Electronics Forum | Tue Apr 24 12:44:11 EDT 2001 | Steve
Take a look at J-STD-003, Solderability Tests for Printed Boards. This may help you create a procedure.
Electronics Forum | Wed May 18 19:12:26 EDT 2005 | HOSS
Hello, Assuming that your dwell and coverage at the wave are in order..... Have you checked the angle and pressure of your fluxer air knife? You can only count on capilary action to a point. The air knife, set correctly, will help get your flux t
Electronics Forum | Thu May 19 12:50:19 EDT 2005 | splice1
Hi Hoss, Thanks for your reply. Yes I am seeing the flux flood over to the top surface of my board, so to an extent I am not concerned with the fluxer. I believ that the foam fluxer is functioning adequately.
Electronics Forum | Fri May 20 08:15:21 EDT 2005 | davef
better" doesn't make sense. Additionally with no preheat, primary side components see a large delta T when they hit the wave.
Electronics Forum | Wed May 14 13:45:05 EDT 2008 | realchunks
Aaaah, I didn't know you washed in between. Sounds like you solved your own question.
Electronics Forum | Mon May 12 17:59:55 EDT 2008 | rgduval
We're currently experiencing a spate of solder not wetting to pads of PCBs, and it's becoming more aggravating on a daily basis. At this point, we're running out of ideas. I've searched the Fine Archives for information, and, so far, haven't found
Electronics Forum | Thu May 19 21:53:07 EDT 2005 | KEN
Is it possible your board is warping and skip plating? Have you run a lev-check? What does your contact patch look like? Do you have ice cikles (spelling???) or solder "flags". IF yes, your flux is consumed or nonexistant. What is your dwell time
Electronics Forum | Tue May 13 09:58:50 EDT 2008 | rgduval
Thanks, Dave, To the 183 TAL...I was just referencing a previous post I found in the archives. We checked the profile on the board this morning, absed on the temp info that AIM recommended, and found that we're above liquidous for nearly 2 minutes!
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
Electronics Forum | Tue May 13 08:26:29 EDT 2008 | davef
First, on your reflow temperature comment: The 183*C focus for reflow recipes for tin-lead solder is a falicy. If you held a recipe for tin-lead solder at 183*C peak, it would never reflow. Recipes for tin-lead solder need to be at liquidus plus 20*C
