Three-Dimensional MMIC and Its Evolution to WLCSP Technology

by: Tsuneo TOKUMITSU; Sumitomo Electric Industries, Ltd.

The history of multilayered, three-dimensional monolithic microwave integrated circuit (3-D MMIC) technology is described here. Although significant researches were carried out in the second half of 1990's, still there were many twists and turns before and after the era. Since 2008, an aggressive and realistic development of 3-D MMIC Wafer Level Chip Size package (WLCSP); for extremely low cost and surface-mount compatible MMIC products, has been performed to provide a one-stop solution for radio-link equipment developers. This paper will be an example that indicates importance of continuous motivations.... read article »

Complete Closure of Late Model SMT and Test Facility Mon, January 23-24 | Online Auction auction by: X-Line Asset Management

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