Electronics Forum | Fri Aug 24 13:21:59 EDT 2018 | babe7362000
What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks
Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto
I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc
CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is
Electronics Forum | Mon Sep 14 16:44:37 EDT 1998 | Steve A
| Reading some technical report I found the term "CSP", but no explanation. | I guess something about Chip Scale Package... but not sure. | Could someone please explain it to me? | Rgds, | Anderson You are absolutely correct. CSP is an acronym for C
Electronics Forum | Tue Dec 29 08:11:18 EST 1998 | Kelvin Chow
As CSP and BGA packages become more and more popular, I want to know if anyone get problem to assembly CSP packages. Currently, most CSP use 20mil solder ball diameter and it is a trend to go down to 16mil or even 12mil. I wonder if there is a probl
Electronics Forum | Mon Dec 04 02:25:23 EST 2000 | Praveen Madaan
Hi all, We are working on the CSP rework project and would like to share the knowledge resource available with you guys. Can you please reply back on the issues and solutions involved in the CSP rework Process. Also please suggest any website/arti
Electronics Forum | Fri Jun 16 08:36:25 EDT 2000 | Paul Houston
We typically use air to air thermal cyling for thermo-mechanical testing. However, you may also want to look at vibration and drop tests. Basically you use the same tests for underfilled CSP's as you would for regular CSP's Paul CBAR Lab
Electronics Forum | Fri Aug 23 12:35:09 EDT 2002 | msjohnston
Has anyone done a study or know of one that addresses the flow / no-flow underfill differences for CSP devices. My main interest is in the reliability of the CSP and underfill. Any help would be great. Thanks, Mike
Electronics Forum | Sun Jun 10 20:47:25 EDT 2001 | erichua
Our company is going to start building PCB with flipchip and CSP component. I'm now trying to get more information on the flipchip and CSP process. Because I'm still new to both (flipchip & CSP) and could like to have more information. Can anyone tel
