Electronics Forum | Thu Nov 03 21:40:40 EST 2005 | davef
There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it's organic, p
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Thu Jan 19 16:25:03 EST 2006 | solderiron
Any metalurgists out there? I take the resistance value of a metal oxide substrate made of silver or gold or manganese. I then solder with 63/37 and the resistance changes but not dramatically. I then solder with Lead free SAC305 and the resistance c
Electronics Forum | Tue May 16 11:53:39 EDT 2006 | Ajay
Hi, I am having trouble with outgasing voids on my solder bumps.Substrate is Cu with electrolytic Au on it.Sometimes I use electrolytic Ni beneath Au.I am doing laser soldering so this process is fluxless.Its been observed that Ni is helping in redu
Electronics Forum | Wed Aug 02 15:35:46 EDT 2006 | solderiron
Be careful and review the MSDS sheets on any dross inhibitor reducer etc. Most are extremely hazardous. We offer a product that is not hazardous it melts at pot temp. forms an oily substrate, removes the good solder from the dross. Also can be used a
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Electronics Forum | Mon Dec 29 07:23:57 EST 2008 | ghenning
Watch out for workmanship specs. I don't believe this is covered under IPC-A-610. You may have to write your own. Alignment of the fixture and coplanarity of the bar and substrate are key. Also, pay close attention to stencil aperture and thicknes
Electronics Forum | Tue Mar 31 08:11:51 EDT 2009 | davef
Solder ball formation can be a significant problem if the balls get trapped in the smaller spaces between ceramic chip carriers and substrates or possibly between the leads of small pitch leaded ICs. The solder balls also reduce the solder volume ava
Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal
In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,
Electronics Forum | Wed Nov 04 03:33:04 EST 2009 | valeo
Hi Davef, I have already checked the SMTnet archives but unfortunetly I didn't find answers regarding mechanical behviour specifications of component glued on substrat. This king of soldering process is new for us. For example, the specification f
