SMTnet.com Electronics Manufacturing Forum http://www.smtnet.com/Forums/ Printed circuit board assembly, surface mount technology and electronics manufacturing forum discussions from SMTnet.com. Fri, 28 Nov 2014 13:18:20 GMT Calibrations jigs for Yamaha P&P http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17805 Does anyone know where can buy calibration jigs for Yamaha P&P machines (Glass QFP68,16,208 , etc) Thu, 27 Nov 2014 06:47:19 GMT Water in TH cap sleeves http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17826 We have a lot of large through hole caps and we run everything through a wash process. Unfortunately water makes it's way inside the sleeves that the caps are shrink wrapped in. Has anyone found a way to prevent this from happening? We are running at 125 psi and 140 degrees water temp Wed, 26 Nov 2014 19:10:05 GMT MPM UP2000 Driver Cards Failing http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17823 We have an MPM UP2000 stencil printer and have a lot of issues with burned out 6410 driver cards (or driver cards just failing to work). I have looked over these threads and found that this is a common issue with these cards. I understand that these cards are old and are hard to come by (they are also expensive!). So we don't want to have to keep replacing them when they fail. My question is - are there any suggestions to a method in which I can modify or add additional circuitry to these boards in order to protect them from destroying themselves? Things that I have noticed: Sometimes, the motor output connectors become charred when they fail which indicates possibly too much output current to the motors? Quite often, one of the slow-blow 15A fuses blows simultaneously to the motor card failure - which supplies DC voltage to the cards in the lower drawer of the UP2000. The motor current must be set according to the particular axis using the DIP switches on the board. Some of these are 3A, 4A and 5A. For example, for "Squeegee Down", the motor requires a setting of 3A so the DIP switches are set to 3.125A. When jogging this axis in Calibrate mode on the UP2000, I have been measuring currents up to 3.4A - which is outside of the rated drive current for this setting (as specified in the 6410 user manual). Could this be causing the driver card to work too hard and thus burn out? I have thought of installing additional in-line fuses or a current limiting circuit on the outputs of the driver cards to prevent over-currents but considered that when the printer is in operation, if one of the axes stops working and the computer doesn't recognise this and continues its cycle, could it cause physical damage to the machine itself? Any thoughts or suggestions would be greatly appreciated. Wed, 26 Nov 2014 18:17:26 GMT How to convert eagle files to gerber files http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17820 Hi all, It is a big trouble for me does anyone know if there are any fast way to convert Eagle Cad .brd pcb files to Gerber pcb files? Wed, 26 Nov 2014 15:33:57 GMT Placement tolerances (CM402, CM212, CM602) http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17818 Can anyone provide me with the accuracy of placement for CM402, CM212, and CM602 machines? Wed, 26 Nov 2014 15:01:07 GMT Royonics assembly http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17825 Does anyone in the U.S. still service these machines or have parts for them? Wed, 26 Nov 2014 13:02:39 GMT Accounting for Dumped/Lost SMT Parts http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17817 Everyone deals with a number of loose SMT parts during production. These usually come from machine attrition (dumped parts), a few parts that are lost during feeder tape changeover, dropped inside the machine, etc. I will categorize them as: A. Identifiable parts over a certain cost. B. Non-identifiable parts over a certain cost. C. Identifiable parts under a certain cost. D. Non-identifiable parts under a certain cost. The goal is to maintain accurate inventory counts to eliminate running out prematurely and to avoid unnecessary cost, whether it is raw part cost due to overbuying and/or cost of sorting and hand placement. How do most companies out there account for these dumped/lost parts (A, B, C and D) and what do you do with them? Thank you in advance. Wed, 26 Nov 2014 11:53:53 GMT Ekra 4000 vs DEK Horizon http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17824 Which printer should I choose to medium volumes, many BGA, will use built-in inspection. Will not acquire any SPI. EKRA 4000 or DEK Horizon. Wed, 26 Nov 2014 05:12:06 GMT SPI and after market squeegees http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17822 Has anyone looked at SPI results across different squeegee blade manufacturers ? We are running Momentums and using the MPM pro-blades. Ive been considering looking at permalex blades again to see if I can maybe squeek out some better yields. Tue, 25 Nov 2014 12:48:31 GMT Fuji Flexa install http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17821 Hello, I had my flexa computer died I got a new computer a 4 port digi port usb to DB9. I have a CP743 that I can talk to just fine (It uses RJ45 connection). I can not talk to either one of my IP3 or my CP4 I get a nickname error when I try to pull or put proper's in the machine. Has anyone else had this problem or might know a fix. Thanks David Tue, 25 Nov 2014 10:46:19 GMT Quad QSV-1 http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17819 I have a Quad QSV-1 machine. It has been off for over a year with no power to it at all. I found out that I lost the BIOS on the machine. I have two QSV-1 with the serial numbers one apart from the other so I copied the bios from one to the other and found that the machine will home and I didn't loose any programs that were in the machine. I can't change to another program or get the conveyor to move either. The message says (Tep1-send command failed) Does anybody have any ideas? Tue, 25 Nov 2014 08:36:32 GMT Solder Balls at component side around Pin in Paste components http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17800 Hello, I'm fighting with problems of random solder balls that appears after reflow soldering around Pin in Paste component. I'm mounting this component with Pick and Place machine. I'm using solder paste type-3 and this is lead free product. This is one side board. Product it's not protected with any extra layer (i.e. coating) in further steps so it's not acceptable for customer. I'm doing a little over print during paste printing for this component to achieve proper volume of solder paste after reflow. Do You know any Expert/Master that it's not corelated with any solder paste, equipment manufacturer that could review my process and indicate area to improve? Tue, 25 Nov 2014 05:20:20 GMT through hole questions http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17809 So we all know through hole assembly hasn't been completely eradicated. I am doing some research as to the types of through hole assembly that still remain. My questions are related to through hole requirements and past, current and future methodology for this type of assembly. Is your current level of through hole assembly more, less or the same as 5 years ago? If more or less, how much more or less (i.e. 10% less)? Are you OEM or CM? What method do you use for through hole assembly...fully automated, semi-automated (light guided hand assembly), manual (slide line)? If semi-automated or manual, what method do you use to trim the leads? Are your assemblies fully through hole or mixed technology or both? How many through hole components average per PCB (or panel)? What method do you see as the preferred method for the future and why? For example, if lot sizes are decreasing will you see more potential for semi-automatic guided assembly etc.? A lot of through hole assembly today consists of larger devices (connectors, transformers etc.). Do these present new challenges such as holding the components in place during soldering? Any and all feedback is appreciated. Thanks, Greg Sun, 23 Nov 2014 20:37:36 GMT stencil --- what's is a stencil's life? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17813 Hello, Can anybody tell me what is the life span of a stencil? How many stokes on the stencil is the maximum count to have PREDICTIVE maintenance on the stencil.Thanks Fri, 21 Nov 2014 10:35:56 GMT Spartan wave solder machines --- buying decisions help http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17815 Greetings, I am looking into buying a wave solder machine for medium production of 100% through hole boards (~8.5"X12" dimension, not many layers, no high density part areas, <50 boards per 8 shift, usually run 5-10 at a time). I am looking at a new Spartan BEN Z-400-F wave solder machine because the low price for a brand new machine is attractive. I have not seen much of these being sold used and want feedback on: how they perform, reliability, parts/technical service accessibility, and if this is the right size machine for what we run. Any other feedback on reliable, inexpensive wave solder machines would also be appreciated. Thanks, Joe Thu, 20 Nov 2014 18:57:52 GMT Is NO CLEAN better for High Speed PCB's? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17816 Hi All, I have a customer with a very dense design (24 layers, 0201's lots of micro-BGA and lead-less), and they run extreme data rates. Every once and a while they will have a unit that has some speed fall off and they attribute that to the possibility of contamination being trapped under a lead-less power supply, and causing some impedance changes in the high speed data line. Currently the assemblies are run with water soluble organic flux and cleaned multiple times during the process with an aquastorm with the hurricane option and di-water. We are confident that the cleaning that is done is as good as can be done with water soluble flux. The customer is pushing us to try using No-Clean as a possible solution to the impedance changes they sometimes see. We tend to run no-clean on high volume, simple products that run and are shipped with little fuss. I don't have a lot of experience with using no-clean with dense products, covered with micro-BGAs and 0201's. Can anyone share an opinion on the possible benefit or issues with using a no-clean on dense assemblies and if there may or may not be affects or benefits to doing so on high data rate designs. Part of my concern is that if they think there may be contamination causing an impedance change that the amount of residue left with No-Clean may be even more. Any insight is most appreciated. thanks Thu, 20 Nov 2014 17:46:48 GMT GemLine PPS Line registration --- Which OS should be used? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=16664 I am just being introduced to GemLine and Assembleon. I have been trying to get the programs on two other computers so we get more work done. One is windows 7, the other is vista. I was unable to get PCP explorer or editor installed on the windows 7, but they are installed on the vista os. Now how can I go about registering these lines? Whenever I try to register a line and type in the name, it opens up an excel file that is completely blank. I am completely new to this software, can anyone help point me in the right direction. Thu, 20 Nov 2014 09:04:58 GMT Multi Cluster Optimisation using HLC software for Juki http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17363 Anyone have any idea how to use the HLC software and in particular the Production Planning side whereby you can cluster a number of sides or Jobs? I want to fix side 1 of a program and optimise side 2 around side 1 fixing common parts and then filling the gaps with the remaining parts therefore giving a common setup for both sides meaning 1 setup for both side? Thu, 20 Nov 2014 06:11:16 GMT How to strengthen the ability of anti-interference in PCB design http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17814 To get the best performance of electronic circuits, components and circuit board supports circuit components and devices in electronic products. Even if the circuit principle diagram design is correct, the printed circuit board is designed improperly, which will have a negative impact on the reliability of electronic products. When the printed circuit board is designed, we should pay attention to the correct method used to be in accordance with the general principles of PCB design. And conforming to the layout and arrangement of wire anti-interference design requirements part is very important. In order to design good quality, low cost of the PCB, should follow the general principle of the following: Layout First, consider the PCB size. When the PCB size is too large, the printed lines will be long, the resistance will also increase, which will decrease the ability of anti noise and increase the cost; when it is too small, then the heat is not good, and the adjacent lines are susceptible to interference. It is better to first determine the PCB size, and then the special element position. Finally, to carry out the layout of all the components of the circuit according to the functional unit circuit. In determining the special element position must comply with the following principles: 1* as far as possible to shorten the connection between high frequency components, trying to reduce the electromagnetic interference between their distribution parameters . Components that are susceptible to interfer are not too close together, and the input and output elements should be kept away from each other. 2* There may be a higher potential difference between certain components or wire, so the distance between them should be increased, so as to avoid accidental short circuit discharge leads. Components with high voltage should be arranged in the debugging place where the hand can not touch. 3* Components whose weight is oover 15g should be fixed with the bracket before welded. Those big, heavy and with much calorific value should not be installed on the printed circuit board, but in the chassis backplane of the machine, and shall consider the problem of heat dissipation. The thermosensitive element should be far away from the heating element. 4* The layout for those adjustable components like the potentiometer, adjustable inductance coil, variable capacitor, a micro switch etc should consider the requirements of the structure of the entire machine. If it is the inner machine adjustment, they should be put on a certain place on the printed circuit board where it is convenient to adjust; if the outer adjustment, the location shall be compatible with the adjusting knob on the panel of the case position. 5* The position occupied by the printed circuit board positioning hole and the fixed bracket should be left. Thu, 20 Nov 2014 04:02:02 GMT What methods do you use for final packaging? Bubble Wrap, bags, trays? Anything unique? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17812 Hi All, I've been in the CM world for a long time and it seems like there has been little change in the packaging techniques used at the end of the day. Assembled circuit boards in small/flex volume are bagged or bubble wrapped and boxed up to ship (if not going into an upper level assembly). Larger volume can use clam shells, reusable carriers or sometimes still go with the bubble wrap and box. Lots of manual labor and sometimes not enough thought is put into it. Is there anyone using anything automated or semi automated in the assembly protective packaging of assembled circuit boards? Anyone making their own bubble wrap on site? My thought is one could possible heat seal bubble wrap around an assembly, similar to a shrink film but without the shrink. Having an easy and more efficient way of packaging than tearing off sheets of bubble all day. What methods do you currently use? Any new ideas? Open for input and conversation. Wed, 19 Nov 2014 18:43:04 GMT Fuji CP3 teach fiducials mark or check part placement http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17793 Hello, Thanks help me to fix this CP3 and now it is running great. Do this machine CP3 has capability to teach fiducials mark and check placement part on the board?. I have the operating manual and program manual. but I can't not get the TEACH display on the machine nemu . In the manual show press PROGRAM > ETC then you see TEACH. But I can't see it. Do my machine need to update the software or chane some thing in the Proper program?. I'm using MCS16 computer. So far the machine runs great , But take me awhile to move to correct fiducial location Thank you Wed, 19 Nov 2014 10:57:55 GMT Stencil aperture http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17811 Wed, 19 Nov 2014 03:12:36 GMT Panasonic Panasert SPPV solder paste screen printer --- need password Level #1 http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17773 Hi everyone, hope you can help me with this machine I bought used and after it is set up , it runs good, home position. I can click the tab Start, and Setup. But I can't click the tab I/O , edit or system. Because, I think I can't log in the Level 1, it is required pass word. Please any one know about this. The pass word is from Panasert or from old customer. it is also when I switch the hard drive # 2 it ask pass word of level 3. thank you Sony Tue, 18 Nov 2014 21:18:29 GMT AMS 3.0 Build 30068 --- Assembleon XP OS to WIN7 WIN8 http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17799 Hello, I'm currently using the AMS 3.0 Build 30068 software to program my assembleon MG1R and Topaz XII's. The software is currently running on XP and would like to upgrade the OS to win 7 or 8. Is anyone successfully running a newer version of AMS on Win 7 or 8. Thanks in advance. R Tue, 18 Nov 2014 15:37:58 GMT DFM software --- what to choose? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17803 Need some help, i'm just new with design and I need to know what software is out there that can answer all my question: able to generate/create correct stencil aperture; Can modify/ edit or redesign the main file(ODB++, Gerber, etc); Can generate centroid data from Gerber,CAD, etc. ;Can compare 2 different Gerber file; Can check correct pad design and Can perform DFM verification. Appreciate the help.Thanks Tue, 18 Nov 2014 13:34:00 GMT