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assembly Electronics Forums search results
3874 results found for assembly in 5s.
Showing matching items 1 - 50
- 98%
Books for SMT - 1/16/07 -
- ... the line integrated circuit and other semiconductor component assembly and failure analysis laboratories. A few of years ago, ?Wire Bonding in Microelectronics? seemed less relevant to electric circuit board assembly than it does today. Today, the wider acceptance and use of multichip modules and chip on board technologies as mainstream technologies make this book an important tool for practitioners in electric circuit board assembly. Mr. Harmon assumes the basics of operating wire bonding ...
- 97%
CIM systems and Final Assembly - 1/22/01 -
- CIM systems and Final Assembly CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly integration of multiple products into a single system. I suggest one product evaluation test; if final assembly requires a "module" it isn't integral to the system design. Fortunately, systems do exist for handling ...
- 94%
CM SIC code - 5/7/08 -
- ... NAICS Product||NAICS Title||SIC Product 334418||334418||Printed circuit assembly (electronic assembly) mfg|| ||334418P||Primary products|| ||3344184||Consumer external modems|| ||334418A||Printed circuit assemblies, loaded boards or modules||3679E ||334418A1||Computer and peripheral printed circuit assemblies||3679E01 ||334418A2||Communications printed circuit assemblies||3679E02 ||334418A3||Other printed circuit assemblies||3679E03 ||334418SM||Secondary products and miscellaneous receipts ...
- 93%
quoting assembly work - 9/16/05 -
- quoting assembly work We have just launched a new contract assembly house and I was wondering if there was anybody out there that had an honist formula for calculating labor cost for the purpose of bidding assembly work, "is there a good canned software package that actually works for this industry" in our geographic area prices can range by as much as 100% on the same assemblies. what is the average burden rate for an assembly house utilizing automation for SMT and thru-hole, what is an ...
- 93%
Re: DFM / DFT information - 7/13/00 -
- ... checked in file viewer 51 test coupon on PCB containing minimum geometry features 52 trace width sufficient for current carried 53 minimum component body spacing 54 SMD pad shapes checked 55 visual references for automated assembly 56 tooling holes for automated assembly 57 sufficient clearance for high voltage traces 58 component and trace keepout areas observed 59 high frequency circuitry precautions observed 60 thermal relief?s for internal power layers 61 solder paste mask openings are ...
- 93%
Re: Board Warp And Twist - 8/10/00 -
- ... or assembly operations. If stress is present in the board prior to the heating operation it will often result in board warpage. If, on the other hand, the board or assembly is not supported correctly during heating and cooling cycle it will result in the board having stress built into the material. The design engineer should always aim to layout a balanced construction with copper tracking and earth planes balanced from one side to the other of a two layer circuit. Fig 1 Example of assembly ...
- 92%
Philips CSM84V - 3/21/07 -
- ... towards the rear of the jaw to increase reach. Set up and calibrate that head with that chucking assembly. Always use the same chucking assembly on the same head as different chucking assemblies on the same head may need a different head offset in the system files. Simply calibrate each assembly on each head and record the different head offsets for each assembly. When you change assemblies change the head offset to suit. You may need to change the centring height. Your 0402 head will also do ...
- 92%
Contract Manufacturer's warranty policy - 3/21/01 -
- ... parts. Buying parts from Radio Shack you may not want to warrant the assemblies for 5 years. Log and track records of suppliers to ensure quality. A PCB assembly is only as good as the worst part on it. The PCB you are assembling with 400 parts- if one of those parts is guaranteed for 30 days from the vendor, a 5 warranty maybe a stretch. 2) you need to determine the class of assembly, class 1,2,3. Rating the assemblies may be a good benchmark for warranty. This was my point in my first response ...
- 92%
Electro-mechanical assembly specification? - 9/2/08 -
- ... assembly specification? > I am new to the board so be gentle with me. > There are standards such as IPC-610 for PCB > assembly, IPC-600 for bare boards, etc. Is there > a "standard" for electro-mechanical assembly? Is > there an IPC standard or any other industry > approved standard that can be applied for or > achieved? > > Thanks for your help in advance! > I am new to the board so be gentle with me. > There are standards such as IPC-610 for PCB > assembly ...
- 92%
Ruggedized PCB Assembly - 11/21/07 -
- Ruggedized PCB Assembly Need some opinions from you fine folks. We are building assemblies 90% SMT, 10% TH. Fine pitch and BGA devices, etc. The customer is complaining about cold solder joints (SMT) after about 1 year of use, scattered thru-out the assembly, not consistant areas, we haven't actually seen a failed assembly yet, this is what the customer is telling us. The assemblies are visually inspected during manufacturing with no problems seen. The assemblies are used in equipment that ...
- 92%
Re: IPC and Nepcon - 11/18/98 -
- ... Dave F Contact: Dan Green 847-790-5371 FOR IMMEDIATE RELEASE IPC/SMEMA COUNCIL UNVEILS PLANS FOR NEW ELECTRONICS ASSEMBLY PROCESS TECHNOLOGY SHOW Northbrook, IL 11/12/98 The IPC/SMEMA Council has announced plans for an industry sponsored trade show and conference on electronics assembly process technology. The event, yet to be named, is being organized by all of the major assembly equipment suppliers with the leadership of the IPC/SMEMA Council. The event will be launched in March 2000 at the ...
- 91%
Baking assemblies after ultrasonic water wash - 6/9/09 -
- Baking assemblies after ultrasonic water wash We are using a water soluble flux which requires the assemblies to be cleaned in an ultra sonic cleaner after assembly. Is there a standard that specifies how long the assemblies need to be baked/dried after being submersed in a water solution for a given time? The JEDEC J-STD-033 defines baking condidtions prior to board mounting. I do not think this standard applies to finished assemblies after they are washed. Is that a correct assumption? What ...
- 91%
Lead Free BGA's on non-RoHS Assembly - 1/29/07 -
- Lead Free BGA's on non-RoHS Assembly I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free BGA/FPGA process requirements? Will I introduce other potential problems with non-RoHS parts in the design, or should things work out ok for the entire assembly? The one thing I want to avoid is using lead-free ...
- 91%
High TG? - 11/15/06 -
- ... AJ, The biggest mistake in the industry today is documentation for lead free assembly required product. We are still seeing prints coming in saying Lead Free / High TG FR4. When in reality standard FR4 170 Tg. material is considered High Tg. and Lead free but is Not Made to with stand lead free assembly Temps. For Lead free assembly product - it should be calling out High Tg Material capable of with standing assembly temps of 340 C. This would let the board Manufacture know to switch his ...
- 91%
dynamic/static contamination test - 11/2/06 -
- ... a calibrated test solution comprised of IPA and DI water. The test solution extracts contamination from an assembly. In order to determine the assembly?s contamination, one must first know the exact cleanliness (resistivity) of the test solution. Before an assembly is inserted into the test solution, the test solution must be ?cleaned up?, removing prior contamination from the assembly. This ?clean-up? process is accomplished by directing the test solution through ion-exchange resins until the ...
- 91%
SIR starting point...? - 10/21/02 -
- ... Abstract : When searching for common industry-accepted test methods to determine the cleanliness of printed wiring boards and assemblies, most manufacturer?s turn to IPC (Association Connecting Electronic Industries) for guidance. It is common to use IPC-A-610 (Acceptability of Electronic Assemblies) as well as IPC TM 650 (Test Methods of Electronic Assemblies) and it?s methods to benchmark the cleanliness or contamination of a process and product. Unfortunately, a chart listing contamination ...
- 91%
Baking assemblies after ultrasonic water wash - 6/11/09 -
- Baking assemblies after ultrasonic water wash Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different manufacturer) they had problems with water being trapped under the QFP. This lead to problems when the board was powered up. We are in a dry climate wth normal relative humidity levels in the 20-30% range ...
- 91%
Box Build/ Wiring/ Terminal Blocks Assembly Drawings??? - 7/19/08 -
- Box Build/ Wiring/ Terminal Blocks Assembly Drawings??? I have alot of experience creating assembly drawings for SMT and THT products. However, we are now doing very large ,complicated box builds that have many terminal blocks, point to point and cable harnesses. It is my job to create these assembly documents in a very simplified way so that the assemblers are as efficient as possible and potential for errors minimized. I have seen examples of this type of documentation in the form of ...
- 91%
50 PPM - 8/21/02 -
- ... PPM rates per each individual assembly! To do otherwise would be creating an average that smooths out the high and lows, giving you false PPM values. I fail to find the significance of the dollar value of the assembly to be a determining factor as to why one would be proactive in reducing defects, therefore reducing costs. I could produce 10 very expensive boards and have a lower rate of return on my efforts than to fix process problems for a cheap assembly that is produced in the hundreds ...
- 90%
Lead-free PCB: After Effect - 8/22/06 -
- ... compliant if it has a surface finish other than Hot Air. To be ROHS compliant and Able to with stand Lead Free Assembly, this is where the board house would need to switch to a Material with a Higher Td. or De-comp. Standard Material in USA for Lead Free Assembly is Isola IS410 180 Tg. / 350 Td. This material has a different Resin content that is able to with stand the higher Assembly Temps needed to flow lead free paste. IS410 Material Looks like ceramic material and has similar draw backs, its ...
- 90%
aoi - 9/20/02 -
- ... Check out the leader in Electronics Assembly AOI Solutions .....Orbotech.... We can provide you the best AOI technology with fully integrated Repair and Yield Management and Process Control Tools. Our global infrastructure and dedicated Assembly AOI support team will ensure you make the most of your AOI. http://www.orbotech.com/products_assembly_products.html Re: Design Guides - 7/22/98 -
- ... Type, Size, Shape, Panel Requirements, And All Other Printed Circuit Fabrication And Assembly Requirements. Marking Requirements Component Location And Orientation Requirements Engineering Change Notices Concurrent Contract Review Requirements Check List For Manufacturing 1) CONTRACT REQUIREMENTS Bill of Materials Master And Assembly Drawings Acceptance Specifications And Test Methods Assembly Identification Documentation Listing And Control Requirements Business Issues (Price, Delivery, Quality ...
- 90%
Re: CSP Assembly- SIR Test - 12/31/98 -
- ... CSP assembly. I prefer to use no-clean, however, not all components are suitable to use it. Especially those dirty capacitors or connectors which may cause solderability problem. It may the reason someone prefer to use aqueous clean paste. | | | | | | Besides, I want say that SIR test is used to determine the characterize fluxes under high humidity and heat conditions. If you want to know the cleaningness of the CSP assembly. You may need to know the "salt" content under CSP after assembly. If ...
- 90%
Re: CSP Assembly- SIR Test - 12/31/98 -
- Re: CSP Assembly- SIR Test Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.htm). Do you follow the same spec? I suppose that this test method can only be applied on a specific assembly; not general PWA assembly. Please correct me if it is not true. Besides, I agree that SIR test is excellent to ...
- 90%
Clean vs No Clean PCB assembly process - 7/24/01 -
- Clean vs No Clean PCB assembly process Thanks Dave. We develop high-speed telecom PCB assemblies that use uBGA and other fine pitch components. Our policy has been to use an NC process at our CM. Our engineering group, who is also a customer, and uses these assemblies for development, has noted an increase in failures, for whatever reason. Upon inspection of the assemblies they have spotted residue on suspected components or areas of the assembly. I must state, as I have to our engineers that ...
- 90%
software to produce assembly programs - 11/13/07 -
- software to produce assembly programs Hi Try Unisoft (founded 1986) they are reasonibly priced and program your assembly machine from either gerber or CAD - 203-913-0782. The software you need is called ProntoPLACE ( http://www.unisoft-cim.com/pcbplace.htm ). Programs and optimizes PCB assembly machines offline. ProntoPLACE ( http ...
- 90%
What is delta t? - 10/25/07 -
- ... components and your Printed Circuit Board assembly as they go through your heat-induced processes like Reflow and Wave Solder. Thermal gradients are different across an assembly due to thermal mass of your components, and hence different heat conduction rates. Reducing the thermal gradients depends on how efficient your Reflow Oven is at transferring heat uniformly across your assembly. For example, forced convection is known to heat an assembly uniformly and is not sensitive to thermal mass or ...
- 90%
BGA & QFP post reflow inspection - 5/4/05 -
- ... I will explain my problem with this process: In our site we are doing a manually FAI before reflow for every assembly. One of the steps is to check the writing on each QFP or BGA (every component that come in trays) against the writing in the BOM of the same assembly. This step is necessary for our production from the rezone that we are not open the tray bags until the assembly beginning, (moister problems). Sometimes, we had a situation that a tray came from the supplier with different ...
- 89%
Scrapped Boards - 3/25/03 -
- Scrapped Boards Rework and repair methods are: * 7721 - Repair & Modification of Printed Boards & Electronic Assemblies * 7711 - Rework of Electronic Assemblies There are no standards regarding: * Repair and rework of electronic assemblies. * Reclaiming components from scrapped assemblies. This makes sense because those decisions should be based on product end use and customer expectations. So such a prescription that would be correct for consumer goods, would be improper for under the hood. It ...
- 89%
Clean vs No Clean PCB assembly process - 7/26/01 -
- Clean vs No Clean PCB assembly process That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that these assemblies did not have post reflow rework, but appearances of the component solder joints tell a different story. There are still residues on the assemblies in other locations which don't appear to be ...
- 89%
Clean vs No Clean PCB assembly process - 7/26/01 -
- Clean vs No Clean PCB assembly process That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that these assemblies did not have post reflow rework, but appearances of the component solder joints tell a different story. There are still residues on the assemblies in other locations which don't appear to be ...
- 89%
cellular phone assembly - 9/24/04 -
- cellular phone assembly Hi FengAng, Sorry about the misunderstanding - last time I was out there all of the front end SMT equipment was very good, but the final assembly of the phones into cases was being undertaken by hand, whereas in Europe we were seeing a lot of automation on the back end assembly to cut costs. Most of the equipment you mentioned was SMT, are you using Robots for the final assembly (Keypad, display, casing etc)? How are you finding the FCM's in comparison to the Panasonics ...
- 89%
Hand Lotions - 3/4/02 -
- Hand Lotions I don't like hand lotions in the assembly area. If hand lotion is needed I would have the operators use latex gloves or finger cots. The lotion can be transfered to the bare board or assembly causing reliability issues. Lotion transfered to a bare PCB can cause solderablitiy issues. Lotion transfered after assembly can cause dirt to stick to the assembly also causing contamination issues. Lotion also will not allow conformal coatings to adhere to the surface. If lotion is desired ...
- 89%
market statistics on SMT Assembly ? - 12/8/00 -
- market statistics on SMT Assembly ? Hy all, i'm in need for some data about the electronics market: - general Industry Data of SMT and SMT Assembly - SMT-worlwide Production / Turnover - ratio of THT / SMT - Structure of productions cost (Parts, PCB-Assembly, Final Assembly, Investment costs / Labor Costs ..) - ... Can anybody tell me where I can find some of this data ? Thanks Andreas
- 89%
Re: Workmanship Standards - 4/10/00 -
- ... been resolved. Co-produced with EIA. IPC-A-610C- Acceptability of Electronic Assemblies A must for all quality assurance and assembly departments, IPC-A-610C illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. The topics include component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. IPC-A-610 is ...
- 89%
Need SMT Tech - 6/20/08 -
- ... needed: Turn-on and trouble-shooting of printed circuit assemblies Analog trouble-shooting skills supported by a strong knowledge of electronic circuitry and schematic reading capability Proper operation of and experience with test equipment such as oscilloscopes, voltmeters, network analyzers Handling small surface mount components in the repair of printed circuit assemblies Repair and/or modification of printed circuit assemblies, both SMT and through hole technologies The hiring manager calls ...
- 89%
Pb-Free BGA on SnPb Assemblies - 5/1/08 -
- Pb-Free BGA on SnPb Assemblies Good Morning, We are seeing an increased number of our customers that specify a Pb-Free BGA when the rest of the board assembly is SnPb. Of course when we reflow at the SnPb profiles, we don't always get a properly collapsed BGA. So we end up reworking the BGA. We don't run a Pb-Free profile because we don't want to risk damaging the SnPb components. I am sure we aren't the only ones that are experiencing this. So, I have a question or two: What is everyone else ...
- 89%
Assembly Time Standards - 10/19/04 -
- Assembly Time Standards Hello, I am looking for industry time standards for assembly tasks, from SMT to product packing. I was told a few years ago that IEEE had these standards. When I finally looked, they did not exist that I could find. Does anyone know if / where such industry standards exist? I am looking for more manual assembly / mechanical assembly tasks for an Excel based labor quoting tool. Please advise, thanks ...
- 89%
Standards &/or Specifications for PBGA Assembly/Inspection - 9/21/01 -
- ... PBGA Assembly/Inspection In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, ?Design and Assembly Process Implementation for BGA's? Your boards should be assembled in conformance with: * J-STD-001, ?Requirements Soldered Electrical & Electronics Assemblies? * A-610, ?Acceptability Of Electronic Assemblies? As a bonus for you and you alone, use the following to assess your contactor: IPC-1720, ?Assembly ...
- 89%
Re: Double sided reflow - 2/13/98 -
- ... 100 C, typically. This stresses the overall assembly and points to any CTE mismatches. What really is not addressed by people is the thermal cycling that takes place in the assembly process. In essence, the product is cycled from 20 C to about 225C. That is significantly more rigorous than the aforementioned cycle. Because of assembly induced temperature cycles, PTVs under BGAs on thick board assemblies crack and fracture. Component functionality is sometimes compromised. Only six thermal cycles ...
- 89%
Paste Push-Out In PP Assembly - 7/20/00 -
- Paste Push-Out In PP Assembly Bob: On "paste push-out" (when inserting a component lead into a through hole pushes the paste out of the hole) in pin & paste assembly: * What factors affect paste push-out? * What techniques reduce this effect, given a board design and component lead size? Continuing, how do different solder paste formulations and mesh sizes perform in pin & paste assembly? What is the preferred paste formulation and mesh size for pin & paste assembly? Thanks
- 89%
CIM systems and Final Assembly - 1/22/01 -
- CIM systems and Final Assembly CIM systems for electronics are very PCB-centric in that they?re not designed for final assembly. Is there anything available that can take me from assembly to final assembly and shipment ...
- 89%
delamination test - 9/1/05 -
- ... The OEM or Assembly house should be calling out What TG or what process the boards will be going through expecially if it is for Lead free assembly. 3) If they are calling out for Lead free assembly do not just focus on TG, Higher TG does not always mean that it will withstand the New Lead free Temps. You need to focus on T260 & T288 ratings, this will tell you how long the material can handle Temps of 260c & 288c. Our Shop Uses as a Standard Material FR406 170 TG. Leaded assemblies. and IS410 ...
- 88%
Mix Pb and Pb free alloy - 5/24/06 -
- ... discussion on Mixed Assemblies in this forum.. do a search.. you will get whole lot of information.. in addition - IF you are using Lead-free reflow profile...make sure the rated temp for Sn-Pb components is not violated.. - You can go down on the temp if the joint is mixed and still get good mixing of paste and ball along with ball collapse.. - Reliability will always be a concern in Mixed Assemblies. - So far I have not been able to eliminate voids in mixed assemblies... I maybe wrong, but I ...
- 88%
Solid Solder Deposit - 8/10/04 -
- ... replacing traditional assembly methods but, has found its way into many seembly environments where it has shown tyo be without equal. It is better known in the US as SIPAD or Precision Pad Technology. SIPAD ssd is the original ssd developed at Siemens in Germany. PPT is a second ssd technology that was developed after SIPAD but came to the US first. It is great for single sided boards, but you will have to use a glue/wave process or something else for second side assemblies. This is true but ...
- 88%
Geometric Dimensioning and Tolerancing - 6/6/98 -
- Geometric Dimensioning and Tolerancing GEOMETRIC DIMENSIONING AND TOLERANCING (GDT) Using and applying GDT to printed circuitry and assemblies is very much like applying it to any other design for manufacturing (DFM) or design for assembly (DFA) requirement using concurrent engineering (CE) principles and methods. This means, the designer must be able to convey product requirements, as drawings with clearly defined dimensions and tolerances, to those making product. It also implies the designer ...
- 88%
CSP/BGA Assembly Solutions - 1/4/99 -
- ... a good article on CSPs in general (High Speed Assembly with CSPs by Julian P. Partridge & Vern Solberg). I've seen some different volumes than what they show, but we did use different aperatures) & have also found that there is a big difference in the volumes you will get on a small board and a big board, even with a dedicated fixture. K. Hi PTT! | As CSP and BGA packages become more and more popular, I want to know if anyone get problem to assembly CSP packages. | | Currently, most CSP use ...
- 88%
Flux Compatibility Issues.... - 6/6/06 -
- ... not all, hand assembly, we use additional flux. We use a flux pen in certain applications and liquid flux in other applications - you can't just say switch to a flux pen, it isn't always adequate. Most flux pens are ORL0 with very low solids content. The liquid flux is more often ROL0, with a higher solids content, but can still be classed as no-clean. We run a no-clean process, but any flux added for hand assembly is always cleaned. No-clean flux in your paste, or wave assembly process that has ...
- 88%
PCB Material - 2/24/06 -
- PCB Material TM, When picking a material for your lead free assembly you need to think about a couple of things, The standard Material in the US that is being used is running 140 - 170 tg. material. But for lead free assembly you need to focus on is Decomp temp (TD). or at what temp does this material start to de-lam. With lead free assembly especially during Wave solder the temps will have to be higher than normal Lead processing which can put this type a material at its upper limits and open ...
- 88%
Gerber Data Extraction - 11/2/04 -
- Gerber Data Extraction Smart Sonic has an entry level component to our StencilScan AOI system called the Assembly Module GT. The Assembly Module GT is low cost and will get the job done. Plus, the Assembly Module GT can be upgraded easily to the other Assembly Module products that include the ability to scan boards, create Gerber data & placement data, ability to scan components and create vision files for placement machines, first article inspection, etc. There is some information on our web ...
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