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The Mark III Reflow System

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Packaging Engineer

Nov 8, 2006 | Texas Instruments

... Mount Technology (SMT) application support for all package-related issues at customer sites worldwide. - Develop new package technologies in support of HVAL business organizations. - Support SMT guideline generation for HVAL pin / packages (BGA, QFN, WCSP, PowerPad and Leadframe base packages). - Generate PCB layout, land patterns, stencil design drawings, solder paste, and reflow profile selections. - Provide customer support with all board assembly related issues (PCB design, equipment ...







 
 
 
 
 
 
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