SMTnet.com Electronics Manufacturing Forum http://www.smtnet.com/Forums/ Printed circuit board assembly, surface mount technology and electronics manufacturing forum discussions from SMTnet.com. Sat, 30 Apr 2016 22:35:16 GMT Hi anyone have recommended pcb manufacturer? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18483 Hi anyone have recommended pcb manufacturer? My require: quick delivery time; best quality; affordable price; best service; PCB Assembly provided Sat, 30 Apr 2016 11:34:23 GMT DEK 265GSX " Board Stop not retracted" http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18723 Hi, I have DEK 265GSX. Just got error message " BOARD STOP NOT RETRACTED" Any help would be greatly appreciated. Thanks Fri, 29 Apr 2016 22:35:01 GMT Need small quantity of chemicals for PC board fabrication http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18719 We have in-house PCB fabrication capability for items such as simple single-sided prototype boards, copper shields and copper stencils for our paint shop. We are having difficulty acquiring small containers of chemicals, especially developer and stripper. Manufacturers are selling these chemicals in large drums only, where we only use 1-2 gallons per year. We are using Kepro etching equipment. Does anybody know of a source for small quantities of chemicals for PCB fabrication for home or small business that would work in Kepro equipment? Yes, we can outsource, but there are some advantages to having limited capability in-house. Thank you! Fri, 29 Apr 2016 08:28:12 GMT We are now building 48 inch (1200mm) SMT assemblies. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18628 We finally got our long board line up and running. As a Contract Manufacturer, of course, we are at the mercy of our customers. I'm wondering if anyone else that is producing these large assemblies might have any advice on handling or any other pitfalls we might encounter along the way? Fri, 29 Apr 2016 08:26:32 GMT Topaz Xll tall components http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18532 Good Day for Everyone! TOPAZ XII can handle 6.5mm height components easily. Is it possible to mount 10mm? The problem is that the picked high component pushes away other placed high component. Camera alignment works well. Please share your experience :) Thu, 28 Apr 2016 17:08:01 GMT Selective Soldering Nozzle Life http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18681 Mainly for ERSA machines, but I welcome other machines info also. What are you guys getting in regard to nozzle life? I am running an ERSA 3/45 with 4 solder pots in it. 2 lead solder and 2 leadfree. I'm very pleased with the nozzle life I'm getting currently, but have nothing to reference it to except my old 40/50 that was replaced. My lead soldering nozzles are dating back to 4/15 and 6/15. The leadfree nozzles date back to 8/15. Thu, 28 Apr 2016 16:55:44 GMT Where buyer order smt parts? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18663 Where are you buying SMT Parts? Alibaba? Made in China? Or SMT net? Or google? Thu, 28 Apr 2016 16:48:54 GMT Automated Stencil Wipe http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18726 Would you use dry wipe or wet wipe procedure for your Stencil Printing process? Whichever you use would you please let me know the benefits of it? Thank you in advance. Thu, 28 Apr 2016 13:27:29 GMT First PCB Printing Process http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18727 I am curious to know if anyone using Mylar to print solder paste on first PCB to make sure your print process is accurate. Can you please give me some info. Thank you. Thu, 28 Apr 2016 10:35:29 GMT Feeder Type http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18714 Hy, I do programs pick & places Samsung . I have a line consisting of a sm471 and sm482 ! to make progamas and optimizes them use easyOlp 6.0.19.1 , these machines use electrical feeders that is SM8 for 0805 SM12 for circuits . My problem is that when I open the program on the line and open the configuration of the components feeders station as SME8 And SME12 , and the machine not assembling if it is not one by one change to the correct feeders! Does anyone know why this? i have others Samsung lines and this not happens! Thu, 28 Apr 2016 04:01:31 GMT Require Specification of Prime Virgin Mercury 99.999% Min purity http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18722 Lead (Pb) <100 Silver (Ag) <50 Zinc (Zn) <200 Cadmium (Cd) <90 Copper (Cu) <120 Antimony (Sb) <130 Gold (Au) <75 Nickel (Ni) <90 Cobalt (Co) <100 Chromium (Cr) <110 Iron (Fe) <200 Molybdenum (Mo) <150 Vanadium (Va) <100 Arsenic (As) <300 Assay (%) ……………………………………99,999 Non volatile matter……………………………<0,001% Nitric acid insoluble matter ………None in visual examination. - CAS Number : 7439-97-6UN Number : UN2809 - Packing : Packed in Standard New Steel flask/cylinder with 34.5 kg (net) in each flask UN-approved with lacquered interiors and transported on wooden pallets or in wooden boxes in a container. - Product Origin : Spain - Minimum Order Quantity: 100 Flasks Contact me on Email: <a class=roll href="mailto:wasatrasitltd@gmail.com">wasatrasitltd@gmail.com </a> Skype me on Dr.AHMED Wed, 27 Apr 2016 15:00:17 GMT IRC/TTE MELF resistor failures http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18673 The program I'm working on is having endcap metallization/resistive element failures. These are on MELFs manufactured by IRC/TTE (MCHP). A sister program is having the same issues. They pulled a couple of date codes and did visual examination and 60% of the resistors had endcap metallization flaking. I did a search of the archives and their was another post from 2003 with the same issue (IRC CHP). Anyone else having this problem now? The big question is what could cause this? Simple answer is contaminated surface preventing adhesion. Funny thing is, the metal glaze operation moved in 2012 from one location to another, and the problem followed. So process related. Any brilliant insight would be greatly appreciated. Wed, 27 Apr 2016 12:12:22 GMT Selective Solder Pot Leaded - Next Steps? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18711 My company bought a used EBSO SPA 400-F selective solder machine at an auction. At the time we bought it we were not sure what kind of solder it was. So we had the solder sent in and analyzed, and it was leaded instead of lead-free. What options do I have since leaded solder cannot be used in any of our processes? There are a couple things I could think of off the top of my head. Fix it: Try to take the leaded solder out and replace with new lead-free solder. Not sure if this is worth the effort or hazards that would come with it. Getting the lead content to below 0.1% as required by RoHS might be troublesome. Maybe there are companies that could do this if this step is dangerous? Buy new pot: See if there is another solder pot that is empty or lead-free for buying...probably too costly. Sell it: We could sell the whole machine, and buy another used one that is lead-free (sounds kinda silly to me). Tue, 26 Apr 2016 11:03:40 GMT Tin Lead Silver BGAs http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18718 Hello SMTnet team, I have read before that silver content on solder joints is ok at around 2% total silver content. Does anyone has experience using SN62/PB36/AG2 BGAs on hard gold (10 micro inches) PCB surface finish? Any drawbacks? Thanks Joel Tue, 26 Apr 2016 09:29:26 GMT gas to extend allowed print-to-place time? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18713 Hi, is there some sort of gas (certainly refrigerated, possibly pressurized?) in which printed boards can be stored to extend the allowed time between SMT paste printing and placement? Or other technique for achieving this? Background: we're a small research shop with an unusual job that requires a very special printing setup and very thick stencils with area-ratio-violating apertures. Reconfiguring the printer for this job and cleaning those superthick stencils afterwards is a huge undertaking, and it's really killing productivity to have to do a full printer setup/teardown each day. We'd like to be able to print a week (or more) worth of boards even if that requires investing in specialized storage. Is there some way to do this? The boards in question have a very large number of LGA landings with very tall paste deposits (8mil stencil). There is a huge amount of paste on each board. Paste is Kester EP256 (leaded). Previously we were using Loctite GC10, which can actually survive a whole week on the board with excellent tack+reflow... pretty amazing stuff. But GC10 is too sticky to use on stencils thicker than 4mil (jams up the apertures, incredibly hard to clean) and for this particular job we need a low reflow temperature. Since we only buy Kester paste for this one job we don't really have a contact at Kester and the reseller we buy it through is not terribly attentive since we buy so little of it. So "ask the paste vendor" does not work here. Experiments show that the EP256 can last 24 hours print-to-place easily, but at 48 hours print-to-place we start getting small numbers of defects (the place-to-reflow time is very short, just a few minutes at most). Thanks, Tue, 26 Apr 2016 03:26:21 GMT Land Grid Array soldering http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18697 I am working on soldering an Large LGA module to a PCB and am having some issues with opens due to variation in the board flatness. I have tried adding more paste but get shorts and excess flux as I get above a 7 mil stencil. I have tried adding solder balls to the module with good results. The problem there is that it is capital intensive and requires changes to my testers. Moving back to a solder paste solution I was wondering if anyone has used a larger partial size paste. Does anyone make a type 1 or 2 paste for electronics applications? Mon, 25 Apr 2016 09:15:18 GMT The Right Way To Undergo a Very Happy Local Shift http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18717 Moving is a shifting always. Whether you are moving locally or going far away coming from the place you must go through same stress and complications. There is less tension when you are shifting locally while you will become near to your near in addition to dear ones. In case you are moving in the same radius then it is definitely a optimistic note that you can conclusion your own shifting disaster. In extra to this we will permit you know the best ways in which you can certainly enjoy your regional moving and shifting to the best of a person. 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Fri, 22 Apr 2016 18:44:10 GMT AOI http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18637 Helllo, our company using yestesh BX AOI for board inspection. It is problematic to detect component description in characters that is rotated 45 degres (SO8 and other) with marking inspection, maybe someone can help how to fix it? Characters that rotation is 90 degres detection is good. Fri, 22 Apr 2016 12:03:16 GMT Fuji Dip Fluxer http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18712 Has anyone used Fuji Dip Fluxer? How would you validate the process? Any help greatly appreciated. Thu, 21 Apr 2016 15:46:33 GMT Powering down machines vs leaving them up http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18710 With desktop/workstation computers I am of the opinion that they should be left to run 24/7 to avoid thermal cycling daily in order to prolong their life. I have dozens of computers between my home and business and I have had good success with this for a long time; computers last a long time and I rarely have a hard drive problem. My business has two older gsm1 machines that we have been getting setup and I'm unsure what the recommendation is on them. We run them about once or twice a week currently but plan to run them more as our business grows. My current strategy has been to leave the machines on once the line has been started up until the end of the week when we shut down for the weekend. We'll start the line back up again once we are ready to program or run a another product and again leave them up until the end of the week unless we are sure we are done with it until next week. What are others that are not running 24/7 doing? Thoughts? Thanks Wed, 20 Apr 2016 22:06:32 GMT GSM machine stops responding to VME during production, CLOCK01.SYS failed to install http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18709 Hi Guys, Yesterday one of our two gsm1 machines just stopped moving and let down the board mid-production. The epc computer continued to respond but no messages were displayed when palming up or down. I tried local IO and it said no IO was configured for any subsystem I was trying to access. I used the shutdown function to turn off the machine. This morning I booted up the machine and got an error message reading 'device driver CLOCK01.SYS failed to install' as shown in the image attached. I pressed the reset button on the EPC and the machine rebooted and initialized like normal. I'm wondering what might be failing on the machine so I can try and resolve the issue; any input would be appreciated. Otherwise these older machines seem to work great now that we've finally worked out most of the issues and learned how to use them. We're really hoping they can help our small manufacturing company grow. Wed, 20 Apr 2016 13:13:20 GMT Nozzle changer issues on gsm1 http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18705 Hi All, I have been running into an issue where my gsm is not leaving an empty nozzle hole in changer 1 and is leaving two open in the other changer. The machine is attempting to change one of the nozzles 5-7 and leaving one open so no vacuum builds. I've manually tested the changer with discrete io and it all works fine. I'm not sure why this is happening. The configuration always matches what is on the head and in the changers so I don't know why it would do this. Worst part is it happen mid run and gets stuck as shown in the photo. I tried manually moving the nozzles back so there is one open hole per changer and adjusting the configuration but it keeps happening. Any idea what I'm doing wrong? Wed, 20 Apr 2016 10:16:21 GMT What will be the effect of additional solder paste? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=18708 We are using Vicor SMT J-Lead VI Chip which is big component on the bottom side. The manufacturer recommends to have 6 mil stencil but the customer required 10 mil stencil. The PWB has gold contacts on both sides. We noticed some mini solder splashes or solder spot on the gold contact area on both sides of PWB randomly. Do you think it is due to the thick stencil that we using? Thank you in advance for your input. Tue, 19 Apr 2016 16:47:35 GMT