Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
634 SMT / PCB Technical Articles

Head in Pillow X-ray Inspection at Flextronics

Dec 18, 2014 | Alejandro Castellanos, Adalberto Gutierrez, Gilberto Martin, Matthew Vandiver, Ranga Dematampitiya, Hung Le, Elliott Le, Phuong Chau, Hao Cui, An Qi Zhao, Wei Bing Qian, Fuqing Li, Jacky Yao, Jiyang Zhang, Leonard Brisan, Cristian Gurka, Shane Young

Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critical part of electronics manufacturing. In this project, we focus on how to use AXI to identify BGA Head-in-Pillow (HIP), which is challenging for AXI testing. Our goal is to help us understand the capabilities of current AXI machines....

Publisher: Flextronics International

Flextronics International

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Singapore, Singapore

Manufacturer's Rep

Failure Modes in Wire bonded and Flip Chip Packages

Dec 11, 2014 | Mumtaz Y. Bora

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...)

The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared...

Publisher: Peregrine Semiconductor

Peregrine Semiconductor

A leading fabless provider of high-performance, radio frequency integrated circuits, or RFICs.

San Diego, California, United States

Manufacturer of Components

Metal-based Inkjet Inks for Printed Electronics

Dec 04, 2014 | Alexander Kamyshny, Joachim Steinke, Shlomo Magdassi

A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed....

Publisher: Hebrew University of Jerusalem

Hebrew University of Jerusalem

Israel's second-oldest university, the Hebrew University is the top university in Israel, overall the 59th-best university in the world.

Jerusalem, Israel

Training / Education

Preparation, Manufacturing Lead-Free Soldering Alloy

Nov 28, 2014 | Tarik Talib Issa, Asmaa Shawky Khalil

A soldering alloy composition Sn40-Bi60 has been manufactured by quenching method to achieve the both cast and wire shape. Differential scanning calorimetric (DSC) was done to study the melting behavior for a large portion of the alloy melts sharply at a approximately 136 C0 ,the melting point of Sn-Bi. X-Ray diffraction and optical microscopy were used to analyzed its microstructure characterization. The hardness of the alloys has been tested and find at a value 2 HRB as ductile form....

Publisher: University of Baghdad

University of Baghdad

The University of Baghdad (UOB) is the largest university in Iraq and the second largest Arab university.

Baghdad, Iraq

Training / Education

Effects of Packaging Materials on the Lifetime of LED Modules Under High Temperature Test

Nov 18, 2014 | Lei Nie, Wenjing Xiang - Hubei University of Technology, Mingxiang Chen, Huajing Li, Quan Chen - Huazhong University of Science and Technology

Performance degradation of packaging material is an important reason for the lifetime reduction of LED. In order to understanding the failure behavior of packaging material, silicone and phosphor were chosen to fabricate LED samples within which an aging test at 125℃ was performed. The result of online luminance measurement showed that LED samples with both silicone and phosphor had the highest luminance decay rate among all test samples because the carbonization of silicone and the consequent outgassing reduced the luminance quickly. The result of the luminance variance with test time was analyzed and an exponential decay model was developed with which the lifetime of LED under high temperature could be estimated....

Publisher: Hubei University of Technology

Hubei University of Technology

With a history of over 50 years, Hubei University of Technology (HBUT) is a provincial multi-discipline university, specializing in engineering.

Wuhan, China

Training / Education

Advanced Thermal Management Solutions on PCBs for High Power Applications

Nov 13, 2014 | Gregor Langer, Markus Leitgeb - Austria Technologie & Systemtechnik AG, Johann Nicolics, Michael Unger - Vienna University of Technology, Hans Hoschopf, Franz P. Wenzl - Joanneum Research Forschungsgesm.b.H.

With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology, particularly in the regime of high-power components, the temperature dependence of the long-term reliability is a critical parameter and has to be considered with highest possible care during the design phase (...)

The aim of this paper is to give a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs. Furthermore, attention will be turned on the development of copper filled thermal vias in thin board constructions......

Publisher: Tridonic GmbH & Co KG

Tridonic GmbH & Co KG

At Tridonic our daily quest is to create perfect light. 2,000 experts worldwide are working tirelessly to control, regulate and operate lighting in exactly the way you want it. And we have been doing this for more than 50 years.

Dornbirn, Austria

Other

Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes

Nov 06, 2014 | Hugh Roberts, Sven Lamprecht, Gustavo Ramos, Christian Sebald

This paper summarizes the results of recent investigations to examine the effect of electroless nickel process variations with respect to Pb-free (Sn-3.0Ag-0.5Cu) solder connections. These investigations included both ENIG and NiPd as surface finishes intended for second level interconnects in BGA applications. Process variations that are suspected to weaken solder joint reliability, including treatment time and pH, were used to achieve differences in nickel layer composition. Immersion gold deposits were also varied, but were directly dependent upon the plated nickel characteristics. In contrast to gold, different electroless palladium thicknesses were independently achieved by treatment time adjustments....

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

Solder Joint Reliability Under Realistic Service Conditions

Oct 30, 2014 | P. Borgesen, S. Hamasha, M. Obaidat, V. Raghavan, X. Dai; Department of Systems Science & Industrial Engineering, Binghamton University, M. Meilunas, M. Anselm; Universal Instruments Corporation.

The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly.

We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed...

Publisher: Universal Instruments

Universal Instruments

Provider of circuit, semiconductor, back-end assembly technologies and equipment, as well as integrated system solutions to manufacturers in various sectors of the electronics industry.

Conklin, New York, United States

Manufacturer of Assembly Equipment

5 Questions to Ask Before Choosing a New Cut and Strip Machine

Oct 27, 2014 | Pete Doyon, VP Product Management, Schleuniger, Inc.

A lot of time and effort often goes into finding the right equipment for your facility. Purchasing a new wire cut & strip machine is no different. With so many options, where does one start? Asking these five questions during the decision making process will help ensure you end up with equipment that fits all of your needs. ...

Publisher: Schleuniger, Inc.

Schleuniger, Inc.

Schleuniger, Inc. is a leading manufacturer of wire processing equipment. Our innovative automatic and semi-automatic machines are designed to cut, strip, crimp and mark all types of wire and cable.

Manchester, New Hampshire, United States

Manufacturer of Assembly Equipment

Combination of Spray and Soak Improves Cleaning under Bottom Terminations

Oct 23, 2014 | Dr. Mike Bixenman; Kyzen Corporation, Julie Fields; Technical Devices Company, Eric Camden; Foresite.

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...)

The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components...

Publisher: Kyzen Corporation

Kyzen Corporation

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Nashville, Tennessee, United States

Cleaning

per page.

Used PCBA Equipment

PCB Depaneling Systems