Electronics Forum: tack force (Page 1 of 2)

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 09:28:24 EDT 2001 | blnorman

You can test for solder paste tack using IPC-TM-650 method 2.4.44. This will give you an idea of the adhesive strength of your paste prior to reflow.

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef

We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which

Re: BGA Bouble sided reflow overlapping

Electronics Forum | Tue Jan 11 11:14:09 EST 2000 | Wolfgang Busko

What a challenge! I think it all depends on the equipment used. Seems rereflow of BGA isn�t that good (see the advices for wavesoldering BGA populated boards). Although you might check for the tacking force by sending a sample BGA board head over thr

expired solder paste

Electronics Forum | Thu Apr 03 22:56:48 EDT 2008 | davef

Potential impacts of using expired solder paste are [University of Bolton]: * Changed paste rheology. Result: poor print quality * Loss of solvents. Result: reduced flux activity * Changed flux formulation. Result: More difficult to clean flux residu

I need to reduce costs on solder paste wasted

Electronics Forum | Tue Jul 19 09:18:14 EDT 2011 | davef

Could this be an opportunity to explore the use of cartridge-type paste dispensers? Or maybe a reason to keep working over the weekend. * Re-Storing & Re-Using “Used” Solder Paste. Though not a recommended practice, used solder paste from the stenci

Simultaneously Double side reflow

Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef

Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The

Homeplate design

Electronics Forum | Wed Jul 25 11:55:21 EDT 2007 | ck_the_flip

Zoinks!! Doing the homeplate design on 0402 will actually make your tombstones WORSE! Think about it. Your wetting forces are now on the ENDS of the device with no solder paste toward the middle of the device to tack the part down - a gauranteed f

Large component count board

Electronics Forum | Fri Aug 03 17:21:03 EDT 2012 | kmots15

We will be running a very large board with 62k+ components on it in the coming week. Has anyone run boards with this qty before? For sanity sake I had to split up the board into 12 individual programs. We will be forced to run it on a My12 due to

Solder Paste Evaluation

Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef

We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste

How to choose a new solder paste

Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef

Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly

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