Electronics Forum | Mon Feb 13 13:19:35 EST 2006 | pjc
ECD's OvenRIDER is the only instrument I know that can measure thermal transfer efficiency of a an oven. I suppose it would work for environmental chambers too. This instrument has thermocouples to measure ambient temp of oven zones and well as hi-ma
Electronics Forum | Thu May 27 13:45:24 EDT 2004 | pjc
An ECD OvenRIDER is an instrument designed to measure and record reflow oven parameters. It�s the only instrument I know that measures thermal transfer efficiency. www.ecd.com Contact your local ECD rep and they may have a demo unit they can bring
Electronics Forum | Wed Jan 21 11:46:39 EST 2004 | pjc
Forced Convection delivers the most efficient thermal transfer.
Electronics Forum | Sat Feb 21 11:59:22 EST 2004 | Ken
sphericity and consistency are important. egg shaped, dog-boned shape snd tear-drops work against you and promote clogging and in-effective "transfer efficiency". One of the most signifficant factors will be brand/type. Not all fluxes are created
Electronics Forum | Mon May 24 12:54:25 EDT 2004 | pjc
Maybe here's an opportunity to get a new oven. Electrovert, BTU and Vitronics offer closed-loop N2 control as an option. This, together with other improvements on oven design can reduce N2 consumption by as much as 40%. Not to mention reductions in e
Electronics Forum | Mon Jan 04 23:15:35 EST 1999 | Kris Ewen
Where I worked, we used 0.014" square aperatures (several mfgs. have proven the benefits of square & I've seen a better transfer efficiency myself). Some mfgs use smaller edge lengths & have had success. 0.005" thick stencils give better transfer e
Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake
Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Wed Dec 10 14:03:56 EST 1997 | Scott Cook
| I would appreciate hearing views on vapour phase soldering particularly in respect to BGA's. | I know that they used to use CFC's but apparently this is no longer the case? | Can anyone help with some info? | Thanks, Alan Brewin Alan, Unfortunately
Electronics Forum | Mon Oct 30 09:47:56 EST 2006 | pjc
If you are using VOC free flux, then forced convection preheats are better at evaporating the water. That may be why you're getting the "splatter". Plus, forced convection preheaters are most efficient at thermal transfer. See if you can get one to p
