Electronics Forum | Thu Jan 25 13:57:48 EST 2001 | davef
Interesting. I'd start with the "Help Desk" at the Reliability Analysis Center [http://rac.iitri.org/]. Please get back with your findings.
Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon
Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on
Electronics Forum | Wed Aug 05 10:05:00 EDT 1998 | Paul Horan
I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the e
Electronics Forum | Tue Jul 07 15:01:49 EDT 1998 | Chris Link
Any Comment's about mydata placment reliability (repeatablity) on all types of components. we have trouble quantifying just how good it is. Is it as good as Mydata Claim ?? Please help
Electronics Forum | Fri May 07 16:28:07 EDT 1999 | Andrew Wulff
On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This is a known L
Electronics Forum | Thu Aug 06 02:25:21 EDT 1998 | P.L. Sorenson - Technical Consultant
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Thu Aug 06 10:30:41 EDT 1998 | Mike
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Electronics Forum | Mon Aug 24 07:16:52 EDT 1998 | Paul Horan
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Mon Aug 24 07:12:20 EDT 1998 | Paul Horan
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Fri Aug 07 02:32:09 EDT 1998 | P.L. Sorenson - Technical Consultant
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
