Electronics Forum | Sat Aug 26 09:40:27 EDT 2017 | v037022
Dear, My current method incluce steps below: 1. take out all screw 2. Put them into alcohol 3. Clean it with bemcot paper which wet by alcohol 4. Dry it by air gun 5. Checking by Dino camera. It took so much time. Now i want to do it automatic to red
Electronics Forum | Wed Mar 14 10:42:20 EDT 2018 | jon_roberts
Dave, thanks. I was going to change Cu/PD/Au to Ni/Pd/Au and then my question is: Has anyone had soldering issue with components (ICs) with the above finish during reflow and/or had to change the oven profile to improve the wetting. Sorry for confusi
Electronics Forum | Wed Mar 28 03:26:57 EDT 2018 | reckless
Thanks Rob, I bought it. Agreed its a good way to get my feet wet. By my math, it should do 1 10" board per minute. Too fast for even my dream production setup. So I may become a huge fan if it works. Not considering Nitrogen unless it doesnt wo
Electronics Forum | Sat Oct 06 16:51:24 EDT 2018 | reckless
Is there anything to watch out for when purchasing older AOI systems other than OS/Software? Specifically I am looking at older Mirtec/Marantz benchtop style units. I figure it's a good way to get my feet wet before going to a full inline system.
Electronics Forum | Mon Nov 26 13:40:40 EST 2018 | robl
Hi Prem, Yes, the flux in the Cobar paste helped with wetting and joint strength, as does reducing voids as there is more solder in the joint, as does cooling rate. Regarding peel test in KG, it depends on the pad size and volume of solder in the j
Electronics Forum | Sat Jan 12 11:47:25 EST 2019 | ranap121212
I am looking for a good material for selective nozzle. We are currently using Kovar but it is expensive and wears out it has very good wetting properties.I looking for a material or coating that would allow me to keep the binder flow and with less co
Electronics Forum | Mon Feb 25 12:52:47 EST 2019 | emeto
Solved it last week! Thank you all for your help. PRoy I wish you posted that earlier :) it would have saved us time and effort. We did extend the soak time(from 65s to 80seconds) in the reflow profile which resulted in a better wetting and stronger
Electronics Forum | Mon Feb 18 07:49:17 EST 2019 | SMTA-Joe
the tarnishing is happening across all the traces without solder even being applied. The PCB is soldered into the housing first. Once this is complete the traces have changed, and when it is time to solder the components to the traces this tarnishing
Electronics Forum | Fri Aug 23 02:29:16 EDT 2019 | sssamw
It seems because the soldering area is not enough, so the wetting force is small to hold the switch, remember >0.08g/mm2 for each part as in IPC standard. So, anyway, you need increase the soldering area to reduce weight/area number to below 0.08g
Electronics Forum | Thu Nov 07 10:07:02 EST 2019 | charliedci
Requesting help from anyone with experience in reflowing Te Connect, PN 1565917-4, 200 pin connecter. Pic attached. Cannot get all 200 pins to wet, main suspect is slight PCB warping during reflow. Have adjusted reflow profile. A 2.75 inch long SMT c
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