Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F
Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut
Electronics Forum | Wed Dec 13 10:24:52 EST 2000 | Wolfgang Busko
Hi Jack, I once tried this finish ( without changing any process parameters ) and encountered wetting problems even in the first reflow process. It was thought as cheaper alternative to Ni/Au we use for planarity reasons. Heard of the same problems
Electronics Forum | Fri Dec 01 15:37:50 EST 2000 | Dason C
Jim, you may need to look with different paste instead of the cleaning solvent. Please advise what is the paste which you currently using? Beside, when you talking about the board stayed in hot area, is it a drying area or the cleaning zone. If it
Electronics Forum | Thu Nov 02 03:42:49 EST 2000 | CHRIS MAY
Tombstoning primarily occurs due to the fact that the paste may melt and wet the metallized face of the chip earlier or better at one end than the other. This could be due to a difference in heat capacity (thermal shadowing ?) or that one end of your
Electronics Forum | Mon Nov 06 10:52:52 EST 2000 | Glen Mantych
Glenn, we have been fighting perhaps the identical problem for nearly a year on a 1mm pitch BGA, we have performed numerous laboratory analyses of defective joints and virgin parts in an effort to specifically identify the cause of the no-wet joints.
Electronics Forum | Tue Aug 22 14:52:55 EDT 2000 | John Thorup
Jax - absolutely right - the archives are a valuable tool and deserve to be used more than they seem to be. Caumel - Are your blobs on the solder side or the component side? Are your vias tented on the component side? What size are your vias? Is th
Electronics Forum | Thu Jul 27 13:59:04 EDT 2000 | Chrys Shea
Sounds like the problem is design realted - here's a cheesy trick if your product/process permits: (you know how I love my cheesey tricks!) Put an adhesive dot between the pins that are bridging. If you're gluing bottomside SMT components to the bo
Electronics Forum | Fri Jul 07 09:15:23 EDT 2000 | K. Chak
Hi Dave, This particular p/n calls for print&etch for wet process..and the problem occured due to surface contamin. with resist residue resisting copper from etching off. The high pressure nozzle was a problem at developing oper. and it is fixed now
Electronics Forum | Fri Jun 23 10:25:35 EDT 2000 | NLykus
Just started using VOC free no clean in a fully inerted wave. Have problem with one assembly with solder balling. This assembly is single sided mixed and solder mask is UV cured wet film. Other assemblies we build are L.P.I. solder mask and do exhib
Electronics Forum | Sun May 28 08:21:52 EDT 2000 | Sal
Can't agree more than moving over to Homebase apertures, But ensure that the cut back angle is correct,to acute of and angle will leave you with an inadequate contact area fot the terminations on the chip components and you will start seeing insuffic
