Electronics Forum | Fri Apr 11 01:52:26 EDT 2008 | andrzej
0,66 Is it ok ? Is it overprinted r - radius of stencil aperture - 9mils ~ 230um t - stencil thickness - 150um Other data : diameter of soldermas - 26mils Diameter of pad - 18mils Diameter of stencil apertre - 18mils Pitch - 0,8mm ~ 31mils What s
Electronics Forum | Fri Dec 10 09:47:52 EST 1999 | Larry
What does everyone use for stencil apertures on D Paks? What's the best way to keep them from floating during reflow?
Electronics Forum | Tue Aug 24 10:58:26 EDT 1999 | James Graves
Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Conseq
Electronics Forum | Wed Aug 25 21:51:13 EDT 1999 | Jason Tomlinson
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Fri Apr 11 05:51:20 EDT 2008 | janz
w/4t=0.8 Regards Jan
Electronics Forum | Wed Apr 16 02:46:55 EDT 2008 | andrzej
Thanks Jan for hints
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Fri Aug 27 13:31:47 EDT 1999 | swsng
1.5 FATOR FOR 20MILS QFP REDUCE 2 MILS HEEL AND INCREASE 2MIL AT TOES AT SIDES -1MILS EACH. SWSNG
Electronics Forum | Mon Apr 14 17:41:21 EDT 2008 | janz
Hello, That is working for us. If you have a look at the Indium or Cookson recommendation they are very similar. Just make few diffrent patterns of the BGA and find out what is workin for you. Regards Jan
Electronics Forum | Wed Aug 25 19:44:35 EDT 1999 | Dave F
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
