SMTnet.com Electronics Manufacturing Forum http://www.smtnet.com/Forums/ Printed circuit board assembly, surface mount technology and electronics manufacturing forum discussions from SMTnet.com. Tue, 31 Mar 2015 15:30:06 GMT smt costings http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18024 Hi Guys, I have been given the dreadful task of looking over our SMT costing to make us more competitive in the industry, I am suffering with the cost per comp, I am assuming that the equation: Loaded cost divided by placement rate should land me somewhere near where I need to be, I am looking for further suggestions that would tie up any doubt in my assumption....any other guidance would be gratefully received. Tue, 31 Mar 2015 09:58:29 GMT LGA Rework http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18019 Hi, I need to replace a LGA component from assembled boards. What are the best methods (automated ones preferred) for this process? The main issue is how to apply solder paste for the fine pitch (0.4mm) on assembled board. Thanks, Eliran Ave Tue, 31 Mar 2015 08:18:32 GMT BGA Rework (Top side heat only!) http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17970 I was handed the task to develop a process to solder a BGA using topside heat only. It is a long story so I will spare the details, but I was wondering if anyone has ever attempted this? I have been going at it for a few weeks with fair results, but the process window seems very tight. Also, what is a good test to verify good solder connection on the BGA? Is there a simple one? Mon, 30 Mar 2015 12:52:45 GMT Japan Unix Destop Soldering Robot http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17957 is anybody using Japan Unix Destop Soldering Robots? I will appreciate if you have any feedback on this kind of equipment. Regards, George Mon, 30 Mar 2015 12:13:53 GMT FUJI CP7 & CP7 & FLEXA http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18004 I am setting Fuji Flexa to communicate with CP8 machine. When I create a new machine, I has to fill out the following value Machine Communication Server: ? Get Production Data : (yes/no) GEM Host Name: ? Disable GEM : (Yes/no) TCP/IP Port #: ? I can not find these information in the flexa reference manual. Could someone help me? Thanks, -Michael Fri, 27 Mar 2015 12:50:35 GMT What to look for in a BGA Lab analysis http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17991 Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different samples to a lab analysis, my question is what should I ask the lab to look for? a) Voids level? b) Inter-metallic layer? c) ball shape? what would be a typical requirement for lab analysis? Saludos! Fri, 27 Mar 2015 10:16:33 GMT Quad 4C MK2, Z axis drift http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18009 Hello everybody Lately our machine has been working pretty well, but it can’t last too long. Now, during this week’s production cycle, it began to increase the component’s reject rate to alarming levels (obviously the operators reported me when the machine became unable to place components at all). Trying to arrive to a diagnosis, I ran Function 30 and 31. I found that NOZZLE HEIGHT readings vary from each Function 30 run to the next, its figure diminished by one or two mils each time. I located a height gauge on the top-end of Z-rod, firmly fitted to the chassis with a magnetic stand. X-Y axis to 0,0, static. After each F30 run I physically checked the zero Z position and it remain constant despite the Nozzle Height variation of readings. I’m looking for a smaller gauge to attach it directly to the head casting and read the actual movement of Z axis at any X-Y position, now I just can check 0,0,0 coordinates. Just after RESET, Function 31 runs fine when I put a component by hand on the nozzle tip. ST1 and ST2 read 1Q85 and the component’s dimension appears. After the Z axis start to drift, ST1 and ST2 reads 30Q65, the X-Y dimension read equal, about 45-60 mils, which correspond to the nozzle tip diameter. I checked the Up and Down End optic sensors, clean and OK. All the mechanical parts: motor, pulleys, belt, screw, bearings, etc. are Ok. The movements are smooth, no slack, non sticky areas. Flex cables prima facie seem to be fine, however I did not examined them in depth yet. I did not detected lose or faulty connectors (not yet, at least). Laser head is a Quad Align type, it was provided by PPM in mid 2013. It has less than 300 run hours and is clean and well cared. Align system version is 1.6C. I have explored the whole forum in order to find any precedent about this phenomenon, but I was not lucky. Any help or advice shall be appreciated. Thanks. Thu, 26 Mar 2015 10:42:16 GMT Dendritic Growth http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18021 Hi guys, i do not have a lot experience on this wave solder process, in my plant now i have the opportunity to work in this area, and a lot issues are been happening on the process and it could be possible that i request information about this, i hope to have a support from You. I saw some topics about the process and is interesting for me to know a new things. Is the flux the root cause of the dendritic Growth? Regards. Wed, 25 Mar 2015 20:44:18 GMT BGA epoxy removal http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17963 Hi, my name is Dacian, and i run a mobile phone repair shop in Timisoara, Romania. Lately we decided to do more advance motherboard repair jobs, and a big problem that we have is, cleaning the board after we remove the chips. We repair manly iPhone, iPad and Samsung boards, and all of them have some kind of epoxy under the bigger BGA chips. The Apple ones have a black, type epoxy that when heated becomes kinda less hard but, almost every time we try to clean the space where the new chip will be mounted we damage some pads. Currently we are heating the spot to 200+ C and scraping with a sharp tweezer, this is very time consuming and many times the pads get damaged. On the Samsung ones the epoxy is a clear type that is not so rigid, but also it is very hard to get off the boards. I have been searching the web for a solution for this, but did not find anything. Maybe some more skilled forum members have a solution, or at least a better way of doing this than we are doing now. Thank you. Wed, 25 Mar 2015 03:27:13 GMT CP-743 tape problem http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18015 We have a CP-743 and recently purchased another one. I would like suggestions on tapes. The only thing that slows the machine down is tapes on reels getting stuck and/or jammed. Does anyone have suggestions for this problems or how do you keep this to a minimal problem. Thanks. Tue, 24 Mar 2015 09:23:54 GMT Dual Lane SMT Processing http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17967 We're a Tier-1 Automotive Supplier, manufacturing here in the Good Ole U S of A, and I'm in the processing of putting together our newest SMT Line. This new line will be a dual lane SMT Line. I've been in the industry a long time, and have put together quite a few SMT Lines, but this will be my first Dual Lane Line. I've done some research already, but thought it would be a good idea to ask all of you fine folks for your input. We've already purchased our Dual Lane SMT Placement equipment, so I'm really just looking for layout ideas for the peripheral front end and back end equipment. Does anyone have some experience in this area that they would like to share? Mon, 23 Mar 2015 15:46:23 GMT Common Problems When Learning Electronics? Ideal Solutions? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18023 Hey guys, I'm an electronics enthusiast, and I'm thinking of starting an electronics blog where I can share content that people learning about electronics will find useful. I find that a lot of the educational electronics resources I come across offer good tutorials, but don't go into enough detail into how and why something works the way it does. I'm hoping people can share some of the other common problems they encountered when learning electronics and the sort of 'learning resources / online content' they wish had been available to them at the time. It would be great if this starts a lively discussion with people sharing common problems and ideal solutions, as well as their favourite online tools and resources, and everyone involved being able to discover something new of use. Mon, 23 Mar 2015 10:58:42 GMT Select soldering of Galvanized shield http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18022 Has anyone out there experienced selective soldering of a shield that is galvanized rather than tin plated? Our supplier is worried about tin wiskers with the bright tin finish. Soldering with SAC305 and a pretty weak no-clean flux. Sorry, I don't know what the base metal is at this time. Thanks in advance for your help! Mon, 23 Mar 2015 08:04:51 GMT Soldering LCD Flex to PCB http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17986 Hi We are trying to Solder LCD Flex to PCB. Few suggested Z-Axis Film (Conductive tape) which can be stuck between Flex-PCB and bonding by applying hot soldering iron across the flex. Is this effective method. If there is any other option, please suggest. Thanks Fri, 20 Mar 2015 10:28:52 GMT PCBA Id using Laser marking http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17989 I'm looking for laser marking equipment for direct serial number Id on PCBAs. Is it recommended to laser mark on solder mask or copper or raw material? Fri, 20 Mar 2015 10:26:05 GMT Pictures of SMD failures http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18020 <a class=roll href="http://www.semlab.com/blog/" target="_blank">http://www.semlab.com/blog/ </a> Thu, 19 Mar 2015 16:51:39 GMT Mydata magazine repair http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18016 Hi everyone. I hope someone or many someones can offer guidance. I have many magazines that have various problems. (Not feeding and/or not pulling tape on some slots) Does anyone have any information for repairing or troubleshooting these? It seems like the electronics of them work correctly. I think most issues are mechanical. I have one magazine that has a feeder spot that appears to be frozen, but the other slots work fine for a while until the magazine stalls. If the electronics are bad, I will send to Mydata for repair, but I think I should be able to fix mechanical failures. Any info is appreciated. Thanks. Thu, 19 Mar 2015 10:49:20 GMT CP8 PLACING 01005 http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18018 What nozzle size do you use to place 01005 on Fuji CP8 machine? The smallest nozzle size on the CP8 is 0.4mm. Could we use this nozzle to place 01005 since the size of 01005 pacakge is 0.4mm x 0.2mm. Thank you for your help, -Michael Thu, 19 Mar 2015 10:42:53 GMT Pin headers (Solder shorts) http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18017 Hi We are running a board on Leaded Wave with Universal carrier and getting solder shorts on 16x2 Pin header connector almost on all boards. Header details: <a class=roll href="http://res.abtronics.ru/pdf/285/920/759/abtronics_FHSS16G10_0.pdf" target="_blank">http://res.abtronics.ru/pdf/285/920/759/abtronics_FHSS16G10_0.pdf </a> (Double - PHDS32G11) Tried almost all possible wave settings. No luck. Please suggest what would be best solution to avoid this issue. And also please tell me why am getting this issue especially on this component. Have attached image of PCB (Solder side). Thanks Wed, 18 Mar 2015 19:45:16 GMT HELLER 1707 EXL http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18014 Oven is not turning on. No heat. Can hear relays clicking. Any help would be kind..... Wed, 18 Mar 2015 10:09:04 GMT Water-soluble flux vs test socket cleaners? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18007 Hello. I would like to know the difference (if any) between water soluble flux and test socket cleaners (e.g. for Burn-In Board test sockets). As far as I know, they both remove oxides (tin & copper) with an activator, solvent and surfactants. Thank you! Mon, 16 Mar 2015 21:03:00 GMT SMT Reflow temp http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17968 I'm new in this industry and need a little direction. I have a wide verity of SM parts on a board, top and bottom. The larger components have a very nice reflow, good shine. The 0402/0201's has a dull almost cold solder look. The boards function and work properly but I am not satisfied with is look. I have a Heller 7 zone oven that allows me to make a profile to match the kester solder reflow profile. where should I go for more information to insure a good product. Mon, 16 Mar 2015 13:35:20 GMT CP7 & CP8 http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18003 CP7 & CP8 has a ftp server. Do anyone know the user name and password to login? Thanks, -Michael Mon, 16 Mar 2015 13:27:36 GMT starting set points for SIMPLE single zone Reflow Oven http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18013 soldering a very simple board in a very simple Accuheat oven. Can anyone give me basic starting point settings (conveyor speed and temperature) then we will profile using a mole from there. Paste 1) Tin Lead Paste 2) Chipquik low temp TL 165C PR Mon, 16 Mar 2015 12:44:36 GMT Flux wave on PCBs http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17999 Hi I have been struggling with boards for high quality picky customer. I am getting flux waves (like splashed - too hard to clean) after wave, where as we are still using Kester 979 (No clean flux, but as we are getting visible marks which looks similar like dross with flux. I have attached images for reference. In image that's definitely not solder. Its flux and please suggest how to avoid this issue. I have tried changing, flux supply level / pre-heat temps / variant conveyor speeds / solder pot heights. But no luck. For IMAGES : <a class=roll href="http://www.keepandshare.com/doc12/show.php?i=2595013" target="_blank">http://www.keepandshare.com/doc12/show.php?i=2595013 </a> Please help me to solve this. Thanks Sat, 14 Mar 2015 15:48:40 GMT