Feb 02, 2012

Nicolas Lietaer, Thor Bakke, Anand Summanwar (SINTEF), Per Dalsjø, Jakob Gakkestad (Norwegian Defence Research Establishment), Frank Niklaus (KTH – Royal Institute of Technology)

The Foundation for Scientific and Industrial Research - SINTEF

A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S...

Jan 26, 2012

Jonathan Friedman, Newton Truong, Mani B. Srivastava

UCLA - Networked & Embedded Systems Laboratory

In electronics design, Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet, a part has a third view, which CAD tools ignore – its supply data (Manufacturer part num...

Jan 19, 2012

Tsuneo TOKUMITSU

Sumitomo Electric Industries, Ltd.

The history of multilayered, three-dimensional monolithic microwave integrated circuit (3-D MMIC) technology is described here. Although significant researches were carried out in the second half of 1990’s, still there were many twists and turns before an...

Jan 12, 2012

Ronak Varia, Xuejun Fan

Lamar University - Department of Mechanical Engineering

In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi...

Jan 05, 2012

Greg Caswell

DfR Solutions

Conformal coating is applied to circuit cards to provide a dielectric layer on an electronic board. This layer functions as a membrane between the board and the environment. With this coating in place, the circuit card can withstand more moisture by incre...

Dec 29, 2011

Jim Hines, Adam Stanczak, David Decker, Theeraphong Kanjanupathum

Molex Inc.

2011 IPC APEX EXPO Conference Article: Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package miniaturization and densi...

Dec 22, 2011

Prawin, Paulraj , Paul, Brian K.

OSU School of Mechanical, Industrial, and Manufacturing Engineering (MIME)

This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate ch...

Dec 15, 2011

I.Zednickova, M.Biler, J.Petrzilek, T.Zednicek

AVX Corporation

manganese dioxide or conductive polymer cathode. Higher stability is achieved by placement of the capacitor into an SMD case filled by an inert atmosphere and hermetically sealed. The long term stability testing performed on such hermetically sealed capac...

Dec 08, 2011

Chrys Shea - Shea Engineering Services, Ray Whittier - Vicor Corporation

Shea Engineering Services

The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c...

Dec 01, 2011

Dr Ronald C. Lasky

Indium Corporation of America

Are electronics any “greener” than before RoHS? It is a fair question to ask. With the advent of RoHS on July 1, 2006, and more recently REACH, one might be inclined to answer that it is greener than it was. We will take a look at this question in several...