Electronics Forum: edgebond (Page 1 of 1)

underfilling of bga

Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo

There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p

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