Electronics Forum | Wed Sep 15 07:34:49 EDT 1999 | Edmund
Hi, Can someone pls suggest to me the best reflow temperature setting for a force air convection oven. The details is as follow. 1) Heller 1700s 2) 12 zone---6 top and 6 bot 3) Solder paste --- Qualitek 691 non clean 4) board size : 159mm X 159mm
Electronics Forum | Wed Sep 15 10:55:21 EDT 1999 | Scott S. Snider
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Electronics Forum | Wed Sep 15 07:43:12 EDT 1999 | Earl Moon
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Electronics Forum | Wed Sep 15 12:07:50 EDT 1999 | Earl Moon
| | Hi, | | | | Can someone pls suggest to me the best reflow temperature setting | | for a force air convection oven. The details is as follow. | | 1) Heller 1700s | | 2) 12 zone---6 top and 6 bot | | 3) Solder paste --- Qualitek 691 non clean | |
Electronics Forum | Thu Sep 16 12:06:29 EDT 1999 | Scott S. Snider
| | | Hi, | | | | | | Can someone pls suggest to me the best reflow temperature setting | | | for a force air convection oven. The details is as follow. | | | 1) Heller 1700s | | | 2) 12 zone---6 top and 6 bot | | | 3) Solder paste --- Qualitek 691
Electronics Forum | Thu Apr 05 12:27:12 EDT 2001 | davef
I concur with your second approach. A profile needs to be tailored to the design of the board, the components, and the solder paste. Your first approach seems to try to balance lower quality soldering with a lower process complexity.
Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL
Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im
Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre
use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder
Electronics Forum | Mon Apr 09 14:05:25 EDT 2001 | slthomas
CAL's word of caution is right on. We tend to stay in the 220C-225C max. temp. on our profiles, and that's because the last heads up from engineering came on a part with a spec. of 230C max. temp. We just found out that one of our old SOIC's is spe
Electronics Forum | Wed Jan 17 03:41:31 EST 2007 | technology
hi guys, tell me how to do temperature profiling on reflow oven with the help of computer. how to use the thermocouple & sensors.
