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 Jun 8, 2007 |
... wave almost splashing solder on the solderable side of the components and pads. Or can be done with a jet wave (thin solder fountain) so the component body sits in air instead of massive metal. Or with a single omega wave (back and forward moving plate in front of the wave) creating enough force and vibration to reach the component solderable sides. Or with a rotating octangle (smart wave) in the front of the main wave creating turbulence and vibrating pressure in the front of the wave. Double ...
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May 7, 2004 |
Wave soldering profiling I will try that next. I did speed up the wave pump motor with a larger pully(20% more speed) This was done at the time to try to increase the size of the wave because I had component leeds touching the wave pot as they passed by. Due to the wave hight being so small. After I cleaned up the solder pot and wave pump impellers though the wave hieght increased dramaticly. And now perhaps the wave is flowing too fast. I will go back to the original pully and that should slow ...
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Oct 11, 1999 |
... wave or use selective soldering pallet's, sometime's both. | Your 'fix' of speeding up the belt and turning off the chip wave really aint the answer, by speeding up the belt your changing the time in the wave which is a critical one for the flux and for the components. Your peel back effect on the wave exit mightt not be as robust as it could be which is going to lead to short's depending on what's on the bottomside of the board. The chip wave should be helping get the little joit's that your ...
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Nov 17, 2005 |
... bridge after Wave solder machine With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT23's, and all SMD's in the "correct" orientation whereby both pads and terminations are hitting the wave at the same time, hence no shadowing of your SMT devices, you may be able to do without a chip wave. Sometimes ...
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Jul 22, 2004 |
... Wave Soldering Notes from an AIM No-Lead Presentation ... Wave Soldering * May require a higher pot temperature than tin/lead: 255-265*C * May require a change in liquid fluxes to compensate for the poor wetting of some alloys and high thermal stresses of the wave process. * Makes OSP a bad choice for wave soldered boards. Solder Maintenance * Certain lead-free alloys, such as Sn/Cu, suffer from high copper dissolution rates. * Unfortunately, whether Sn/Cu or Sn/Ag/Cu is implemented for wave ...
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Jun 23, 2000 |
... Grab hot board from other end of wave (key word here is HOT) and use the profile generated from your profiler software to make adjustments to your wave so you meet the flux vendors data sheet. It may take a couple of passes through the machine with the profiler, but you should be able to meet the data sheet within a day, depending on your experience and profiler. 6. Set-up the wave portion of your wave until you have good contact between your board and wave(s). Next run the board and profiler ...
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Jun 23, 2000 |
... Grab hot board from other end of wave (key word here is HOT) and use the profile generated from your profiler software to make adjustments to your wave so you meet the flux vendors data sheet. It may take a couple of passes through the machine with the profiler, but you should be able to meet the data sheet within a day, depending on your experience and profiler. 6. Set-up the wave portion of your wave until you have good contact between your board and wave(s). Next run the board and profiler ...
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Jun 21, 1999 |
... Solder wave contact time and area must be assured as specified for a particular board type. Usually, using a Lev-Check glass plate, I set the contact area between 1.5 and 2.5 inches assuring paralellism across the plate. The contact time should be between 2-3 seconds and the board should be immersed in the wave not more than 50% of its thickness. Don't forget board angle over the wave at about 7-10 degrees depending on requirements. This may vary for selective wave pallets. | | If all else comes ...
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Jun 17, 1999 |
... Solder wave contact time and area must be assured as specified for a particular board type. Usually, using a Lev-Check glass plate, I set the contact area between 1.5 and 2.5 inches assuring paralellism across the plate. The contact time should be between 2-3 seconds and the board should be immersed in the wave not more than 50% of its thickness. Don't forget board angle over the wave at about 7-10 degrees depending on requirements. This may vary for selective wave pallets. | | If all else comes ...
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Jun 17, 1999 |
... Solder wave contact time and area must be assured as specified for a particular board type. Usually, using a Lev-Check glass plate, I set the contact area between 1.5 and 2.5 inches assuring paralellism across the plate. The contact time should be between 2-3 seconds and the board should be immersed in the wave not more than 50% of its thickness. Don't forget board angle over the wave at about 7-10 degrees depending on requirements. This may vary for selective wave pallets. | | | | If all else ...
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Sep 6, 2007 |
... during wave soldering Hi Joris - There is an excellent wave solder guide called "Take No Prisoners" that includes instructions for attacking and eliminating solder balls and preventing their recurrence: 1. Increase Dwell Time Solder balls are normally caused by too much flux solvent still on the board when it hits the solder wave, causing tiny explosions as the solvent vaporizes when it comes in contact with solder. One cure can be to increase your dwell time, to give your wave more time to ...
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Feb 5, 2000 |
... wave elimination Hany: In response to your questions: 1- In a double wave solder M/C, is possible to completely eliminate the second wave without affecting the quality of the solder joints? Many w/s machines have a turbulent wave and a smooth wave. The turbulent wave is closer to the fluxer. The smooth wave is closer to the exit conveyor. � Narrow turbulent wave wets all connections. � Wide smooth wave forms fillets and removes excess solder. Generally, people use their turbulent wave on ...
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Jul 17, 2008 |
... solder temperature & dwell time * The most extensive study ever conducted on wave solder process control, involving 384 wave machines worldwide, found 76% of all wave machines running boards disparallel through the solder wave. 84% of the plants that corrected their disparallelism problem reported what they condsidered significant improvement in board quality the day the correction was made. [New Frontiers in Wave Solder Optimization: Daily Measurement of Parallelism Will Transform Your Board ...
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Jun 17, 1999 |
... Solder wave contact time and area must be assured as specified for a particular board type. Usually, using a Lev-Check glass plate, I set the contact area between 1.5 and 2.5 inches assuring paralellism across the plate. The contact time should be between 2-3 seconds and the board should be immersed in the wave not more than 50% of its thickness. Don't forget board angle over the wave at about 7-10 degrees depending on requirements. This may vary for selective wave pallets. | | If all else comes ...
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Jun 17, 1999 |
... Solder wave contact time and area must be assured as specified for a particular board type. Usually, using a Lev-Check glass plate, I set the contact area between 1.5 and 2.5 inches assuring paralellism across the plate. The contact time should be between 2-3 seconds and the board should be immersed in the wave not more than 50% of its thickness. Don't forget board angle over the wave at about 7-10 degrees depending on requirements. This may vary for selective wave pallets. If all else comes ...
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Jan 4, 1999 |
... a table that corresponds to your wave contact number. Regardless of the actual shape of your wave. I think it was a after-thought feature to compete with the Wave Optimizer, which does a real immersion depth reading. In any case, DOE's have shown that immersion depth (1/3 to 2/3 of the board) has the least impact of any variable in wave soldering - contact length is the key. Several years ago I evaluated process control toys for wave soldering. The best I found was the Malcolm Dip Tester. I ...
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May 9, 2001 |
... could be made more reliable by decreasing the pad size. Wave soldering puts a tremendous amount of solder, relative to reflowed connections, on each end of the ceramic chunks that comprise SMT resistors and capacitors. Wave soldering puts more solder on these connections for two reasons: 1 There is more solder available to form the connection in wave soldering than reflow soldering. 2 Components are stood-off the board more in wave soldering than reflow soldering as a result of using adhesives ...
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Aug 28, 2009 |
PCB residue after wave solder I had seen such effect caused by the wave itself, where the exposed wave surface was coated by a thin dull oxide layer which then adhered to the bottom side of PCB during wave soldering. You could verify if the wave surface is clean metal when the PCB contacts the wave. During wave soldering, the leading board edge should push out this oxidized surface layer to allow clean metal exposure to PCB ...
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Dec 17, 2007 |
wave soldering and solder bridge 5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to http://www.WaveSoldering.com/WSO/Parallelism.htm. Remember, you must establish parallelism from -0.2 seconds to +0.2 seconds based ...
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Oct 18, 2002 |
... IPC 782 and 770 have some useful info regarding mounting and pad geometries for wave etc... Since I do not know what type of components you will be wave soldering I will just give you some input on things I have learned. Orient all chip parts perpendicular to the wave, extend length of pad .2mm or so and reduction in width is sometimes beneficial SOIC packages should be mounted with the leads perpendicular to wave with solder thieving pads at the trailing edge. Make sure that the height of ...
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Dec 11, 2006 |
... WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic products is quickly approaching. To meet the challenges of lead-free soldering, a method to evaluate the performance of lead-free wave solder fluxes will be explored. Identifying the optimal water-soluble and no-clean chemistries is the objective of this testing. Existing wave solder ...
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Jun 17, 1999 |
... Solder wave contact time and area must be assured as specified for a particular board type. Usually, using a Lev-Check glass plate, I set the contact area between 1.5 and 2.5 inches assuring paralellism across the plate. The contact time should be between 2-3 seconds and the board should be immersed in the wave not more than 50% of its thickness. Don't forget board angle over the wave at about 7-10 degrees depending on requirements. This may vary for selective wave pallets. | | | | If all else ...
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Oct 10, 1999 |
... fix' of speeding up the belt and turning off the chip wave really aint the answer, by speeding up the belt your changing the time in the wave which is a critical one for the flux and for the components. Your peel back effect on the wave exit mightt not be as robust as it could be which is going to lead to short's depending on what's on the bottomside of the board. The chip wave should be helping get the little joit's that your smooth wave will skip if your running too fast through it. best ...
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Jan 5, 2005 |
Lead Free Wave Soldering Hi, Now in my wave the PCB TOP Side temperature before WAVE is 110 - 115 DegC and the Peak temp in the wave is 240 - 245. These informations are for an 63/37 Alloy. What is the PCB TOP Side temperature and the peak temperature for Lead Free Wave Sn/Ag/Cu 217DegC ? Thanks Frank
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Dec 10, 2008 |
Barrel fill with Pb Free Wave Solder Oops...just noticed you were referring to wave soldering. We'd still suggest a water-soluble flux, instead of the no-clean; especially at wave soldering. Also, checking pre-heat temps, and dwell time on the pot. Is the wave a chipper wave? If not, is this option available? I've experienced solder fill issues in the past with leaded solder, and the fix was to run the board with the chipper wave, as the turbulence helped to avoid any potential shadowing issues ...
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May 21, 2008 |
... Wave Parameters Good morning gentlemen, I could use some advise as to the min / max windows for the wave process. We have had little problems with our leaded wave but when applying the same process to lead-free wave we are having problems. Obvisouly the temps are hotter, but the real issue is the process windows are so much tighter. SO i believe our leaded wave is riding towards the edges of the wide process window but still OK. However when we applied these same ideas to the leaded wave we are ...
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Jan 15, 2007 |
Wave Cassettes and Heat convection So others can solder the same board and part but you can't. Dipping the legs in flux doesn't help. Then it's either your pre-heat or wave. Measure your pre-heat and compare to others or flux mfger. Do you have chip wave or something like an Omega wave found on them Electrovert machines? Also, what is a "selective wave solder cassette"? Are you running boards thru a wave solder machine just for the pre-heat and then selective soldering? If so, it probably is you ...
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Nov 7, 2005 |
Wave soldering after SMD assembling 6 deg is std angle. Some machines have option to adjust angle from 5 to 7. Maybe yours does. If you have an Electrovert wave machine you can get the Omega option. This option vibrates the wave to reduce surface tension. It does a nice job on rectangular chips, MELFs and SOTs. I think some other wave machine mfrs. have a similar option, I think Soltec calls it a Dancer. Turbulent Chip waves also reduce shadowing. Electrovert also has a Rotary Chip wave where an ...
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Feb 28, 2005 |
Solder in wave soldering: Which one is the best? This sounds a lot like a profile that is killing flux activity prior to wave immersion. What is your topside preheat temp just prior to hitting the wave? What type of preheat do you have, convection or radiant? Are you using a chip/turbulent wave in addition to the laminar flow wave? What is your dwell time on the wave(s)? How thick is your board? What is the lead to hole ratio for the problem areas? What is your conveyor angle? How is the flow ...
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May 6, 2004 |
Wave soldering profiling Here is some more info with regarding my Wave. 1. PCB .065" thick 2. leed length .20" (.135" protrution) I know this is high but we use many thousands and cutting each is not practical. 3. no clean flux by way of foam fluxer 4. wave machine is a HOLLIS eng. +/-20y old (but does work well) This machine has been sitting for a while and did not have a well performing wave, as in hieght and flow. I took the wave and pump apart, cleaned and once back together performed like ...
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Feb 20, 2004 |
... wave is a 50/50 flow off of the front and back. We use laminar flow waves with a flow of 90-95% front flow and back flow only very slightly present that can be stopped by just touching the solder. Or backflow only when the board is actually rding over the wave. Your pre-heat is not critical here since these little chip parts when they hit the wave are going to be at solder temp in a very short time. pre-heat is used to activate flux and prevent thermal shock when the assembly hits the wave along ...
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Feb 19, 2004 |
... the wave. Look here, but shield your eyes first: [ http://www.thepdfshop.co.uk/ppm/defects/Wave/asp/50.asp ] [A respectful bow to BW for the pix] Could you tell us more about: * Board direction through the wave [relative to the problem bulbousity] * Component type, primary /secondary side, leads relative to wave, etc * Conveyor angle, flux, solder alloy, direction of solder flow on the wave surface ...
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Jun 11, 2003 |
Wave soldering profiling Frank, ECD (WaveRIDER) and Datapaq (Optimiser) have wave solder machine process control devices. They will check the following: 1. Conveyor speed 2. Preheat Temps 3. Solder Temps 4. Wave Dwell/Contact Times 5. Wave Heights 6. Waves Parallelism Go to http://www.ecd.com or www.datapaq.com If your profiler is an ECD SMG, the investment for their wave machine gizmo is shorter money than DQ. Happy waving ...
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Jun 11, 2003 |
Wave soldering profiling Frank-In addition (Dave gave some good scoop) we use a Pyrex Glass board to run through the wave. This is useful as you can see through the board .....you can watch the flux coverage, preheat, and Wave (be it Chip, lamda, or??) as it goes through the process. I like it for the Wave part as it allows you to see how parallel the board is to the wave. Lastly, I do not know what type of flux application station you are using but if it is not a sealed pressurized unit you may ...
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Oct 15, 2001 |
Through-hole/SM mix Before this wave solder pallet salesman blather gets too far out-of-control, let�s stop for a minute. The three major approaches you have are: 1 SELECTIVE SOLDERING: Using: * Specialty wave soldering machine to solder specific areas of a board * Peculiar wave solder pallet on a standard wave solder machine to allow soldering specific areas, while block other areas from contact with the wave. 2 INTRUSIVE REFLOW: Using: * Paste printed on PTH pads and then reflow soldered ...
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Nov 17, 1998 |
Problems with wave solder For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder and SM infra red reflow. Wave preheat is 95C, Reflow is 150C plateau, 230C peak with 60s above 183C (Solder liquidus). These are not new boards and whilst they have a lot of cut outs we have been processing them for many years ...
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Jan 4, 1999 |
... looked up in a table that corresponds to your wave contact number. Regardless of the actual shape of your wave. I think it was a after-thought feature to compete with the Wave Optimizer, which does a real immersion depth reading. In any case, DOE's have shown that immersion depth (1/3 to 2/3 of the board) has the least impact of any variable in wave soldering - contact length is the key. | | Several years ago I evaluated process control toys for wave soldering. The best I found was the Malcolm ...
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Apr 28, 2000 |
Wave Soldering No-Clean Bottom-Side SMT We have had nsome new products come in that require Bottom side wave soldering (SMT). I have SOIC's 1206, 0805 that are Glued then Wave soldered. I have had trouble with bridging and no-clean residue with these pcbs. I have a Econopak 2 SMT two zone with Chipwave(Turbulent) and Lamda Wave. I use the Lamda and Turbulent when running bottom smt. How do I profile with the Turbulent wave should I burn off all of the Flux before the Turbulent or before the ...
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Apr 22, 2009 |
PB-Free Wave Soldering Service Provider Quick Question! We have an assembly that we're building for a customer that will have to be soldered via a Lead-Free Wave Solder. We do not currently have a Lead-Free Wave Solder in house. Does anyone know of a company that may be able to provide this service at a reasonable rate? It's 45 pieces. And the assemblies would be provided built complete, holes masked, they would only need to be Wave Soldered, and inspected. (Looking to have solder joints only ...
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Feb 15, 2006 |
... for Wave solder (defects on PCB's) Russ, On both instruments, I ran them through the wave 20 times each using identical profiles and wave parameters, and then used statistical formulas to measure the variation and repeatability of each. I had these all in Excel, but that was around 1999.I'll try dig this up somewhere... The parameters which I felt were worth measuring were: 1.) Dwell Time 2.) Contact Length 3.) Parallilism 4.) Delta T (temp delta before the last pre-heat and chip wave) 5 ...
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Apr 14, 2004 |
Wave soldering profiling Just a thought.... Some Fluxes require temperatures upto 260F (127C). Are you using water based flux or solvent (alcohol). I have noticed that many wave machines are NOT capable of preheating adequately when using water based materials. This can be compounded with selective pallets. Wave dwell can be limited by flux selection. NC flux tend to have shorter dewll times (2-3 sec) where as OA's can survive out to 4+ seconds. Is your flux dual wave capable. Low/Ultra-low ...
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May 25, 2009 |
solder skips in chip wave on a NU/ERA wave solder Hello !! I have a problem with my wave solder oven, in one of the products we made has connectors on one side of the pcb and in the other one has SMT components the process is kinda tricky on the SMT components we use an adhesive and put to the reflow oven to cure,after that we put the connectors on the opposite side of the SMT components, then is taken to the wave solder where we use the chip wave and solder wave to solder the components and the ...
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Dec 4, 2007 |
Epoxy on bottom of SMT component Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in reflow? A: Yes, but somebody here don't agree with me that the glued part need help from wave to get the good wetting. They are wrong. The only good reason you should be gluing parts on is because you want to solder them with the wave or if you are doing double-sided reflow and you have heavy parts that would fall off on the second pass. In your case ...
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Sep 22, 1998 |
... then you gotta look at the process. The chip wave is meant to splash solder everywhere to eliminate skips. So, if you're getting skips, turn the chip wave up. Now, a chip wave alone would create a bazillion shorts. The smooth wave, on the other hand, fills holes and debridges all the skips made by the chip wave. Without a debridging knife, the height of the smooth wave is absolutely critical to eliminating shorts. The smoother the smooth wave is, the better the natural advantage of the surface ...
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Feb 3, 2000 |
Second wave elimination Hello there: Could anyone help: 1- In a double wave wave solder M/C, is possible to completely eliminate the second wave without affecting the quality of the solder joints? 2-From a quality control prespective, what is the minimum accepted length of DIP component leads on the the solder side after wave soldering? 3-Is there any technical reference or quality standards for the PCB assemblies curvature after wave soldering? Hany
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Feb 21, 2007 |
Wave Soldering Process Restrictions Ideally? Never. You risk component break down by re-running the board over the wave machine. In a perfect world, your wave operator would make adjustments after one run, and you'd run another panel over the wave to judge the effectiveness of the adjustments. Besides, the solder presence from the first run may skew your results in the second run. Functionally, of course, we've done this with regular thru-hole assemblies. I don't glue/wave anything currently ...
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Jan 24, 2003 |
Wave Soldering - Icicling/Bridges I am not familiar with your flux but with no-cleans (which I use) the primary cause of icicling is the amount of flux solids left on the board prior to wave and how long the board is in the wave (2.5 to 3.5 seconds should be OK). The amount of flux solids left on the board prior to the wave can vary depending on the amount of flux that was applied during fluxing or how much if any was burnt off prior to the wave due to excess board temperature. With a foam ...
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Apr 27, 1999 |
... been wave soldering these for a while with no problems, trick is to slightly enlarge the lad's a bit so there is no chance of shadowing either with the fluxer or the wave. | | good luck | My 2 cents: Can you wave them? Yes. Do you want to wave them? Not if you can help it. Depends on the process - got a good active chip wave? Good fluxes? Good adhesive and dispensing process? Depends on the design - got good six-sided terminations on the component? Got a footprint for wave soldering with bigger ...
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Oct 11, 1999 |
... from the heat at wave or use selective soldering pallet's, sometime's both. | Your 'fix' of speeding up the belt and turning off the chip wave really aint the answer, by speeding up the belt your changing the time in the wave which is a critical one for the flux and for the components. Your peel back effect on the wave exit mightt not be as robust as it could be which is going to lead to short's depending on what's on the bottomside of the board. The chip wave should be helping get the little ...
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Mar 12, 2002 |
Wave Soldering with or w/o Nitrogen I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Optimizing the Wave Soldering Process with Hot Nitrogen Knives" Chrys Shea, Siemens, & Gary Shipe, Air Products In the SMTA Knowledgebase look for: �Inerting The Wave Soldering Process With Membrane-Generated Nitrogen ...
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