Order by: Relevancy | Date
Jul 7, 2017 | -7mil, -10.2mil. I'm looking for a machine that I can zoom in to the edge of a feature than determine the distance to the next substrate. P&P doesn't zoom in enough. Tony
Feb 1, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing Hi Joshua, No, the adhesive lasts 2 or 3 runs. The adhesive is put on manually as is the kapton. It's a big panel for a flex - nearly 300 x 210, so the operator loading the boards onto the pallet and fixing them (then into a buffer) stays
Jan 31, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing Dispensing: You can dispense for 0201 and above Warped laminates: Ask your laminate fabricator what's ausing the warping and how to make it go away
Jan 31, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing Hi Rob, So do you have to constantly remove the old adhesive and spray on new ones? Is that an automated process? Also for the kapton tape removal and application, is that automated as well?
Jan 31, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing Hi Joshua, We ran 150K per week this way, you just need a lot of pallets. Regarding dispensing I've seen 0201 (Imperial)paste dispensed, so about 0.4ish mm dots. I'm sure the Mydata printer is also pretty high resolution too, but not too
Jan 30, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing Looks like a similar product to magic resin. Thanks I'll check it out.
Jan 30, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing Tacsil is another product you might try.
Jan 30, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing I just assume when you have laminates that thin, it will invariably be warped in some degree. I have worked on a few and I have never seen one that is not warped consistently.
Jan 30, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing Thanks Rob. I'm not so sure in a mass production environment that using the mount spray and kapton tapes are going to be efficient. For solder paste dispensing, any idea what is the smallest solder dot size the machine can dispense?
Jan 30, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing so, why are your laminates warped? What needs to be done to correct that issue?
Jan 30, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing > Hi all, > > Am new to SMT here. > > I have a very > thin laminate substrate which around 120um > thickess. Being that thin, warpage is constantly > an issue for us. > > For the solder printing part, > ; we have a number of problems. > > Being so thin > and warped, we need to have a carrier to support > the substrate while it is being printed. Since it > needs to be totally flat when printed, we will > need to vacuum hold it down. > > The problem is > the substrate
Jan 27, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing Consider that printing may not be the only approach to getting paste on to your board. Would a dispenser work better?
Jan 26, 2017 | Very thin laminate substrate problem with solder printing Very thin laminate substrate problem with solder printing Hi all, Am new to SMT here. I have a very thin laminate substrate which around 120um thickess. Being that thin, warpage is constantly an issue for us. For the solder printing part, we have a number of problems. Being so thin and warped , we need to have a carrier to support the substrate while it is being printed. Since it needs to be totally flat when printed, we will need to vacuum hold it down. The problem is the substrate is so warped to begin with that vacuum can't hold it down unless we press the substrate down manually
Dec 14, 2016 | but when completing wire bonding and the wire bonds on pad and substrate, the pad will get out of the chip easily, so do you have ideas
May 6, 2014 | J STD 002 Test S source of ceramic substrate J STD 002 Test S source of ceramic substrate Most ceramic you'll see comes from Coors or Kyocera. Size of your substrate will vary according to the stencil / component that you're using. 3" by 3" should be sufficient for most applications. If you get them too small, you could have handling issues
May 5, 2014 | J STD 002 Test S source of ceramic substrate J STD 002 Test S source of ceramic substrate Hi, I was wondering if there is a preferred source of the .635mm ceramic substrate specified in the J STD 002 Test S and if there is what is the typical size folks are using (3" x 3"?). Thanks, Rich
Sep 7, 2012 | Camalot 1818 Array Hi I am using an old Camalot 1818 to dispense squares of epoxy on a substrate. Does anyone know if it is possible to do an array of squares across the entire substrate rather than individually entering the coordinates of each square? Thanks!
Aug 27, 2012 | no copper layer Board 2 -- 500 mil end substrate, unscored, no copper layer Board 3 -- 500 mil end substrate, unscored, top-side copper layer Board 4 -- 456 mil end substrate, unscored, top-side copper layer Board 5 -- no substrate Board 6 -- 350 mil end substrate, scored, disontinuous top-side copper layer Board 5 and 6 can be alleviated and some of the changes
May 21, 2012 | Assemby of flexible printed circuits Polymide is like a sponge and absorbs moisture much faster than rigid substrates. Pre-bake your substrate for 2-4 hours at 125C and perform your soldering within 1 shift thereafter or seal in moisture barrier bags.
Sep 24, 2009 | pbga substrate crack vision system pbga substrate crack vision system What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board
Sep 24, 2009 | pbga substrate crack vision system pbga substrate crack vision system Is there any vision system to check for substrate crack?
May 28, 2009 | ball pitch, solder ball size only the number of balls will change. We will use a new solder mask
Apr 29, 2008 | Board Warpage Hi, I am also facing the same probelm. I assembly a substrate with a thickness of 0.30mm and the board warp after reflow. If I bake the substrate at 125 Deg C for 2 hours will it help to solve this problem? Thanks
Mar 18, 2008 | Migration of copper during reflow process Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper migration to the solder joints and made the solder joints quite brittle. They request that we change the PBGA substrate finish to ENIG to prevent this ... Can anyone shed some light on this issue ... Thanks
Jan 21, 2008 | Cleaning procedure when WS609 flux is used We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Jan 18, 2008 | Cleaning procedure when WS609 flux is used Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Nov 30, 2007 | laser soldering If the goal is selective soldering (not to raise the substrate temperature too high), consider the use of microwaves. Our company has been working on this technology for selectively bonding substrates. For example, we use the process to bond ROHS metallizations bumps at far lower
Sep 11, 2007 | depending on the product. * Use steam to age the substrate in simulated shelf life conditions. In 24-96 hours, a shelf life period of more than one year could be simulated. * Reflow OSP substrates to reflow conditions used for solder paste reflow. * Send the substrates to your fabricator and ask them to strip the OSP. A silver nitrate test can be used to verify
Mar 12, 2007 | retention�. Using the recommended hole diameters from the vendors has resulted in problems with some connectors �popping� off the substrate during reflow due to marginal PCB material/construction and the differences in the coefficient of expansion. We have also observed the inability to place the component at all due to a tolerance accumulation/mismatch between the part and substrate. By the time we capture all possible linear/hole diameter tolerance variations the hole in the substrate becomes too large to serve any purpose relating to the advertised advantages. Based on these observations we
Mar 8, 2007 | Skewed components To be honest this product its only a part of bigger PCB, so we have only substrate with 3 FETs on it so no other components at substrate occurs and all substrate are staying at metal fixture. WE have already window pan aperture. WE producing this product for few years and problem with skewed parts starts occuring 2 months ago and its growing up. Tomorrow I m going to do some test at other oven in our company to ensure that oven its not generating this defect and hot stream air doesnt blow up out transistor from substrates.Maybe this is issue.
Feb 15, 2007 | Solder Printing 2x2 inch ceramic Substrate Solder Printing 2x2 inch ceramic Substrate Phil, I used to print solder paste on 2" X 2" and 3" X 3" 96% Alumina substrates all the time. I used standard solder printers and stencils. Screens are difficult to use and don't print well. You can use a stencil on a DeHart, CW Price, or AMI Presco thickfilm hybrid printer also. I used semi auto Dek 249, semi auto SMTech 100MV, and fully auto Dek 265 printers. I used a pallet to transport the small substrates on the Dek 265 conveyor. I believe my pallet was about 5" X 5". I used a vacuum box that mated with the pallet at time of print. Honestly
Feb 15, 2007 | Solder Printing 2x2 inch ceramic Substrate Solder Printing 2x2 inch ceramic Substrate Hi All, I was wondering if anyone has experience of printing solder paste on to 2x2" ceramic substrates.. At present we are using a very old de haart printer with a mesh emulsion screen.. I am looking to replace this with a more reliable modern
Feb 15, 2007 | SMT on Flexible circuits I didn't pose the question -- but have some: As the substrate is flexible -- how do you hold the flex substrate flat for paste application and then flat enough for larger (>1" long SMT components to be placed without coplanarity issues> Also, what types of finishes
Jan 18, 2007 | Uneven solder reflow "solder tends to pool on the short side of the substrate" Does the short side of the substrate have any significant difference in thermal mass? if so, try slowing the belt (within reason) or increasing temps (within reason) to better equalize thermal distribution. maybe
Jan 17, 2007 | Uneven solder reflow I'm trying to get an even solder coating onto a retangular shaped ceramic substrate (5.0mm x1.83mm), but the solder tends to pool on the short side of the substrate.
Mar 24, 2006 | pad board separation Lifted pads are almost always caused by pad to substrate adhesion likely degraded significantly after too much heat. Poorly trained operators armed with soldering irons can do this expertly.
Dec 29, 2005 | regular basis (on a Delvotec bonder). What the pull test results did you have when you tried to bond to ENIG? What the pull test results do you have now, when you bond to thick gold? We have chosen ENIG as a surface finish for our PCB substrates, because we have to both solder and wire bond chips to the substrates and ENIG seems to be suitable for this application and gives the lowest price of substrates. Are we alone in the universe?
Nov 3, 2005 | Wire bonding pull strength & substrate contamination Wire bonding pull strength & substrate contamination There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it
Nov 3, 2005 | Wire bonding pull strength & substrate contamination Wire bonding pull strength & substrate contamination We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull stregths wires break or separate during temp cycling. We are bondig with gold wire on gold pads. Laminate substrate is BN300. We are bonding immediately after plasma clean Surface analysis does not show any spikes other than Ni Ag
Nov 3, 2005 | Wire bonding pull strength & substrate contamination Wire bonding pull strength & substrate contamination Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface
Nov 3, 2005 | Wire bonding pull strength & substrate contamination Wire bonding pull strength & substrate contamination We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads , but we cannot maintain good bonds. Our normal plasma cleaning process does not seem to remove this residue. We have verifed our wire bonders and cleaning process and we can relate the issue to specific lot numbers from our laminate substrate supplier. Niether our supplier or us can put on a finger
Mar 29, 2005 | Solder joint strength IPC-TM-650 TEST METHODS MANUAL Number 18.104.22.168 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials by a perpendicular pull and force measurement. It is designed to test solderable metals on any type of substrate in a variety of surface mount land sizes. The surface finish shall be the same as the board it represents.
Mar 7, 2005 | Lead Free Substrate Lead Free Substrate It has been my experience that the standard Fr4 material (Tg 135c) will discolor when processed at the new higher temperatures required for the high tin alloys... We have been using the High Tg Fr4 (Tg 170c) for many years to ensure this does not happen....
Feb 24, 2005 | Lead Free Substrate Lead Free Substrate Here is an interesting article that supports T2s comments about Td: http://pcdandm.com/pcdmag/mag/0502/0502mcgrath.pdf
Feb 2, 2005 | Lead Free Substrate Lead Free Substrate I would call it conservative, but definitely recommended. It sort of depends on your assembly design. We have run 140 boards lead free but are now using the 170. Russ
Feb 2, 2005 | Lead Free Substrate Lead Free Substrate Some of the research on Lead Free I've done indicates that a pcb with a higher Tg (>170C) would be required for a lead free process. Can anyone comment on whether that is necessary or just conservative? Thanks John S
Sep 14, 2004 | BGA Solderability Standard USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. Reflow in oven with BGA profile 4. After reflow, remove the substrate and devices and allow them to cool down. After the devices cooled to room temperature, remove the the components from the ceramic substrate using tweezers. 5. Remove BGA device from ceramic plate and inspect solder BGA balls at 10X - 100X for solder
Aug 13, 2004 | Exactly. Also, excessive time at reflow really begins to stress the substrate and components as well.
Dec 12, 2003 | and the copper substrate pads are coated with OSP (Entech 106). Co-planarity of the component leads measure within 0.10mm. Identical components with full tin-plated leads or with bright-plated leads do not improve the situation. The only experiment that has worked oxidized the leads before screening and soldering perfectly. We are now trying to adjust the temperature profiles to reduce the heating of the component lead and/or increase the substrate temperature but these may only be 'band-aids'. Does anyone have any similar experiences with no-lead paste or can point to a root
Jun 25, 2003 | Plastic BGA mounted on Alumina substrate Plastic BGA mounted on Alumina substrate Hello everyone, my company produce Alumina PCB. Till now we mount ceramic BGA on alumina substrate, but now it's hard to find ceramic components so we'd like to mount plastic BGA on this kind of substrate. Do you know problems about it? Please, if you have