electroless copper

"electroless copper" search results in the Electronics Forums



8 results found for "electroless copper" in the Electronics Forums

Order by: Relevancy |   Date

Black hole process (MacDermitt) for PCB fab

May 30, 2000 | the non-conductive areas conductive to enable pattern plating on boards with a conductive material. In contrast to electroless copper, direct metallization can not be inspected for complete hole coverage - this occurs only after copper electroplate. Direct metallization processes are: (1) Easily

PCB fab supplier supplier/evaluation

Aug 8, 1999 | plating. 2.3.8 Hole Wall Preparation - Plating Support All hole wall preparation requirements shall be met to ensure specified electroless and subsequent electroplating requirements are met. 2.3.9 Electroless Copper Deposition Electroless copper deposition in hole walls shall be sufficient to support

Pin Hole/Blow Hole - Causes and cure please

Jun 24, 1999 | poor copper electro-plating and, in general, poor process management in the board shop of choice. All the baking in the world will not cure the problem. Only effective process management within the board shop will do that. Earl Moon

Photopolymerized Conducting Polymers

Mar 11, 1999 | for the preparation of conducting polymer films can be applied to PWB manufacturing as an additive direct metallization process. | | The process eliminates environmentally undesirable electroless copper plating and significantly reduces the number of PWB manufacturing steps. The developed direct metallization

Photopolymerized Conducting Polymers

Mar 10, 1999 | films can be applied to PWB manufacturing as an additive direct metallization process. The process eliminates environmentally undesirable electroless copper plating and significantly reduces the number of PWB manufacturing steps. The developed direct metallization process is highly efficient and has

Assembly of CSP on pads with vias.

Jan 23, 1999 | and electroplated copper

Plating Processes

Oct 30, 1998 | etc.), hole wall preparation (etch back and smear removal), electroless copper

PCB Standards

Jun 10, 1998 | then prepared (by removing resin smear on inner layer conductor interfaces) to ensure an acceptable plating interface. Then, an catalytic electroless copper deposition process is performed on the drilled hole and inner layer conductor (and PCB surface metal) interface by applying sufficient metal to support electroplating. This requires certain things must be met in terms of minimal voiding, etc. Electroplated copper is then deposited over the electroless copper

Reflow Ovens thermal process improvement

SMT equipment