Electronics Forum | Mon Sep 17 02:56:40 EDT 2001 | mugen
Hi, (me been absent for some time...) Are your brds confirmed HAL over copper? (check out what Dave F mentioned abt possible root causes) or are the brds HAL over nickle? (shd be no problem here, if so?) or are the brds strictly nickle plated pads?
Electronics Forum | Thu Oct 17 21:32:28 EDT 2002 | davef
Please help to clairify the problem. Are we talking: * A pre-reflow [placement] problem? * A post-reflow [solder wetting] problem? Is the wetting issue that you mention related to the board or to the component? Please give us a little more detail
Electronics Forum | Mon Mar 07 20:27:07 EST 2005 | KEN
Oh silver and its...improved solderability over tin / copper. BS if you ask me. Look to your flux and thermal profile for wetting spread. Ask yourself just how much "wetting spread" do you need to fill a barrel? I have the same 100% barrel fill
Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
Electronics Forum | Fri Sep 08 11:29:40 EDT 2006 | GPP
James, What type of profile are you using. Ramp-to-Spike, Ramp-Short Soak-Spike, or Long-Low Spike? I had a similar problem in a past life - random skews on chip components - and got rid of it by converting to Ramp-to-Spike (the old profile was R
Electronics Forum | Wed Oct 04 10:18:51 EDT 2006 | greg york
Now seen the Blow Holes and shallow inverted and non wetting problem an aweful lot over here. Over came the Blow Holes and shallow inverted joints by washing the bare PCB with hot Saponifier then rinse and dry = problem dissapears. Think most PCB ven
Electronics Forum | Thu Jan 25 04:55:08 EST 2007 | greg york
Strange as we have had huge problems with Silver in Many different Assembly houses. Mainly with Nitric Acid based Silvers causing blow holes, non wetting and even the Nitric etching away the tracks on fine boards. It has been one of the main problem
Electronics Forum | Fri Feb 02 12:37:16 EST 2007 | Derek W
We've had the same issues with silver. We also ran into shelf life issues but that's specific to our business. We've moved to ENIG with good success, our board vendors were also very happy to move away from silver though I'm not sure why. As long as
Electronics Forum | Fri Jun 22 11:09:01 EDT 2007 | realchunks
Sup G! Normally when spray fluxers get neglected, the spray pattern is the first thing affected. To actually 'see' this, we cut out a piece of cardboard the same size and length of the board. Run it over the fluxer and then turn itover and look at
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
