Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef
You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1
Electronics Forum | Wed Aug 24 16:30:48 EDT 2005 | davef
Optical microscope or SEM work fine. You say, "I have found out that the method of measuring intermetallic compound(IMC) formation is quite questionable." What's the issue?
Electronics Forum | Wed Aug 24 04:07:31 EDT 2005 | Khoo Meng Tze, Freescale Malaysia
Hi, I am doing a research on the solder ball joint strength of lead free PBGA package. Coming across a dozen of literatures and journals(and the industry itself), I have found out that the method of measuring intermetallic compound(IMC) formation is
Electronics Forum | Wed Aug 24 08:54:30 EDT 2005 | patrickbruneel
SEM to determine thickness and spectrum analyses to determine the metals forming the IMC. This will give you everything you would want to know.
Electronics Forum | Thu Aug 25 04:55:32 EDT 2005 | Khoo Meng Tze, Freescale Malaysia
Hi, Whenever I'm measuring IMC using the optical microscope, I have to make sure that the images captured are clear. If not, then i will have an issue in differentiating the blurry areas between the IMC and solder(for example). This gives variatio
Electronics Forum | Mon Sep 18 18:17:56 EDT 2017 | chintan
IS there an IPC standard or equivalent which specifies the maximum thickness of intermetallic compounds (IMC) in a reliable solder joint?
Electronics Forum | Mon May 20 22:13:45 EDT 2013 | ultimatejoker
So u mean it is to form the intermetallic compound which is (Cu,Ni)6Sn5?
Electronics Forum | Thu Sep 21 20:59:55 EDT 2017 | davef
There is no standard minimum / maximum IMC thickness. * There needs to be an IMC * Thinner IMCs are preferred over thicker IMCs
Electronics Forum | Tue Oct 24 11:56:44 EDT 2017 | babymythird0421
As far as I know there is no standard thickness minimum or maximum thickness. It depends
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
