Electronics Forum | Thu Mar 22 16:52:10 EST 2001 | kaopsahl
Yes, there are adhesives designed just for stencil application. Usually plastic squeegee blades are recommended for best printing results. Plastic stencils are also available for this application. Both Alpha Metals and Loctite have articles on this s
Electronics Forum | Wed Jan 08 08:20:52 EST 2014 | emeto
To most of our boards I give 20-30% tolerance in both directions. From experience if you have big aperture on your stencil, the squeegee will scoop certain amount of paste from this aperture and you will see lower height. Depending on your board supp
Electronics Forum | Wed Oct 07 15:15:04 EDT 1998 | Joe P.
| I am currently experimenting with Pin-To-Paste reflow. does anyone know some excellent references or links that could give me tips and tricks, optimal aperature dimensions, etc. I have been informed that if I have pull through that I should put a
Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
Electronics Forum | Wed Jun 27 21:16:20 EDT 2007 | rfrog
5 mil will treat you just fine. Do some research on stencil area ratio and aspect ratio if you ever reduce your aperture sizes any further.
Electronics Forum | Mon Jan 25 13:51:07 EST 1999 | Parvez PAtel
Steve i agree with u. we use kapton tapes for test puproses at our facility and they do not interfere with the printing results. Infact we sometimes use it to mask off unwanted apertures on stencil underside. But could their applcation affect the gol
Electronics Forum | Tue Jun 10 11:44:25 EDT 2014 | patel_daxa29
It is very hard to say by looking at picture(solder joint quality).Overall appearance looks good.If you think is not sufficient solder or meeting required standard, enlarge opening of connector on solder stencil. Make all conn. aperture square or in
Electronics Forum | Mon Sep 13 07:27:50 EDT 2021 | denism
There may also be a problem with the a thermoprofile. Measure the temperature of both contacts of the component, if they heat up not evenly and the soldered lead heats up faster, then the problem is in the profile. To solve the problem of misalignmen
Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy
Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of
Electronics Forum | Mon Jun 29 13:51:29 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU