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soldering* Electronics Forums search results
4740 results found for soldering* in 3s.
Showing matching items 1 - 50
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SAC305 soldering to 58Bi/42Sn - 11/19/09 -
- SAC305 soldering to 58Bi/42Sn Which components are falling off during the second reflow ...
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share the DFX Design Guideline - 10/13/09 -
- ... third bullet. Why does Entek require different test point spacing than other surface finishes? Page 55, top image is off the page, partially. 2.3.6 Depanelization of Arrays, 10th bullet [Breakaway Scoring] refers to "using a Lihr Hermann machine." What is this machine? 3.3.3 Thieving Pad Required for Wave Soldering Multi-leaded Devices, Table: "intersatitial" [2 places] should be "interstitial (staggered leads)" 3.4.6 SOICs [reflow]: Gives pads and pad layout for "wave" rather than reflow
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BGA failure after coating - 10/5/09 -
- BGA failure after coating we suggest as below : the first : check the soldering(solder ball and pad) by X-ray ; second: to do dye analyse (note:pls confrm is there have crack ...
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Pb soldering to Pb free finishes - 10/2/09 -
- Pb soldering to Pb free finishes If you know "soldering Pb free (Sac based soler) to Pb/Sn coated lands is a no-no," why would soldering with Pb/Sn to Pb-free coated lands be different? If you are going to do this, follow the advice of an earlier poster who recommended higher peak soldering temperature [~230*C] than you would use for leaded assembly ...
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Importance of Exposed Pad In ST QFP for Set top box product - 9/28/09 -
- Importance of Exposed Pad In ST QFP for Set top box product That your solder connections reflow properly when heated with a soldering iron, indicates that that your reflow recipe needs improvement. * Thermocouple the pads that require touch-up and adjust your oven recipe to assure that they reach liquidous+20*C for 5 to 10 seconds * Use IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes We are uncertain about what you're asking us about an "exposed pad ...
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Baking populated PCBs - 9/9/09 -
- ... even in touchup we still had out gassing). After thorough investigation we found carbon smear in the TH plating. The reason for the carbon smear was that the board house didn�t have a procedure for drill sharpening or drill replacement. A dull drill will leave carbon smear in the hole and the carbon will not allow sufficient platting. Once a drill sharpening procedure was in place we never baked a board again and had zero blow holes after soldering. Might also be something to look into ...
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Low Silver Solder Problems - 8/25/09 -
- Low Silver Solder Problems It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attached a picture of the balls after soldering ...
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Problem with flux - 8/20/09 -
- Problem with flux Armando: We're guessing that the white residue is on the laminate also. We believe that the residue has something to do with your low residue flux and water. It could be: * Water contamination in the flux. * Poor selection of preheat temperature that does not fully vaporize water in the flux. * Humidity in the air that is some how condensing on the board prior to soldering ...
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BGA post SMT reflow? - 8/15/09 -
- BGA post SMT reflow? It would be nice, save you money, improve yield, improve reliability, etc. if your reflow process was more effective. It sounds like you're not getting the part hot enough during reflow soldering. Tell us about: * Measured temperature on this bluetooth component * Solder paste * Material of the component leads * Material of the solderability protection on the board
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Need low cost pick and place machine for limited production - 8/11/09 -
- ... it has the accuracy needed to match the size/pitch of components you are placing. With BGAs on the board, I would recommend at least a 7 zone oven if not more zones, especially if this is a lead free assembly. A small SMT rework station and/or soldering irons will be needed as there will be occasional touch up/repair of various components on the board. You can buy an X-Ray machine and a BGA rework station but rework of the BGA could probably be outsoruced if needed. Do not get the cheapest ...
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Need low cost pick and place machine for limited production - 8/10/09 -
- ... the priority level I want or at a budget I can afford. When you also factor in shipping, VAT and import hassles doing everything in house looks attractive. I'm in Bangkok, and operator time is essentially free. I've thought about 10 guys with soldering irons. Unfortunately, the BGA components make this impractical, and I need better process reliability than full manual assembly can provide. What else do I need besides a pick and place machine and a reflow oven if I wanted to do this myself? I ...
- 100%
LGa soldering issues...... - 8/10/09 -
- LGa soldering issues...... We don't know dip about your Linear Tech LGA118, but we agree with published reports that say you should have between 4800 and 7000 thou^3 of paste on the pad for a LGA. These volumes were analyzed based on volumes found successful for CGA and then evaluated for LGA ...
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SPC control-Wave soldering - 8/7/09 -
- SPC control-Wave soldering Well, since you've gotten no takers, we'll launch in to this with careful analysis and introspection, fully aware that we're likely to get 'blasted' for any number of reasons. The most critical parameters to monitor for proper wave solder machine process control are: * Dwell Time * Top side board temperature just before hitting the wave(s) * Pot temperature And dwell is the single most important measure ...
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LGa soldering issues...... - 8/6/09 -
- LGa soldering issues...... Yeah, those gosh darn disty parts...get you every time. lol Can we get just a little more info? Let's start with the basics... Stencil Thickness? Aperture Reduction? Leaded or Lead-Free? No-Clean or Water Soluble? How's your reflow? Have you profiled your oven to this specific PCB? We've done a shi...errr...buttload of LGAs. We haven't really had any problems. But then again, I'm not sure if we've placed this specific one ...
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LGa soldering issues...... - 8/5/09 -
- LGa soldering issues...... Help! We are havin issues installing the new Linear Tech LGA118's. We are installing 17 of these beast per assembly, the problem shorting? Any ideas? Linear Tech is usless, they blame heat, not a big enough reflow oven, moisture, part disty's...etc. Looks like too me they have a part design issue, the part has a 27 page rework doc! Anyone working with the new Lin Tech LGA's? Thanks for your help ...
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SN100C Nickel Content - 8/4/09 -
- ... alloy without Nickel to bring the levels back down, it is very rare to require dumping the pot. We also do this for the Copper content in our SAC and Sn100Sb alloys as well. Generally dissolving Nickel from Ni/Au boards is the main culprit due to high heats of selective soldering and dwell time, I would have thought a marginal increase in melting temperature could occur and possibly slower wetting above 0.1%. But best to keep below by using a non Nickel bar Cheers Greg BLT Circuit Services
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Electrically-Conductive Tapes application advice? - 8/2/09 -
- ... the discs would not solder properly. How much will the sensor expand (vs PCB expansion) at soldering temperatures? Will the sensor need to be soldered to the discs? Because of the potential problems when soldering, and the quantities mentioned, I think that the 3M adhesive is the best choice. You can also get the tape precut to the exact shape you desire ($$), if required. Jim
- 100%
SPC control-Wave soldering - 8/2/09 -
- SPC control-Wave soldering Hi all, If we are using non clean flux, what are the wave soldering parameters that we should monitor using SPC control chart? If not mistaken pre-heat is one of the important parameter that we should control.. Thanks, Sean
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Electrically-Conductive Tapes application advice? - 8/1/09 -
- ... ovens are for when you move to production quantities. It sounds like you could hand solder your prototypes (proof-of-concept) with wire-core solder, but you will lose the repeatability that (should) come with production techniques. When hand soldering your prototypes, remember that the type and quantity of flux is very important. Not all flux are created equal. The problem that I see with using tape to fasten parts is that it is a manual operation. This may increase cost when moving to full ...
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Electrically-Conductive Tapes application advice? - 8/1/09 -
- ... about if my PCB is a prototype, would it be more economical to use hand soldering or just manually applying solder paste around the copper strip and heat it up with solder iron? I guess for my design (see picture at first post), mass manufacture will be a problem right? If anyone has a better idea, feel free to share!! :) Anyway, if i were to use a high temp adhesive tape to tape down the copper strip instead of soldering it with solder paste, is there any problems in the long run if the PCB is ...
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Electrically-Conductive Tapes application advice? - 7/31/09 -
- Electrically-Conductive Tapes application advice? If the sensor can survive the 200C in the molding machine, then could it not survive Pb-free soldering? Maybe not convection reflow, but it should be able to survive vapor-phase reflow. I would control solder height by controlling the amount of paste applied (stencil thickness ...
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How to remove Oxides from older components? Fine Pitch - 7/29/09 -
- How to remove Oxides from older components? Fine Pitch What temperatures did you read on the QFP component leads during reflow soldering ...
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PCB residue after wave solder - 7/29/09 -
- ... Maybe it has something to do with it (perhaps board was not pre-heated enough due to bigger thermal mass)? Belt speed was 120mm/min (0.8"/sec). I checked the wave width with tempered glass and it is about 40mm. What I can't check is the PCB temp. after pre-heat. As I have understood, it should be about 100 deg.C, but I have no means to verify it. "Webbing" is definitely partially made of solder alloy, as I have removed it from the PCB by hand (it melts on the soldering iron tip)... regards Dejan
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PCB residue after wave solder - 7/29/09 -
- ... recently started to use wave-soldering. As total newbies in that field, we got successful results most of the time. Howewer, this batch of PCB's had a lot of resdiue, as shown on the picture. Most of it is most likely flux, but on some areas even some soldering alloy is visible (marked red on the picture). It's a leaded soldering wave with foam fluxer and IR pre-heat. Any suggestions will be helpful. Also, if someone knows a good on-line tutorial on wave soldering (how-to's, do's and dont's) I ...
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Electrically-Conductive Tapes application advice? - 7/28/09 -
- ... be used to provide electrical connection to the device. The main reason i wrote high temp soldering is because my operating temperature is about 200 degrees C in the molding machine 24/7. I would not want the solder to melt. I am not familiar with the types of solder,any advice? So, if using copper strips method is easier, how can i control the solder protrusion height to less than 1mm? Can hand soldering achieve that? How about using a high temp adhesive tape to tape it down instead? But this ...
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Electrically-Conductive Tapes application advice? - 7/28/09 -
- Electrically-Conductive Tapes application advice? It's possible that there is limited application of "3M� XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9719" similar to your intended use. What do 3M� application types say? Certainly high temperature soldering would make a mess of a piezoceramic sensor. So, why aren't you using a low temperature solder ...
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Flux residue - 7/28/09 -
- ... Hi Sean, No-clean flux does leave a residue. Under the best conditions, it is invisible. There are many factors that can cause the residue to become visible such as an inadequate oven profile (or lack of proper preheat on a wave). Also, if wave soldering, the flux application method effects the amount of visible and invisible residues on an assembly. Lead-free processes, with their higher reflow temperatures also contribute to residues as the flux polymerizes (crosslinks) during the reflow ...
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Solder Ball and Splash after Hand Soldering - 7/26/09 -
- Solder Ball and Splash after Hand Soldering Is it possible that the assembler is using solder wire that's too small for the application and feeding it too quickly to compensate ...
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Electrically-Conductive Tapes application advice? - 7/26/09 -
- ... Axis Electrically Conductive Adhesive Transfer Tape 9719" to connect the device to the PCB trace to replace the need for soldering but i am not sure if this method works? Or is sticking a copper strip over it works better (see picture)? I have read in this forum about the use of aluminum tapes to secure thermocouples but i am not sure if it can be used to replace soldering. The sensor will be hit by an ejector pin and will produce a voltage difference between the top and bottom surface of the ...
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Solder Ball and Splash after Hand Soldering - 7/25/09 -
- Solder Ball and Splash after Hand Soldering Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper thickness helps eliminate the out-gassing ...
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Solder Ball and Splash after Hand Soldering - 7/24/09 -
- Solder Ball and Splash after Hand Soldering Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ...
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Solder Ball and Splash after Hand Soldering - 7/24/09 -
- Solder Ball and Splash after Hand Soldering Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperature of the soldering iron * Preheat of the soldered assembly * Solids content of the flux selection * Solder mask compatibility with flux
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Solder Ball and Splash after Hand Soldering - 7/22/09 -
- Solder Ball and Splash after Hand Soldering Hi SMTnet Team, I had facing a lot of feedback from my customer interm of the solder splash and solder ball, After I check my process the issues came from manual soldering process. Is any one having the same problem with me ?, any one have solution to that. I had running for high mix low volume product with more than 1K models family ...
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BGA reballing tool - 7/22/09 -
- BGA reballing tool Hello, this is my first question. More than 10 years my job was mobile phones repair, and for BGA repairing proces I used special template stencil, soldering paste and flux. Right now my job is notebook repair, and I'm interested about reballing of BGA chipset (ATI/Nvidia...). Regarding that, what method and tools do you sugest me? Sorry for some mistakes, because english is not my native language. BR
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AOI side angle cameras - 7/20/09 -
- ... that maybe it was something I was doing wrong and called the manufacturer for help. They sent 3 different FE's over the course of a year and they could not get it either, however, they all argued that the machine was more than capable and our soldering process was to blame. Since then, we have changed AOI suppliers and have gone with a single, downward looking camera system. It is excellent at catching lifted leads and everything else, but has a very low false call rate. With the image ...
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Equipments required for making SMD PCB's - 6/27/09 -
- ... prototypes, then you could get by with a syringe of solder paste and a hear gun. You can put down a little solder paste on each page and then place the passives and heat gun the board. If you have other active parts, you can use of those wave soldering iron bits and solder these. However if your doing BGA, then this is a little more tricky, but just flux the pads and heat gun them down gently. However you would need to do the BGA's before the passives as the BGA needs more heat and should not be ...
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Screens in selective soldering - 6/25/09 -
- Screens in selective soldering Hello, I want to hear some experience about selective soldering for PCB using nozzle plate and screens Do you have solder defects? bridges and insufficient soldering? How do you combat that? and about the screens you have good quality? What is the frequency of cleaning and changing screens? Thanks for your time
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Thermocouple soldering - 6/23/09 -
- Thermocouple soldering Are you sure there is any "cleaning" needed? Can you see leftover bits of the teflon remaining? If so, work on it with an Xacto knife. But, most thermocouple wires are VERY hard to solder - as in practically impossible. Many of them have aluminum, nickel or chromium in them, typically hard to solder metals. That's why the spot-weld them. Jon
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Thermocouple soldering - 6/23/09 -
- Thermocouple soldering I don't know about removing the teflon insulation, but we weld our thermocouples ...
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Thermocouple soldering - 6/23/09 -
- Thermocouple soldering We use teflon covered thermocouple wires. I can't seem to do a decent job of cleaning the wires to get a good high temp. solder ball on the tip between wires when I need to repair one. Any tricks to it ...
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Hazards of Lead solder fumes? - 6/19/09 -
- Hazards of Lead solder fumes? I should know the answer to this question but it's Friday and my brain hurts. When soldering you create fumes that are from the soldering flux.. These fumes should be extracted or diverted. Question is at what point does the leaded alloy become a vapor? I google and came up with 2858F to vaporize lead solder. Is that accurate? Any help would be appreciated ...
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Crazing or Delam - Thermal or Mechanical? - 6/17/09 -
- ... This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discoloration does not appear after the press operation, only after wave soldering (not a verified statement). We have been running this assembly the "same way" for a couple years at production volumes of about 200 per month and have never experienced this prior. 220 out of 250 assemblies on the last production run exhibited this ...
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BGA flux dipping process - 6/15/09 -
- ... process IMHO I would suggest that if you are using flux only during a BGA placement on a small run, that you first tin the pads with your soldering iron, then level the pads back out with wick. Accomplishes two things; adds a little metal to the joint to make up for some warpage, and can help eliminate the head in pillow effect as well, since you are soldering the BGA sphere to the solder already on the pad. Naturally, this is already the case in a rework situation, where the BGA is being ...
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Innolot - Solderingpaste - 6/15/09 -
- Innolot - Solderingpaste Helloooo Germany. Innolot solder paste is a product for harsh environment vehicle electronics that Cookson Electronics developed to improve SAC387, look here: http://www.soldertec.com/SITE/UPLOAD/Document/Conferences/Brown.pdf
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Innolot - Solderingpaste - 6/15/09 -
- Innolot - Solderingpaste Hallo Guys, i am looking for a supplier of Innolot-Solderingpaste. Can anybody tell me where i can ordering it? Thanks! Greetings from Germany ...
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QFN 16 Soldering - 6/12/09 -
- QFN 16 Soldering Minimize scavanging by the attached trace and provide more uniform temperatures between all pads ...
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QFN 16 Soldering - 6/9/09 -
- QFN 16 Soldering We are looking at feasibility concerns of using a QFN 16 from Motorola. I have a couple of questions regarding their recommended PCB design guidelines. 1) Does anyone know why they would recommend coming out of the pads with a narrow trace (.1mm width for a distance of .5mm) and then widening it? 2) Why would they recommend a 2 mm keepout around the package land area? I attached their datasheet showing their recommended PCB design. Does anyone have any experience with this part ...
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BGA Pad Cratering - 6/7/09 -
- ... and/or thermal stress. Generally: * Lead-free solder connections are stiffer than tin-lead connections * Some lead-free laminate materials are more brittle than conventional tin-lead materials. This reduced flexibility, combined with: * Higher soldering tempera?tures required for lead-free assembly * Greater flexing of BGA during these higher temperature swings caused by Cte mismatch between the BGA interposer and the the board ... could transfer more strain to the laminate, causing a pad ...
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BGA ball vs land design problem?? - 6/4/09 -
- BGA ball vs land design problem?? Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD with small diameter balls in order to reduce cases of bridging between balls during board assembly soldering ...
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X5R dielectric aging - 6/1/09 -
- X5R dielectric aging Reflow soldering de-ages the capacitors. Two things may be affecting your testing. * Capacitance measurements are often erratic during testing for about 10 hours after de-aging. * Test limits should be set so that the capacitance value is within the specified tolerance at 1000 hours, because the capacitance change in the first 1000 hours [four decades of aging] is the greatest ...
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