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80% Board Assembly and Packaging Specialist

... and Vitronics Reflow Ovens, Camalot 3500 Underfill Dispense Machine, SEHO and Electrovert Wave Soldering Systems.  GSI Automatic Optical Inspection System  2D and 3D X-Ray Inspection Systems  Reflow Oven Profiling using Datapaq, KIC and Supermole  Lead Free Soldering Materials and Processes  Alternative PWB Component Surface Finishes including Ni/Au, OSP Copper, etc.  Paste in hole Soldering Processes  Micro BGA Repair and Rework Processes ...