotive industry, it is equally important to get insights into the PCB used in vehicles and the new innovations brought forward by researchers to create a dream vehicle of the series. The below paragraph drives you to the types of PCB used in the automotive sector....

Publisher: Technotronix

Technotronix

TechnoTronix provide PCB Assembly service, PCB Design, PCB Layout, Printed Circuit Board Design Services, PCB Design Solutions, PCB Manufacturing, PCB Assembly and Fabrication.

Anaheim, California, USA

Contract Manufacturer, Manufacturer of Assembled PCBs, Repair/Rework, Test Services, Turnkey

New Approaches to Develop a Scalable 3D IC Assembly Method

Aug 11, 2016 | Charles G. Woychik Ph.D. Sangil Lee, Ph.D., Scott McGrath, Eric Tosaya and Sitaram Arkalgud Ph.D.

The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate.

In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility....

Publisher: Invensas Corporation

Invensas Corporation

Invensas is focused on the development of cutting-edge enabling technologies in advanced semiconductor packaging for advanced mobility and storage products.

San Jose, California, USA

OEM

PCB Molding An Upward Curve Of Innovation In Building Protection Systems

Aug 11, 2016 | Technotronix

Be it a residential building, hospital, shopping mall, hotel, school, educational institution or any kind of a building, the security of the building is a prime facet to get a complete building solution. This also includes protecting the building, its assent and the human life from the airborne toxic industrial chemical, radiological and biological attacks or any accidental release apart from fire, water, earthquake and other security concerns. For these high value security solutions, the upgraded technology for the building safety system is now a top priority, especially in the commercial building sector and residential constructions. To introduce a completely new concept and a unique solution, it is necessary to focus on the dynamic electronic design and manufacturing solution in consultation with the custom PCB experts....

Publisher: Technotronix

Technotronix

TechnoTronix provide PCB Assembly service, PCB Design, PCB Layout, Printed Circuit Board Design Services, PCB Design Solutions, PCB Manufacturing, PCB Assembly and Fabrication.

Anaheim, California, USA

Contract Manufacturer, Manufacturer of Assembled PCBs, Repair/Rework, Test Services, Turnkey

Evaluation of Under-Stencil Cleaning Papers

Aug 04, 2016 | Lars Bruno

Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen printing is the under stencil cleaning process and one of the key materials in this process is the cleaning paper1. This, often neglected, material affects the cleaning process and thereby also the print quality. It is therefore important to perform tests of different cleaning papers before one could be chosen.

This article describes how cleaning papers can be tested and it also tells how big differences it can be between different materials....

Publisher: Ericsson AB

Ericsson AB

Ericsson AB manufactures and markets radio and television communication equipment. The company was formerly known as Ericsson Radio Systems AB. Ericsson AB (Sweden) operates as a subsidiary of Ericsson.

Stockholm, Sweden

Other

Success Story of PCB Assembly Trend

Aug 04, 2016 | 4pcb assembly

With the onset of 1900’s, the novelty of printed circuits boards got started with a profound concept of constructing an electrical path on an isolated surface of a board. The initial trend of printed circuit board got into a vain to develop and upgrade the radios and gramophones. Gradually the notion of ‘Through Hole Technique’ came into picture to produce a double sided PCB. In mid 1990’s the idea of auto assembly process was introduced by PCB Manufacturer USA. This was a point of modern touch to enhance the fabrication process with automated soldering technique. The research and development picked up a pace for end to end electronic solutions for defense and US army....

Publisher: 4PCB Assembly

4PCB Assembly

Are you Looking Printed Circuit Board Manufacturer in USA? Then PCB Assembly is right place for manufacturing, design, fabrication and assembly of PCBS.

Anaheim, California, USA

Assembly, Contract Manufacturer, Design, Manufacturer of Assembled PCBs, Manufacturer of Assembly Equipment

Printed Circuit Board Becoming A Vital Arena for Bringing Creativity In Audio Devices

Aug 02, 2016 | Technotronix

The audio device industry is set to grow in parallel with the technology triggering across the globe. Also the entertainment and hospitality industry has created an increased demand of audio devices at large. With the enhancement coming up in consumer applications every other day, the recent trend of implementing wireless technology in audio devices has captivated the attention in the market with its growing popularities all over the electronics industry. The recent audio discoveries have marked cosmic developments in the new product launch, business partnership and acquisition globally. With this, the audio device makers are now in race to present a multi featured compact device with giving an appealing dimension experience to the end users in order to survive in the electronic market. ...

Publisher: Technotronix

Technotronix

TechnoTronix provide PCB Assembly service, PCB Design, PCB Layout, Printed Circuit Board Design Services, PCB Design Solutions, PCB Manufacturing, PCB Assembly and Fabrication.

Anaheim, California, USA

Contract Manufacturer, Manufacturer of Assembled PCBs, Repair/Rework, Test Services, Turnkey

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