Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Wed Oct 20 07:09:12 EDT 2004 | mattkehoe
Not really. Our process is a solid solder deposition application so we are not placing components into the wet paste prior to reflow. We print the paste then reflow is without components, trying to create a meniscus which is then washed, flattened,
Electronics Forum | Sun Apr 10 03:25:35 EDT 2005 | Peter
Normally, some conformal coatings do not have very good wetting properties, that should be basic function of a good coating material (the same reqirement as avoid bubbles during coating process)! For UV curing conformal coatings, you can try Lackwe
Electronics Forum | Wed Apr 06 12:36:53 EDT 2005 | smt_rookie
I've tried a different lot of the same double header connector (yes its double level right angled header conector) twice but nothing has improved. I've also suspected that top row of the connector has greater heat sinking capacity (which should hold
Electronics Forum | Thu Apr 14 06:54:02 EDT 2005 | teera
hi! below are the item need to check: 1)top plate condition(under screen squeegee). 2)under screen clean contact position(with stencil) 3)make sure the thickness of wiper paper not so thick(not over 6o gm)becaue it will effect the vacuum suction. 4)s
Electronics Forum | Tue May 24 19:35:36 EDT 2005 | davef
Certainly, most often, the focus of pot analysis is directed at controlling impurities. Maintaining proper level of tin is important, also. When the portion of tin decreases: * Liquidous temperature increases. * Ability to wet decreases. * Solder c
Electronics Forum | Thu Jun 16 10:30:35 EDT 2005 | clampron
Good Morning Everyone, We have had an issue with a specific board house on a job that has bright tin plating. At one point, a lot recieved proved to be unsolderable. The plating looked OK but no wetting would occur at reflow. We hagled with the boar
Electronics Forum | Fri Aug 12 21:12:34 EDT 2005 | fctassembly
Hello Pete, I am not aware of any Wave solder machine manufacturer selling new pots from SS without being "LF compatible". Who would buy it now?? Also, machine warranties generally are no longer than 1 year anyway so all existing machines over 1 year
Electronics Forum | Thu Oct 06 09:11:14 EDT 2005 | russ
We use a diffrent colored traveller to identify the pbfree vs. other if you will. During our First article inspections we verify that the correct solder is being used per documentation and that the correct traveller is being used for that build. As
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