SMT / PCB Assembly Electronics Manufacturing

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SMT Process Engineer

Jul 19, 2002 | ... Surface Flaws. Modeled pipe joint using NISA software. Relevant Graduate Courses Robust Design ComputerImplementation of FEA (ANSYS) Design for Manufacture Computer Aided Engineering (I-DEAS) Design of Experiments Electronics Packaging Project Management Database Management and Communication Graduate Projects Analysis of thermal stresses in a Turbine blade using ANSYS: The project involved modeling and finite element analysis of turbine with application of indirect coupling. The results ...

FEA Engineer

Feb 4, 2000 | ... Corporation, Binghamton, NY, where my research has primarily been in the area of Finite Element Analysis (FEA). Here, I have had the opportunity to perform non-linear thermo-mechanical analyses for complex electronic packaging assemblies using ANSYS 5.5. I also worked at C&D Technologies, Inc., Conshohocken, PA as a summer intern where my work involved the extensive use of AutoCAD� R14 for the preparation of assembly and part drawings. United States Johnson City ,Engineering,Research and ...







 
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