|
| Subscribe to the SMTnet Express |
|
|
|
| Link to SMTnet |
| Tell everyone you know about SMTnet! You can add this small image to your Web site and provide a link to us. Click here to learn how. |
 |
|
|
|
 |
6012 Electronics Forums search results
27 results found for 6012 in 1s.
Showing matching items 1 - 27
- 82%
Shrinkage in paper phenolic pcbs - 8/23/02 -
- ... For Printed Boards * IPC-6012A w A#1 - Qualification & Performance For Rigid Printed Boards ? but if you didn?t call-out 6011 & 6012 in your procurement documents, it?s kind of moot. Many fabricators are up-front with their tolerances and tell their customers what to expect. Many of these are posted on the web. Without drilling into the specifics of your case, 6012 allows considerable reduction in conductor spacing on rigid boards. What is normal is debatable. What is acceptable should be ...
- 80%
PCB Burned after reflow? - 3/5/09 -
- PCB Burned after reflow? Solder mask requirements: * IPC-6012 and IPC-SM-840 contain detailed specifications and information regarding solder mask requirements. * IPC-A-600 defines acceptability of printed boards [analog of A-610 for board assemblies]. Why can't you use A-610, 10.0 Laminate Conditions as the basis for accepting your 'toasted' board ...
- 80%
1oz Copper Sheet Specifications - 12/9/08 -
- ... the IPC minimum data is probably safest. So for 1 ounce copper, is the typical "nominal" value that is used to specify the copper weight. Third, while nominal thickness is 36um (1.4thou) per 1 ounce of copper, in real life, inspect for a total surface copper thickness of 0.0024" (0.0010" minimum foil thickness after processing + 0.0014" copper plating on the surface). Continuing, this is the 0.0010" final copper foil thickness is discussed in IPC-6011/6012 for 1 ounce starting copper weight ...
- 80%
SMT Processing and gasketing - 11/11/08 -
- ... Class 1, 2, 3: Defects do not meet the above critera. Now, being from the middle of the back-end of the pack of the SMTneters from an astuteness stand-point, even we sense that's not the answer you were hoping to find. So, we checked IPC-6012 - Qualification & Performance For Rigid Printed Boards, just in case. Here's what we got for you ... 3.8.3 Solder Resist Thickness. Solder resist thickness is not measured unless specified in the procurement documents. If a thickness measurement is required ...
- 80%
looking for HASL TIN thickness specification - 9/2/08 -
- looking for HASL TIN thickness specification IPC-6012 Table 3-2. States "Fused tin-lead or solder coat - Coverage and Solderable". The lack of any specific dimension criteria doesn't make this any less a requirement. There must be complete coverage of solder on the land, and it must be wettable ...
- 80%
warpage dtandard - 8/24/08 -
- warpage dtandard For an nate measurement method, look here http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.22c.pdf For bare boards, look to IPC-6012, par. 3.4.4 For assemblies, look to IPC-A-610
- 80%
Gold thickness - 7/11/08 -
- Gold thickness Thanks Dave, IPC-6012 states min at 0.05um. Has this been a update or is it for a different class? thanks, aj ...
- 80%
Criteria for Min Thickness regarding Large and Small pads - 6/30/08 -
- Criteria for Min Thickness regarding Large and Small pads It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it must be wettable. If you want uniform solder thickness with HASL, you should make all the pads the same size. Any HASL thickness: * Less than 2 micron has a limited shelf life * Above 5 micron ...
- 80%
PC Board Guidelines - 9/18/07 -
- ... Does the change from supplier to supplier as a result of: * Board definition? * Differences in processing at fabs? 3 Specification Fir Tree General Technical Specification 3a Design/Layout: * IPC-2221 * IPC-2222 3b PCB Fab: * IPC-6011 * IPC-6012 * IPC-4101 * IPC-A-600 3c PCB assembly: * J-STD-001 * IPC-A-610 IPC-1730A, Laminator Qualifier Profile Are you a laminate manufacturer looking to provide your customers with a consistent, detailed report on your facility(s)? IPC-1730A is the one tool ...
- 80%
Scratches on BGA solder resist - 2/27/07 -
- Scratches on BGA solder resist IPC-A-600G, 2.9 Solder Resist [Solder Mask] [snip]"Solder resists are used to limit and control the application of solder to selected areas of the printed circuit board during assembly soldering operations and are sometimes used to reduce dendritic filament growth[s] between conductive patterns over the printed board's base material surface. Detailed specifications and information regarding solder resist requirements are contained in IPC-6012 and IPC-SM-840."[snip ...
- 80%
PCA shipping requirements - 11/28/06 -
- PCA shipping requirements Choices are: * IPC-RB-276 [superseded by IPC-6011/6012], Section 5 discusses some basic shipping and packaging requirements. Also, it references ASTM D-3951 and MIL-P-116. * Universal Instruments has done a nice job putting together a packaging specification. It outlines the requirements for prepairing, packaging and transproting production parts from, within and to their facilities. SMD flatness standard - 11/20/06 -
- SMD flatness standard Sorry for stating this incorrectly. It should been: Bow & twist for bare boards and panels: IPC-A-610 Acceptability of Electronic Assemblies, 10.6: 1.5% for PTH only and 0.75% for SMT, acording to test method TM-650, method 2.4.22 IPC-6012, par. 3.4.4 Surface Mount Product: 0.75% of PCB diagonal measurement = 0.0075 inch / inch All Other Product: 1.5% of PCB diagonal measurement = 0.015 inch / inch
- 80%
IPC STANDARDS FOR HOLE POSITION - 9/9/05 -
- IPC STANDARDS FOR HOLE POSITION Look for discussion of breakout in: * A-600 * A-610 * 6012
- 80%
Ionic Contamination - 11/10/04 -
- Ionic Contamination You can start with J-STD-001 for assemblies or IPC-6012 for Bare Boards ...
- 80%
PCB cleanliness test house in Malaysia/Singapore - 11/2/04 -
- PCB cleanliness test house in Malaysia/Singapore We are looking to have some PCBs (bare and assembled) independently tested for cleanliness. Our mfg facility is in Malaysia. Can anyone recommend a test house capable of testing to IPC-6012, IPC-5701, etc ...
- 80%
HASL on Pads - 6/14/04 -
- HASL on Pads HASL Thickness: * HADCO DFM manual specifies a nominal thickness of 50-1500uin with an option for 100-1000uin * Merix DFM manual specifies 30-200uin IPC-6012, Class 1, 2, 3 do not spec a HASL thickness at all but only require that full coverage is made and that the board meets solderability requirements. We'll bet money that those unHASLd, copper areas will not take solder. Get rid of the boards ...
- 80%
via masking - 12/13/01 -
- via masking There is neither ?nominal thickness? nor ?is there a set maximum? for via masking. We use some of our vias as test pads. So, as you?d expect, we get rabid when we get mask bleed onto these pads. IPC-6012 - Qualification & Performance For Rigid Printed Boards * 3.8.3 Solder Resist Thickness states words to the effect of: ? solder resist thickness is not measured unless specified in the procurement documents. * 3.8.1 Solder Resist Coverage talks to things like: - Metal conductors shall ...
- 80%
We're gettin' the standard! - 5/31/01 -
- We're gettin' the standard! See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-610
- 77%
Plugging of via through holes - 7/23/08 -
- Plugging of via through holes Q1. Is this a standard process for plugging? A1. Not as such. We checked both IPC-6012 and IPC-SM-840. Neither comments on plugging. So, your fabrication notes rule the day. Q2. Is this okay for such thick PCB's or is it mandatory to use a special plugging paste? A2. What ever works is OK. This doesn't work. The aspect ratio limit for plugging is 6:1, for most fabs. Your boards are 8:1 [assuming the 3.2mm thickness and via diameter of 0.4mm are finished numbers]. So ...
- 77%
How to choose IPC in PCBA manufacturing? - 10/29/03 -
- How to choose IPC in PCBA manufacturing? The possibilities are dizzying, aren't they? In our dingy fog, if we don't understand your requirement, say so. 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-610
- 77%
Hasl thickness trends - 9/16/03 -
- ... at school have one!!!"?] Instead of saying, "Yes, Dear Customer, you are correct. I messed-up and didn't deliver as promised. I'm sorry. I'll make it right. And I will never do that again." Second, way, way, way-down in order of precidence; IPC-6012, Classes 1, 2, 3 do not specify a HASL thickness, but require full coverage and that the board be solderable. Third, further way, way, way-down in order of precidence; last time we checked: * HADCO DFM manual specifies a nominal thickness of 50 ...
- 77%
Re: Qualifying new PWB Vendors - 1/15/99 -
- ... detailed information concerning all the above and more, address IPC-D-275 (now, I believe, 2221 and 2222) for quality conformance test circuitry requirements. For evaluation and qualification testing, use the old MIL-P-55110 or its new equivalents 6012 and 6013. For test requirements, procedures, and methods, hire me or, better yet, call an independent military or industry test laboratory nearest you. You've seen a neat lady, representing Robisan test labs. She's a good place to start or go to ...
- 77%
Re: FR4 vs Polyamide - 2/15/99 -
- ... has about the same Z axis expansion rate of from 50 - 60 ppm/C. as FR-4. However, the time before the cookie crumbles is extended because of its high Tg. Concerning any type soldering operation, polyimide meets or exceeds MIL-P-5510 (now IPC-6012) thermal stress and shock testing requirements. Therefore, it will survive all well managed soldering operations. It should be noted that this material has a lower foil/pad/trace bond strength right out of the bag. It ranges from 6 - 7 lbs versus most ...
- 77%
Re: Suspected Pink Ring - 7/28/99 -
- ... locations. Then, qualify the pink ring/delamination as acceptable or not, or is it really what we're talking about. Third, use the thermal stress test requirements in IPC somewhere, now lost to me after the demise of 55110 days. It may be in 6012 or 650. Someone keeping track of all this stuff knows. Anyway, perform the test using a specimen prepared as required and perform the solder float test at 550 degrees F. for 10 seconds. Then, pot the specimen and examine it in accordance with whatever ...
- 77%
Re: PCB fab supplier supplier/evaluation - 8/8/99 -
-
- 77%
BGA Processes - 4/19/01 -
- BGA Processes Few beer drinking Ozzies drink Foster's. Foster's is brewed FBG [Foster's Special Bitter] Breweries in Toronto, Canada. The whole "Foster's is Australian for beer" thang is concocted for very nice people [including Brian].
- 77%
via as test point - 2/26/01 -
- ... Task Group (D-33d) "will develop acceptance criteria for protecting plated-through holes, blind and buried vias. The work of this task group will be [has been] submitted to the Rigid Board Performance task group for inclusion in the IPC-6012 B Revision." [Maybe some can status us on this effort.] Finally just to cloud the issue completely, a study done [in the distant past] by Roger Wild at IBM showed that an unfilled via was most reliable, a completely filled via was almost as reliable as an ...
|
|
|
Back to the Top
