Electronics Forum: mitigation (Page 1 of 6)

Gold mitigation

Electronics Forum | Thu Jul 30 23:40:45 EDT 2020 | smith88

Is there a way I can inspect for gold embrittlment.

Gold mitigation

Electronics Forum | Fri Jul 31 11:44:39 EDT 2020 | cyber_wolf

The down and dirty method is to pop a part off using mechanical leverage. Otherwise you may be able to see it if you have a good Xray or CT.

Tin Mitigation Processes

Electronics Forum | Mon Apr 30 17:43:53 EDT 2012 | scottv02

I have heard there is a process for mitigating the pure tin issues for 0402/0201 size parts by the use of SN63/PB37 solder print process. Is this true and does anyone have the data to back this up?

Propensity of Immersion Tin surface finish fo whiskers

Electronics Forum | Mon Dec 12 09:39:39 EST 2005 | Amol Kane

thank you devef....My point is this....If you solder all the areas that have Imm Sn on them, there wont be any whisker formation DUE TO THE IMM TIN COATING.....whiskers could still potentially form as a result of COMPONENT FINISHES and effective miti

Tin Mitigation Processes

Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon

Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w

Re: seeking low cost fix to tce mismatch

Electronics Forum | Thu Jan 06 15:39:57 EST 2000 | Mike Naddra

Jim, The use a a teflon substrate, would mitigate the TCE mismatch you are expierencing. Mike

FMEA

Electronics Forum | Thu May 12 20:18:57 EDT 2005 | davef

Your customer knows what's correct, but we'd expect a unique FMEA for each process used in the quality plan and control plans to mitigate issues identified in the FMEA.

Best Alpha Lead Free WS paste??

Electronics Forum | Thu Jan 10 12:33:05 EST 2008 | jdumont

Thanks for the reply.. May foam eh? We actually clean some of our no clean boards anyways so I have Zestron in the wash sump. That should mitigate any foaming that would occur in straight DI I would think...?

RoHS Part Conversion

Electronics Forum | Wed Nov 09 11:01:35 EST 2011 | blnorman

This application is military, which requires a minimum of 3% Pb on the terminations, or mulitple mitigations for tin whisker prevention.

Interesting Article on Reliable Soldering

Electronics Forum | Thu Sep 01 18:16:51 EDT 2016 | sarason

I found this rather interesting article on the science of Tin Whisker mitigation. http://iconnect007.uberflip.com/i/721932-smt-sept2016/36 sarason

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