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May 4, 2018 | For best / most accurate results, I would imagine you will need some automatic solder wire feeding station. - At least to maintain consistency. Is this something you have on-site to perform the test with? - Indeed, a pretty straight forward process. We have done many in our lab testing different . This is because of the out-gassing occurring within the flux cored wire. The gas created from the flux (igniting in this instance) is what is creating the flux splatter and solder ball defects. To reduce: Try to solder with a temperature closest to the liquidus state of your alloy. (lowest possible - assuming all parts are eutectic) - if the alloy is not eutectic, you will need to target the highest liquidous temp in the composition. (Eg. SAC305 - the 3 part composition (tin, copper, and silver) all have 3 different liquidous temperatures -> meaning its non-eutectic. You would want to stay as close
Mar 13, 2018 | I think of palladium coated copper with gold flash (CuPdAu) as bond wire used in chip attach. Look here: https://www.heraeus.com/media/media/het/doc_het/products_and_solutions_het_documents/bonding_wires_documents/fact_sheets/Factsheet_PdFlash.pdf I have no connection with nor receive benefit
Aug 24, 2017 | Hello, I am looking for the name of a type of connector that connects wires on one side and simply slides on the side of a PCB to connect. The PCB has copper lines on the surface (so no connector part rigidly mounted to the PCB). Can anyone help me with the name of such a type of connector
Jun 8, 2017 | ? I could do simple copper plating, but am worried it would oxidize before soldering. I guess the oxidation could be wire brushed off. Thanks again for feedback. can silver plating be used as barrier when soldering brass to copper? silver plate the brass? davef, thanks for feedback. I talked with a plater who said they put copper before silver when plating brass. Would a complete stack of: Brass part, then 0.0001-0.0002" of copper, then 0.0005" of silver, then Tarniban anti oxidation. Sound reasonable to prep a brass part for soldering to copper
May 18, 2017 | socket is 40++ N. I found that the break wire has exposed copper on wire strands. what will be the possible root cause and what can I do to increase the wire strength? wire harness strength We are soldering wire 26AWG to jack socket. However after went through washing, baking, coating, curing processes the wire breaks (at joining point with jack socket) during wire dressing. We have tried to increase and decrease the solder amount but rejects still happened. pull test of wire and jack
Oct 4, 2016 | IPC-7721, Section 6.1, Jumper Wires, Jumper Wire Selection #5 states: "Recommended wire is solid, insulated, plated copper wire, 22 to 32 AWG with a heat resistant insulation. Wire with tin-lead plating may be restricted due to environmental laws." Yes, etching is a common method to condition fluoropolymer coated jumper wires prior to staking and /or applying conformal coating. Often, teflon coated wire is not the first choice of materials in hi-rel products. Select a wire to match current handling capacity of the circuit to be replaced.
Aug 2, 2016 | On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you have local fiducials you can get a reading near
Jan 17, 2016 | Managing Thermocouple wires during reflow profiling We are using KIC (kicthermal.com) in reflow profiling. It uses thermocouple wires about 0.5 meter only each point. Previously, Winkic the machine built in software which requires about 5 meters wire. No need for the operator to stand there and feed the TC wires.
Jan 8, 2016 | Managing Thermocouple wires during reflow profiling We utilize the built in profiling equipment in our reflow ovens. It's somewhat tedious to have the operator stand there and feed the TC wires in as the board progresses through the oven. Otherwise the wires sometimes hang up and the board stops moving through, like it's tethered. Also, when profiling to use the edge hold chains, it puts the wires close to the edge of the mesh belt and the wires sometimes get caught. Does anyone utilize some kind of feeding mechanism for the wires? I'm picturing a fishing reel type device that would slowly feed the wire or allow it to be unspooled.
Jan 30, 2015 | how to solder manganin 0.05mm manganin wire to a copper plate Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates around 2mm in height and 7mm in diameter , but i
Jan 29, 2015 | how to solder manganin 0.05mm manganin wire to a copper plate Nichrome, manganin, phosphor bronze etc are easy to solder ... the hard part is removing the corrosion * Manganin: 86% copper, 12% manganese, 2% nickel. Often, it's used in making cryogenic measurements, due to its low heat loss. * Select a flux for soldering stainless steel, kovar or nickel * All of solder on the connection to the manganin wire
Jan 29, 2015 | how to solder manganin 0.05mm manganin wire to a copper plate how to solder manganin 0.05mm manganin wire to a copper plate
May 17, 2014 | I hate to say this but in all probability this wont work. I have built real strain gages and they depend on the change(Co-effiecent) of resistence with strain(or Stretch). since you are connecting you elements up with copper wire it will frm part of your circuit. The changes are infinitely small Etch strain gauge in copper layer to measure deformations during press process [How to?]
May 16, 2014 | Etch strain gauge in copper layer to measure deformations during press process [How to?] Interesting. How did you connect the gauges in the press? Our press only has connections for thermocouples. But in essence, it's only a wire and an electical output. If you placed these prefabricated gauges on top and on the bottom surface, weren't they affected by the high pressure of the press?
Apr 22, 2014 | No we have a battery spring that is soldered directly to a PCB (standard tin plated copper PCB). The Battery spring supplier (and I have no confirmation he makes them or buys them) claims they are tin plated. When trying to solder to them it is very difficult to get the solder to wet, and or adhere to the spring. According to other battery spring manufactures Nickel plated carbon steel (piano wire) is a material of choice. Tin plated battery terminal can cause galvanic corrosion. I may look into the epoxy, but wanted to see if others out there have had similar experiences and had some feedback. Thanks
Jan 23, 2014 | stranded copper wire - tin or not tinned I agree with AFlex. Don't tin stranded wire that's assembled into a screw terminal block. I believe the reasoning has to do with avoiding stress on the wire metal caused by different expansion rates of the solder and the wire. BR davef
Jan 23, 2014 | Even for me its a No. Its quiet strange why some preferred tinned ones.
Jan 23, 2014 | stranded copper wire - tin or not tinned Should stranded copper wire (20 gauge 19 strand) be tinned prior to insertion into screw connector? One of our customers "suggests" tinned, but past experience tells us no.
Sep 5, 2013 | , but its name can be defined by the user. System allows PCB design contains 16 Mechanical Layer, respectively Mechanical Layer 1, Mechanical Layer 2... Mechanical Layer 16, the layers with different color display. (4) Mask the Layers (layer resistance welding) : used to protect copper wire, also can (1) Signal the Layers (layer Signal) : the copper foil layer, used to complete electrical connections. Altium Designer Winter 09 allowed 32 Layer signal, circuit board design, respectively, for the Top Layer, Mid Layer 1, Mid Layer 2... 30 Mid Layer and Bottom Layer, each Layer with different color display. (2) Internal Planes (the middle tier, also called Internal power supply and ground layer) : also belongs to the copper foil layer, is used to establish the power and ground network. 16 middle tier system allows circuit board design, respectively as Internal Layer 1, the Internal Layer 2
Jun 7, 2012 | raw copper on pcb Hi, I have pcbs (Duroid/RT 5880) with raw copper, soldered in vapour-phase chamber at 230 degrees Celsius. During soldering, copper gets tarnished. Cleaning with Vigon A250 removes the tarnished layer. Indeed, in the VigonA250 techn. datasheet it is reported that the clean agent attacks copper. Do I have to worry for this Copper attack? how properties of copper surface are affected? thanks.
May 16, 2012 | Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies ** Liquid Solder Mask -MPR80 Amber - Nippon soldering. ** Fixed and sprung pallets location pins used for the flexible. Protrusion of pins above the circuit was approximately 0.010.” ** Circuits do lift on the edge of the tooling holes which does not cause a problem during assembly. This may be due to the copper being relieved around the hole causing ** Remove and replace components ** Set-point on tool 340-360*C ** Use lead-free wire to set-up air pencil distance from joints for reflow ** Removal of solder shorts with solder wick ** Shorts purposely added to SOIC16 leads for testing ** Set-point on iron 380*C ** No issues of delamination or pad lift
Oct 19, 2009 | of solder connections do your assemblies consist of? (Wire Terminations, PCB Interconnects, Thru-Hole Electronic Components) 4) Are you soldering to a PCB Board? If so, what is the Surface Finish, copper weight, and number of layers? Please provide as much information as possible. Thanks
Aug 27, 2007 | Wire prep I know this is a little outside of SMT production, but, I'm hoping someone out there can help me with a small issue. I have a product that I'm building that requires 4 .250" wires, with .125" strip on each end. I solder one end to the board, and one end to a header. Anyone know where I can get .25 wire stripped .125 on each end? My normal wire supplier can't strip wire that small. Hand stripping in house is time consuming, as well as physically difficult. Absent any leads on where to get the wire pre-stripped, any one have any ideas of a creative way to accomplish this en masse? Our
Aug 27, 2007 | Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migrated over the nickel.
Jul 13, 2007 | warning - not all stainless steels are non-magnetic! Quite a few alloys are magnetic, some as highly magnetic as ordinary steel. One quick test is to demagnetize the jaws. If you can find one of the old-style Weller soldering guns with the copper tip that bolts to two terminals on the front , these make excellent small-part demagnetizers. You squeeze the gun's trigger, put the part close to the tip (or pass between the two wires for even stronger field) and then pull the part away from the tip before releasing the trigger. I use this trick all the time to demagnetize tweezers, small
Jun 4, 2007 | IEC - 60601 compliant LF-NC Wire Solder Patrick Q1) Is the test pattern similar to the IPC-B-25? A1) - No - Tests were run on a prototype assembly. Q2) what is the temperature in the test chamber and voltage supplied to the test coupons? A2) 25C with 3.3VDC. Q3) Does this test include pH, copper mirror and silver chromate paper test (presence of halides) for the flux? A3) No Q4) Also do you have restrictions in alloy selection? A4) Target alloy for this product is SAC305. Not negotiable. Q5) Does the test coupon with the lead-free solder wires you tested show filament growth? A5) None observed
Jun 4, 2007 | IEC - 60601 compliant LF-NC Wire Solder -free now. I�m not familiar with the IEC - 60601 test, only with Bellcore electromigration which is 85RH/85C 500 hours. Is the test pattern similar to the IPC-B-25? You specify 95%RH but what is the temperature in the test chamber and voltage supplied to the test coupons? Does this test include pH, copper mirror and silver chromate paper test (presence of halides) for the flux? Also do you have restrictions in alloy selection? Does the test coupon with the lead-free solder wires you tested show filament growth? Answering these questions would let me know if I can help. Patrick
Apr 5, 2007 | I have seen a method used where the pins on the connector are of the same materials as the thermocouple and the connector is connected via single strand wires of the same material to the PCB however the wires were spot welded to bare copper pads to reduce the effects of thermal noise as the noise that this is a common cause of failure in thermocouples besides broken wiring.
Feb 7, 2007 | Bismuth is a low-melting metal with poor mechanical properties; if you melt the bismuth wire into a standard tin-lead solder joint, then the bismuth alloys with the solder, and forms a material that will crumble if you scrape it with your fingernail. The idea is that if you mix bismuth into a solder joint that you want to remove, then the joint will become so mechanically weak that you can pull the component off with your fingers, and the joint will break, with no damage to the component or the board. At that point you can clean the lands with flux and copper braid. [Electronic Parts
Dec 21, 2006 | to components of high thermal mass. (3) Proximity to edge of assembly. (4) PCB pad with big copper layer underneath(Usually, light green solder mask indicates copper layer underneath). Hi Real Chunks, On item #2, usually, if we were to attach TC wire to D-PAK lead, what is the temperature different compare Criteria for thermocouple wire attachment Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal mass of component. (2) Proximity of component
Dec 20, 2006 | Criteria for thermocouple wire attachment from incomplete PCBA(Some SMT components are not mounted) is the same as reflow profile from PCBA with full complete component mounted. (2) This component(DPAK type) has heat sink at the bottom and is located on the big copper layer area (Light geen solder mask color indicate copper layer underneath ). Question: In this case, attach thermocouple wire to the component lead is sufficient to obtain accurate temperature profiling. These 2 claims sounds weird to me but I need confirmation from expert here. Lastly, wish every single SMTnet user "A Merry X'mas & Happy New Year"!!
Sep 27, 2006 | Hello Steve, Yes, there are differences in the various alloys and I have described briefly below these differences: SN100- a common name for 100% tin that is used to increase the tin content in 63/37. SN100C-Name for Tin/Copper/Nickel/Germanium alloy used for wave solder, tinning, wire solder and solder paste. SN100Ce- Tin/Nickel/germaniuum top-up alloy used IF the copper content exceeds the recommended limit of 0.85% in the wave or tinning pots. SN100CL-Tin/Copper/Nickel/Germanium alloy used for Hot Air Solder Level (HASL). SN100CLe-Tin/Nickel/germaniuum top-up alloy used IF the copper
Jun 20, 2006 | I was afraid so. Hand soldering wires in general is not difficult, but with your constraint of the space restriction it does make fairly hard to do. I am assuming you have a 2 sided board and stranded copper wire. So once solder starts to flow, the flux follows the heat up the wire Wire to board soldering
Jun 19, 2006 | Wire to board soldering Hi All, We have a board that's going through our process at the moment, it's 1.6mm thick and has 4 wires soldered into it, these are 10SWG multi stranded wires, i'm finding that it's difficult to get the holes filled with solder as it travels up the wire, customer expects 100% hole fill but the more solder we push in the more the wire takes, also the wire is to be flexible as the board goes into an enclosure and needs to bend pretty close to the board. Has anyone had to deal with anything like this before? Should the wires be screwed into a connector rather than soldered? What are the IPC
May 22, 2006 | Grant has a good idea, we started that way also. We made a tank out of stainless steel with copper tube coils about 18" off the bottom. Circulate cold water through the tubes to condense the vapor to keep the loss down. We used electric burners underneath from Mcmaster Carr. This setup allowed -heat if this is a problem. This does work. The perflourinated fluid is a little expensive but this is way cheaper than wiring up a 480V electrical service for a 5 zone oven.
Apr 26, 2006 | wire diameter diminishing due to copper dissolution.
Mar 14, 2006 | Q: Is anyone aware of any solderability issues that may exist when soldering beryllium copper parts (in this case spring contacts) to a PCB using standard Pb63/Sn37 solder paste/wire? beryllium copper
Feb 28, 2006 | the copper of the wire. He recommended a 70Pb/30Sn solder. I bought 10-lbs of it and filled a tinning pot up and it tins the Litz wire beautifully... -Steve Gregory- leadfree solder content to avoid wire being thin I just went through the same problem. We have an inductor that is made with a bundle of 30-strands of Litz wire that is vaccuum coated with varnish, and have the ends of the wire bundles tinned that we have to solder to SMT pads on the board. The inductor that we got from the company that made
Feb 20, 2006 | It appears to us that the problem lies in the lead-free solder paste rather than the inductors. We have not found a lead-free solder that does not do this. The green is on the copper wire. We believe it gets there during the reflow. The gasses from the flux are released and the coil wire has
Feb 16, 2006 | Assuming the AL tape shorts the wires for the thermocouple, you effectively have three junctions at the business end of the wire: wire 1 to AL, wire 2 to AL, and wire 1 to wire 2. If the temperature of the junctions wire 1 to AL and wire 2 to AL are the same (same piece of AL), they drop out
Jan 27, 2006 | Lead free tin copper only Kester is offering a tin/copper alloy for lead free. Any comments regarding using just tin/copper as opposed to tin/silver/copper or tin/nickel/copper? the price is low but why wouldn't everyone else offer just this alloy as opposed to the standard SAC305?
Jan 3, 2006 | what is the cause of green decay on the soldered wires on church copper roofs they call the green stuff verdigree (dont know if ive spelt it right)
Dec 14, 2005 | processes. With electrolytic plating you will have exposed copper on the sides of the traces. The trace is plated ONLY on top with nickel and gold, with the sides being exposed copper. The potential for some serious galvanic corrosion is high. * Electrolytic gold will have differentials in thickness due for Engineering Uses] * Type-I 99.7% gold minimum; hardness grade A, B, or C [For general-purpose, high-reliability electrical contacts, solderability, and wire wrap connections.] * Type-II 99.0% gold minimum; hardness grade B, C, or D [A general-purpose, wear-resistant gold. It will not withstand high
Dec 8, 2005 | what is the cause of green decay on the soldered wires Grant Copper Oxide [Cu2O]: Color is red to a deep red that can appear almost black. Luster is adamantine or submetallic to dull or earthy if massive. Transparency: Crystals are transparent to translucent. Look here: http://mineral.galleries.com/minerals/oxides/cuprite/cuprite.htm Copper salts are green.
Dec 8, 2005 | Hi, Copper oxide is green right? So the green residue after a few days is corrosion of the wire? Regards, Grant what is the cause of green decay on the soldered wires
Dec 7, 2005 | what is the cause of green decay on the soldered wires Would you by chance be soldering copper to aluminum?
Nov 14, 2005 | From Alpha Metals: "The test for copper dissolution was conducted by dipping a pre-fluxed copper wire specimen into the test alloys for a specified time period. The change in diameter of the copper wire is measured and a rate of erosion is determined by the formula: Erosion Rate = [do - df Copper Dissolution
Nov 3, 2005 | does copper wire become thinner when it dip to leadfree solder? the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation
Nov 3, 2005 | does copper wire become thinner when it dip to leadfree solder? Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an intermetallic layer. The rate of dissolution
Nov 3, 2005 | does copper wire become thinner when it dip to leadfree solder? arnold: I did not say that Sn100 dissolved copper faster. The graph of dissolution rates [from the link above] shows that Sn100 dissolves copper slower than many of the other solders.