SMTnet.com Electronics Manufacturing Forum http://www.smtnet.com/Forums/ Printed circuit board assembly, surface mount technology and electronics manufacturing forum discussions from SMTnet.com. Wed, 01 Jun 2016 07:16:33 GMT Ekra X5 setup http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18137 We purchased an Ekra X5 at auction a while back to replace our semi-automatic stencil printer. We bought it knowing the following: it was running when removed, it had no manuals, screen or keypad (as I've seen on other ones). I'm trying to put together a plan for testing this machine prior to deciding whether or not it's going to be usable for us. Does anyone have a manual? It was manufactured in 2003, if that helps. Tue, 31 May 2016 15:39:58 GMT Conformal Coat http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18801 Not exactly SMT but something I recently did that might save you lots of time and money: Complex high $ assy that has 25+ conformal coat keep out areas - most different shapes. All locations are dimensioned on customers' print. We tried a one piece masking fixture but it just didn't work well due to the complexity. Too leaky, too much maintenance so masking tape is only option as we don't have a fancy programmable conformal coat machine. So, I designed frames and had them cut by stencil house. Frames sit on assy, aligned by tooling holes; they outline all specific masking tape locations. Next (here's the biggest time saver), I cut all the masking tape shapes on our programmable laser wire stripper. It has a 4"x 4" window and I was able to cut all the shapes in a half day - probably 1,000 or more pieces. It would have taken 2 or 3 operators all week. Bam!!! Easy money. Hope this gives you an idea or two. Tue, 31 May 2016 11:35:12 GMT Contact systems series 3 for sale http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18808 Hi all Reader, I have two contact systems machine, one is 3AVX-100 and other one is 3AV-80 with many feeders. I want to sale these machine for spare parts. Anyone, who interested in is, please contact me for further detail. Regards, Tue, 31 May 2016 08:21:44 GMT electrovert omni excel7 http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18811 Tue, 31 May 2016 06:08:45 GMT Omni excel 7 http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18810 Tue, 31 May 2016 04:53:10 GMT Desiging a Board from sratch http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18809 Hi experts, I am new to board design, and have some question please guide me, I have a hardware design Idea, which needed 2 connect a sensor with an MCU, so i have 2 PCBs (both evm) 1:- How should i start to make a single PCB using both (removing few components)? 2:- Should i first create 1 PCB, test with MCU evm then make a PCB with both? any software tools suggestions. Note:- Basically i have only Schematic diagram, i outsourced PCB design only (sensor part ) Tue, 31 May 2016 01:52:39 GMT DEK Galaxy CAN Node Not Responding Error http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18807 Hi Folks, I'm having issues with our dek Galaxy which is randomly having and reporting the error CAN Node Not Responding. Has anyone seen / fixed this error before? Mon, 30 May 2016 20:17:54 GMT PCB delamination http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18803 We have recently had a jig get caught in the chain of the flowsolder machine, causing the board to delaminate, is there any hard and fast rules as to if the area needs evacuating due to fumes, and if the air quality has to be checked before allowing the workers back into the site? Fri, 27 May 2016 15:05:21 GMT topaz x bring back component http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18805 how are you. I have a problem with a table that the issue errori topaz. The issue is the message "Bring back component." a problem with the pick up parts vacum setting level is 100 and the current 111 with vacum head is 6. Can u tell me how to Calibrate? Fri, 27 May 2016 13:20:06 GMT Quad 4C laser align calibration http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18799 So, I haven't used my Quad 4C for a while and when I started everything back up to run a new board it appears that the Quad align is in need of calibration. When I pick up a component and do an LAE measurement on it it shows the part center location to be off by about 80 mils in both X and Y. I have tried re-measuring the shaft/nozzle with function 30 which reports what I believe are reasonable values but component measurements still read off center. This is a big issue since when I actually do a run the components are then getting placed ~80 mils off center but with various rotations about the desired placement point. So, does anyone know how to either re-calibrate the Quad align or compensate for the offset? BR, Steve Fri, 27 May 2016 09:27:56 GMT GSM XS placement not consisten http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18804 Fri, 27 May 2016 05:46:49 GMT Hi anyone have recommended pcb manufacturer? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18483 Hi anyone have recommended pcb manufacturer? My require: quick delivery time; best quality; affordable price; best service; PCB Assembly provided Wed, 25 May 2016 14:09:47 GMT Quad Feeder Issue http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18789 I have at least 10 identical 8mm feeders I received recently that all have the same issue when snapped into a base. Both indicator lights illuminate, and the directional buttons do nothing. These feeders also appear to have been serviced recently as all the plastic has been repainted, and they have identical labels with "New Reel, Upgraded 04-02" handwritten. Anybody experience issues similar, in general (hoping it's not as bad as my assumption (bad EEPROM))? Or would anyone know who would have serviced them? Wed, 25 May 2016 10:01:59 GMT Quad Feeder Programming - ThinPRO 2mm Index http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18783 I recently purchased some used ThinPRO precision feeders for my Quad IV-C (PPM 4000C). They are in great shape, but I do not know how to program them to index at 2mm Does anyone have experience with these that know how to program them? I can only go as low as 4mm with the instructions I have. Wed, 25 May 2016 09:46:02 GMT User manuals for Philips topaz and eclipse http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18796 Hi everybody, right now we are having a second hand machine of philips. the topaz and eclipse and unfortunately it dont have any manuals and no one from our team knows that machines. so im looking for anyone could give any user, programming and parts manuals in a pdf format. Thanks for all for any help.. Wed, 25 May 2016 07:20:26 GMT 85K grant. How best to use? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18790 Hello, We are about receive an 85.000 USD award grant towards purchasing manufacturing or testing equipment for our company. We are trying to figure out how to best use this grant. Here are short facts about us: We are a design house, so all our manufacturing is currently outsourced. To give you an idea of our output: for 2016, we will have about 15 different designs produced. 10 of these will be new designs, and will be produced in qtys of 30 to 50. 5 of the designs are validated already and will be produced in quantities of 400-1500 each. A total of 7000 boards will be delivered to customers in 2016. Most boards are "complex": A quick survey shows our most common boards have about 50-140 unique and a total of 250-600 components. Most of the passives are 0402 size. Most boards have at least 5-6 BGA devices (0.5 to 1mm pitch FPGA, DDR, Processors etc) and a few QFNs. Our current pain points: - We wait for what we think an unreasonable time to get an open "slot" in our assembly partners' factories. If we could get at least the prototypes built in-house, it would be great. - Testing!: We currently only do functional testing. For a long while, we thought our volumes are not enough to invest in any other testing systems. - Rework: Especially for initial prototypes, sometimes there is a lot of rework that needs to be done during bring-up. For complex rework, we send the board out to the assembly house, so we lose a lot of time. Our thoughts on how the money can be invested: - Basic pick and place setup : Perhaps a manual or semi automatic stencil printer, a "basic" PnP machine (Dima ATOZ pp-050 or Essemtec Lynx/Fox) with enough feeders, and a basic reflow oven. - Invest in even more basic production setup: A dispenser, a table-top reflow oven, etc. - Invest in quality rework equipment. - Keep all production outside of our company, instead, invest in testing systems: ICT, JTAG, etc. I'd love to hear about what you think how to money should be spent. Thank you, Please note: - No used equipment purchases are allowed for this grant. - 85K figure is just the grant amount, we can obviously invest more if we can justify the ROI. Tue, 24 May 2016 15:39:04 GMT Multi Cluster Optimisation using HLC software for Juki http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17363 Anyone have any idea how to use the HLC software and in particular the Production Planning side whereby you can cluster a number of sides or Jobs? I want to fix side 1 of a program and optimise side 2 around side 1 fixing common parts and then filling the gaps with the remaining parts therefore giving a common setup for both sides meaning 1 setup for both side? Mon, 23 May 2016 16:42:31 GMT Ekra E5 Camera Y Stop Error http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18794 Im having trouble with and Ekra x5 machine. It works fine when up being run constantly, but if it sits for 10-15 minutes when you try to move the Y table to the front of the machine it makes a loud sound as if the table is hitting/catching on something or the motors suddenly stop. We then get the error message: Camera Y stop sensor behind the transport rail not found. Any advice helps thanks Fri, 20 May 2016 12:14:25 GMT Auto calculate Aperture are on stnecils http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18793 Hi All I have a need to calculate the Aperture area in a stencil with in a very short time without going in to a CAD viewer. I need that when I insert solder paste file in to a certain software application and that application software calculate the area of each Aperture in the stencil and output a single value of the total area covered by the Apertures. Thanks in advance for any information, Milroy Fri, 20 May 2016 08:04:30 GMT We are now building 48 inch (1200mm) SMT assemblies. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18628 We finally got our long board line up and running. As a Contract Manufacturer, of course, we are at the mercy of our customers. I'm wondering if anyone else that is producing these large assemblies might have any advice on handling or any other pitfalls we might encounter along the way? Fri, 20 May 2016 07:17:42 GMT PCB Thermal Design Considerations http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18792 Fri, 20 May 2016 03:42:44 GMT PCB Thermal Design Considerations http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18791 With power components coming in smaller and smaller surface mount packages it is very important to come up with a coherent approach to mitigating the thermal dissipation requirements of these components in a PCB design. While the development of an exact mathematical analysis of the thermal characteristics of a PCB Design can be a complex process, it's possible to apply some simple rules to improve the thermal conduction of your design. Ultimately, properly controlling the dissipation of heat in your design will allow you to produce a more reliable and economical PCB design. What follows is a brief discussion of the standard thermal dissipation model and then some general rules for dealing with thermal dissipation in your designs. First it is important to define the terminology that is going to be used through the rest of this entry. The next figure presents the different components to a power IC that we must consider when discussing thermal management. We will be discussing the temperature of the Junction, Top and Case of the component and their thermal resistances to the ambient environment through out this article. With these terms in hand, we will briefly look at the standard model used to simulate the thermal dissipation of a component. Thermal resistance is normally modeled as a resistor network. The standard model for a component is presented in the following figure: In the presented figure TJ is defined as the temperature of the junction (the internal working portion of the component), TT is the temperature of the "top" of the package (typically the plastic enclosure of the component), TC is the temperature of the "case" (this is the temperature of the highly thermally conductive pads of the component and the attached PCB) and TA is ambient environment's temperature. The goal of the electronics designer is to then produce the lowest thermal resistance possible between the junction and the ambient environment. With the exception of ?CA, the thermal resistances of the system (?JT, ?TA and ?JC) are defined by the properties of the component and can be pulled from the data sheet for said component. As a PCB designer we principally have influence over the value of ?CA, which is dependent on our PCB design. As such, the primary challenge for the designer is the reduction of the thermal resistance of the IC's case to the ambient environment by reducing this resistance. How well we are able to lower this thermal resistance (?CA) will largely define the temperature differential (or lack thereof) that will develop between the ambient environment and the junction of the component. Of note is that the other path for thermal conduction is the plastic case (or the "top") of the component. As the plastic packaging of most power components do not provide a good thermal path to the ambient environment the efficiency of thermal dissipation of the design is more heavily dependent on the design's ability to dissipate thermal energy to the surrounding environment through its case. The only exception is when the power IC in question is designed with a thermal pad located on the top of the component. In this case, the IC is designed for a heat sink to be attached directly to the top of the IC and the thermal dissipation of the component through its "top" becomes a much more important factor in the design. The standard approach to translating heat away from power components is through thermally connecting the power components to adjacent copper planes by way of thermal vias. This is typically achieved by placing a number of vias in the foot print of the power IC. These vias provide a thermal connection to the copper layers below the IC, which then conduct heat away from the component. Additionally, the more power copper planes connected to the power IC by said thermal vias, the higher the efficiency of the thermal dissipation of the PCB. For example: using a four layer design vs. a two layer design can increase the power dissipation capacity of a PCB up to 30% when comparing two designs of the same area. The following design rules are provided as a good starting point for approaching the thermal considerations of your design. In order to dissipate 1 watt of power a good rule of thumb is that your board with need to have an area of 15.3 cm2 or 2.4 in2 per watt dissipated for a 40°C rise in board temperature. If the board is subject to airflow this requirement can be cut in half (7.7 cm2 or 1.2 in2 per watt). These values assume that the component is thermally coupled to a copper plane that extends to the edges of the board and that the board is positioned so that air can flow freely around both sides of the board. If these power density requirements are too constrictive for your design, the inclusion of an external heat sink may be required. Also, a 40°C temperature rise is a good starting point to consider when controlling your circuit board's temperature. Whenever there is more than one power component being placed on a board, it is best practice to place those components in such a way that your PCB is being evenly heated by these components. Big temperature differences across the length of you PCB design do not allow your PCB to optimally translate thermal energy away from the mounted power components. If available to the designer, thermal imaging can allow for the empirical inspection of your component placement once a design revision is complete. The more vias that you can place below your component the better your PCB will translate thermal energy to the connected copper plane. Array vias to increase the number in contact with the power pads of your package (the large thermally conductive pads of the component). In designs that dissipate higher wattages you will need to use higher copper weights. One ounce copper is recommended as a starting point for power designs. When utilizing a copper pour to dissipate thermal energy away from a component it is important that the pour not be interrupted by tracks that run perpendicular to the thermal path away from the power component. If a heat sink needs to be utilized to keep the temperature of the system in tolerance it is of note that the heat sink will typically be much more effective if placed in such a way that it is thermally connected to the case of the component. This typically means attaching the heat sink to the opposite side of the board from a surface mounted component. While it may be tempting to place a heat sink directly on the top of the component, the thermal resistance of the components plastic case will render the heat sink ineffective. As noted above, the exceptions to this rule are packages explicitly designed to have heat sinks attached to their "tops". In summary, the thermal performance of a design is very important to consider whenever you are working with power components. Using the design rules presented in this article early in the design process of your PCB will allow you to get a good head start on controlling the temperature of your PCB and allow you to avoid drastic redesigns later in the development process. <a class=roll href="http://www.allpcb.com" target="_blank">http://www.allpcb.com </a> Fri, 20 May 2016 03:41:04 GMT AOI false calls with 3D AOI http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18761 Hi All, I've been told that 3D AOI machines are a solution to the false calls that you get on a 2D machine, but I don't really see how the depth information can help in eliminating false calls for unreadable markings, misregistered parts etc. For soldering defects I'd say yes, it will probably help, but inspecting solder joints is something that 2D machines have problems with anyhow. Any input will be highly appreciated. Thu, 19 May 2016 05:25:54 GMT PCB with stains bleach after flux aqueous wash http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17943 we received assembled PCBs with spots that look like a bleach spots all over the PS and CS . The board house said that this is normal due to flux aqueous wash process. Can it cause problems (e.g. corrosion ) in the long run or cause issues when working in extreme temperature environment? Thu, 19 May 2016 03:39:04 GMT PCB with stains bleach after flux aqueous wash http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17943 we received assembled PCBs with spots that look like a bleach spots all over the PS and CS . The board house said that this is normal due to flux aqueous wash process. Can it cause problems (e.g. corrosion ) in the long run or cause issues when working in extreme temperature environment? Thu, 19 May 2016 03:39:04 GMT