Electronics Forum | Fri Apr 13 07:25:06 EDT 2007 | davef
Your paste should meet the mid-point of outside lead bend. If you cannot meet that, IPC-A-610D, 8.2.5.6 defines the minimum. We agree that it gets confusing when you post multiple threads on the same or very similar topic.
Electronics Forum | Tue May 03 20:01:24 EDT 2011 | city4497s
It a recent occurance and it happen randomly on other area. I'm using senju M705-GRN360-KV and Indium SMQ 90 Leadfree solder paste, we have been using both paste for 4~5 years. We have asked the oven supplier to perform maintenance and inspection, pr
Electronics Forum | Thu May 05 01:21:42 EDT 2011 | city4497s
Hi Davef The problem shows up on * random location including component pads * all PCB and different PCB supplier * different solder paste lot * both printing and dispensing process * all production shift * we have only 1 production line It black,
Electronics Forum | Wed Nov 06 03:51:28 EST 2013 | cuperpeter
Hi rob, Thank you very much for your response. Profiling was made exactly on the pad, which showed dewetting, so the values are mentioned for this pad. PCB's is about a week old. It is possible that the surface of pads is already oxidized? I will t
Electronics Forum | Tue Aug 28 16:07:09 EDT 2001 | slthomas
Just talked to my component engineer. We use the B parts also, and apparently the B suffix indicates compatibility with wave or reflow applications, X is for reflow only. Since we only reflow these parts, sounds like that might be the best route fo
Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan
Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts
Electronics Forum | Thu May 09 11:59:34 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu May 09 12:00:32 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu May 09 15:30:57 EDT 2002 | TomN
I'd be a more than a little cautious about doing this. Had a somewhat different application once and found out that as the solution was cleaning/etching the surface, it also leached (thru the lead frame) into the body of the part. What we thought w
Electronics Forum | Thu Nov 07 09:56:26 EST 2002 | bpan
Thanks for the ideas guys. My QC inspector can take a pick and move the back part of the lead....even though the front of the lead is soldered enough to hold. There is SOME NOT ALL areas where there is no solder on the curved portion of the lead.The
