Electronics Forum | Fri Apr 12 15:10:00 EDT 2002 | jsherrow
IMHO it's caused by three things: 1) placement 2) placement 3) placement
Electronics Forum | Thu Apr 11 16:37:16 EDT 2002 | pteerink
Profile would be the first place I look. Check your rise and fall rates for temp. Should be no more than 2 deg/sec for rise and 4-6 deg/sec for cooling. Phil
Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect
We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Thu Jul 15 14:01:15 EDT 2004 | nanref
WERW HAVING PROBLEM IN OUR PRODUCT SINCE WE STARTED USING A LEADFREE SOLDER PASTE..REJECTS OF TOMBSTONING IS SO ERRATIC...HOPE YOU CAN GIVE SOME INPUTS HOW TO CONTROL THIS..WHAT IS THE POSSIBLE CAUSE?THANKS
Electronics Forum | Thu Jul 15 15:37:29 EDT 2004 | davef
Get started by searching the fine SMTnet Archives. We love talking about tombstoning and solderballs. Good luck.
Electronics Forum | Thu Feb 16 12:41:50 EST 2006 | fredericksr
Hey folks, I was interested in any information that you might have on tombstone reduction when using a lead free solder and profile. Thanks for any input that you may have! -Russ #x
Electronics Forum | Fri Feb 17 09:02:21 EST 2006 | russ
proper pad geometries, accurate placement, and good reflow profile. Are you having problems right now?
Electronics Forum | Fri Feb 17 11:01:47 EST 2006 | amol_kane
with lead-free solders, one would expect to find less instances of tombstoning. this is because SAC alloys are not eutectic and melt over a range of temp (usually 217-220 deg C) instead of at a single temperature. therefore the forces due to solder s
