Electronics Forum | Mon Sep 23 02:54:40 EDT 2013 | pradeep_selec
We are using Dpak package & I would like to know which is the best Aperture shape for DPAK, whether is there any problem if the Aperture of Ground pad is made of the same shape & size as the pad & what are the possible issues faced with it. Can I hav
Electronics Forum | Tue Sep 24 10:09:52 EDT 2013 | leigh
Windowpane your ground planes, this will prevent a lot of voiding.
Electronics Forum | Mon Sep 23 09:55:12 EDT 2013 | emeto
Hi, just for the package you have you will see 20 different designs for the ground pad. Some will be 1:1 with the part some will be 3 times bigger than the part ground contact. I would always print according to the part and will always do a windowpa
Electronics Forum | Fri Oct 11 16:25:43 EDT 2013 | scdunlap
Also coplanarity can be poor on these parts so overprinting the paste (beyond the pad perimeter) can increase volume to insure robust solder joint.
Electronics Forum | Fri Jul 06 04:55:59 EDT 2012 | ccgooi
I have fabricated a artwork of stencil on a mylar and make comparison on PCB and Stencil in order to confirm if there is any PCB stretching at both end. The results are comparable for both stencil and PCB without any stretching . So,I assumed that th
Electronics Forum | Thu Oct 30 15:36:18 EDT 2008 | grantp
Hi, Sounds like your engineer does not know what he's doing. We have developed and built hundreds of thousands of boards with normal square pads for 0402, and we just use a 5 thou stencil with 5% reduction and it works well. Decoupling? What is tha
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Wed Mar 09 19:51:28 EST 2005 | KT
Greetings: I would like to know the common land patterns and aperture shapes that are currently in use. We are doing some research on the same. Please respond to the thread if you have a success story with you current design. Thanks KT
Electronics Forum | Thu Mar 10 14:31:56 EST 2005 | KT
Thanks for the info. Appreciate it.
Electronics Forum | Tue Jun 04 22:46:21 EDT 2002 | davef
Factors to consider are: * Squeegee speed * Squeegee pressure * Separation speed * Stencil thickness * Stencil aperture fabrication method * Stencil aperture shape * Paste type * Stencil under-wipe frequency Search the fine SMTnet Archives for a thr
