Electronics Forum | Wed May 17 14:02:06 EDT 2006 | russ
So, what is the pitch of the part and the pad size, also tell us the thickness of stencil. Russ
Electronics Forum | Wed May 17 13:48:37 EDT 2006 | dwelch123
I'm having trouble printing leads on a fine pitch part. The lead is only .008". I'm using a DEK 265 with metal squeegee and using WS200 multicore solder paste.The stencil is laser cut and polished. I've experimented with different pressures and diffe
Electronics Forum | Sat Jun 18 00:35:15 EDT 2005 | mskler
Thanks to all. I am working on your suggetions will get back as the problem solved
Electronics Forum | Thu May 18 12:00:42 EDT 2006 | jdengler
I think he edited his original post.
Electronics Forum | Thu May 18 11:16:16 EDT 2006 | russ
Go 5 or 6 mil thick with stencil, i am not familiar with that pitch but I would recoomnd a 5mil. Was the thickness in this post before and i missed it? Russ
Electronics Forum | Thu May 18 09:18:33 EDT 2006 | Chunks
Hi dwelch123, 8 mils seems a bit thick to me. I would normally go 6 or 5 mil for fine pitch such as this. One other area to check is the the snap off. Are you using the slow snap off or just lowering the board right after print? If so you should
Electronics Forum | Thu Jun 16 00:24:29 EDT 2005 | mskler
Hi everybody, Can some body tell me that what stencil thicknes is required for the 16mil QFP. I am getting bridging as well as dry at QFP pins. What type of solder 1. Viscocity 2. mesh size 3. flux contents Should be used for this type
Electronics Forum | Thu Jun 16 08:31:15 EDT 2005 | jh0n!
The most part I have the most difficulty with is a 16mil QFN. We found that reducing stencil thickness to 4mil, and reducing aperatures for the IC by 20%, and setting local fiducials to the IC helped immensely. We used to get 75% or more bridged ou
Electronics Forum | Thu Jun 16 09:13:46 EDT 2005 | russ
We use a 5 mil for 16mil pitch QFPs, Make sure that the stencil has been polished. Type 3 paste. We have used lead free no-clean, lead no-clean, and water soluble lead pastes for these packages. We set the printer for a slow stroke .7 in/min. wi
Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
.gif)
